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2003-08-15 Photon-probing system eyes wire bond technologies
Based on the EmiScope platform, the EmiScope-I-GP system from Optonics Inc. performs transistor-level backside analysis of advanced IC designs containing any number of metal layers
2004-09-13 Philips UARTs eye space-constrained apps
Philips expanded its family of 16C Universal Asynchronous Receiver/Transmitters with the release of four new devices in compact lead-free HVQFN packaging
2005-08-22 Philips to house its 16C quad UARTs in the HVQFN package
Royal Philips Electronics disclosed that its 4-channel advanced 16C quad UARTs will be made available in the industry's smallest packagesthe HVQFN
2006-06-27 Pericom introduces four analog switches for mobile terminals
Pericom Semiconductor introduced a new family of advanced analog switches created for mobile terminal applications which feature Chip Scale Packaging, very low On-Resistance and wide voltage ranges.
2013-07-10 Palomar set to debut latest die bonder tech at SEMICON West
Palomar Technologies will unveil the 8000i Wire Bonder and the VisionPilot technology aimed to support automated complex microelectronics packaging and production
2015-02-02 Optimising BGA signal routing in PCB designs
BGA packaging technology for embedded designs is steadily advancing, but signal escape routing is difficult. Know the strategies to ensure that a product is correct in terms of form, fit and function
2007-03-27 Optek, IRC develop LED design kit for solid-state lighting
TT electronics' Optek Technology and IRC Advanced Film Division have developed a LED design kit that combines IRC's Anotherm technology and Optek's IR and high-brightness LEDs
2006-11-22 Open-Silicon licenses MIPS' processor core for ASIC devt
MIPS Technologies Inc. announced that Open-Silicon Inc. has selected the MIPS32 24KEc Pro processor core to power advanced custom ASIC solutions for complex SoCs
2005-09-29 National Semi boosts op amp design process
As the consumer market continues to drive advanced features into smaller form factors that require high-performance amplifiers with lower power and smaller footprints, National Semiconductor caters to such demands with the release of its new process technology for operational amplifiers
2011-01-26 Nanotape may soon replace solder pads
The new nanotape could replace solder pads with a thin lightweight material that improves thermal energy management. Its foam-like flexible compliance could form the basis for new IC packaging techniques
2007-04-11 MOSFET chipset targets high-current DC/DCs
International Rectifier has introduced a new DirectFET MOSFET chipset for high-current DC/DC converters used in notebook, high-end desktops and servers, and advanced telecom and datacom systems
2010-03-18 Mentor, ST co-develop 32/20nm design solutions
Mentor Graphics Corp. and STMicroelectronics have entered a broad-scoped collaboration to develop advanced design solutions at the 32nm technology node and down to 20nm node
2014-02-28 MCU scaled down to the size of a golf ball dimple
The Kinetis KL03 from Freescale leverages advanced wafer-level chip scale packaging for integration into space-constrained designs.
2006-02-22 Magnetic device features dual-coil config for design flexibility
Datatronics introduced an advanced DR359 series of surface-mount inductor/transformer that combines a unique dual-coil design with a low-profile package
2005-05-11 IR MOSFET chipsets tweak dc-dc for Intel, AMD portables
IR has two new 30V DirectFET MOSFET synchronous buck converter chipsets for advanced notebook computer designs using the latest Intel and AMD processors where small size, high efficiency and improved thermal conduction are required
2015-09-14 Intersil drives power MOSFET tech with Great Wall buyout
Intersil said that Great Wall's design team brings valuable experience in advanced design and process technology to enable power efficiency gains and footprint reduction in complex power systems
2007-08-16 Intel pulls ahead in processor capex race
Advanced Micro Devices Inc. and Intel Corp. are taking different paths in IC manufacturing, but the traditional capital-spending race appears to be over in the x86-based processor arena
2009-05-26 HS-CAN transceivers handle 1Mbit/s apps
NXP Semiconductors has released the TJA1042 and TJA1051 high-speed (HS)-CAN transceivers that offer enhanced CAN functionality, improved performance, greater reliability, environmentally friendly packaging and reduced system costs
2008-05-23 High-power density promise from bus converter
Vicor's brick business unit has added the VI BRICK BCM bus converter to its new VI BRICK family that provides an advanced modular power platform for power solutions
2003-11-12 Hi-Sincerity FETs provide improved voltage-blocking
Hi-Sincerity Microelectronics Corp. has released its H07N60AF series of n-channel power field effect transistors (FETs) in TO-220FP packaging
2010-10-07 GigaMOS TrenchT2 MOSFETs come in low-profile DE-series packages
IXYS introduced the new additions to its GigaMOS TrenchT2 Power MOSFET portfolio, the IXTZ550N055T2 and the IXFZ520N075T2. These devices combine the high-current ratings of IXYS' GigaMOS TrenchT2 product line with the advanced electrical, thermal and mechanical properties of IXYS' ultra-low profile DE-Series package technology
2005-09-23 Fujitsu rolls 65nm ASIC, SoC process
Enabling the next wave of semiconductors, Fujitsu Ltd has rolled out its 65nm process technology for advanced ASIC and system-on-a-chip (SoC) designs
2006-09-18 Freescale develops wireless push
Freescale Semiconductor is stepping up its wireless push, armed with innovations in magnetoresistive memory and packaging, and guided by a new general manager, Sandeep Chennakeshu, recruited from Ericsson's handset group
2012-10-17 FOD8316 optocoupler features isolated gate driving
The device is an advanced 2.5A output current IGBT drive optocoupler which aims to cater to the high-power industrial applications demand for a gate driver with high performance and critical protection features
2005-06-29 Enhance your phones' performance
Royal Philips Electronics announced a family of advanced, bulk acoustic wave (BAW) filters and duplexers that promises to significantly enhance the performance of multimedia mobile phones
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm
2006-07-27 DC/DC buck converter improves efficiency, thermal performance
IR said its new synchronous buck converter chipset features packaging with double-sided cooling and the latest HEXFET MOSFET technology to reach higher levels of efficiency and thermal performance at the intermediate current levels
2005-05-03 Chongqing emerging as the largest IC hub in mainland China
The enlistment of two Taiwan-based, large-scale chipmakers -- Advanced Semiconductor Eng Inc. (ASE) and ProMOS Technologies Inc. -- is projected to make Chongqing Electronics Town the biggest semiconductor production base in mainland China, according to Xinhua Electronic News
2005-04-28 Chipsets offer higher power density
International Rectifier introduced two new 30V DirectFET MOSFET synchronous buck converter chipsets for advanced notebook computer designs using the latest Intel and AMD processors
2009-07-06 Chip ban ripple effect hits OEMs
Systems makers may be beginning to feel the bite of a limited exclusion order banning the import of chips from six companies found to infringe two packaging patents of Tessera Technologies Inc
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