Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > agreement

agreement Search results

?
?
total search4575 articles
2004-03-09 Zytronic strengthens growth in Asia with PCT agreement
In a bid to strengthen its growth in Asia, Zytronic has signed an agreement with Professional Computer Technology (PCT) Ltd.
2007-05-09 Zoran-HP agreement extends technology use
Zoran Corp. has signed a licensing agreement with Hewlett-Packard (HP) to extend the use of Zoran technology with certain HP LaserJet and HP Officejet printing devices.
2003-05-07 Zoran, Oak Technology ink merger agreement
Zoran Corp. and Oak Technology Inc. have entered a definitive merger agreement.
2003-03-24 Zia inks manufacturing agreement with Emcore
Zia Laser Inc., and Emcore Corp. have agreed upon a sublease and contract manufacturing arrangement for high volume epitaxial growth and laser diode processing.
2006-01-27 Xilinx inks distribution agreement with PALTEK
Xilinx announced that it has formally concluded a distribution agreement with Japan-based PALTEK Corp. Starting Feb. 1, 2006, PALTEK will commence marketing Xilinx products, with shipments beginning April 1, 2006.
2005-10-21 Xilinx and Nu Horizons expand distribution agreement to Asia
linx Inc. and Nu Horizons Electronics Corp. have expanded their North American distribution agreement to cover select countries in the Asia-Pacific. The expanded partnership provides Nu Horizon distribution rights for Xilinx's FPGAs, CPLDs, development software and intellectual property, and covers China, Taiwan, Southeast Asia and India.
2005-03-21 Wipro, Cadence renew EDA agreement
Tapping into a growing Indian IC design market, Cadence Design Systems Inc. has renewed an agreement giving India-based Wipro Technologies access to its EDA software.
2002-11-15 Vitesse, Titan enter logistics agreement
Vitesse Semiconductor Corp., through an agreement with Titan Logistics Corp., will provide its EMS (electronic manufacturing services) and CM (contract manufacturer) customers with a source to meet their needs.
2003-02-11 Virtio, Toyo enter license, distribution agreement
Virtio Corp. has signed a technology license and distribution agreement with Toyo Corp.
2014-03-18 Vietnam, Microsoft ink agreement for tighter IT security
Microsoft has signed a cooperative deal with Vietnam to take advantage of the latest IT solutions in enhancing the country's IT capacity.
2006-06-09 VIA extends licensing agreement with ARM
VIA has extended its agreement with ARM by licensing the ARM926EJ-S and ARM968E-S processors.
2003-01-15 Veeco, FEI terminate merger agreement
Veeco Instruments Inc. and FEI Co. have mutually decided not to pursue the merger agreement both companies entered in July 2002.
2002-02-21 UMC, Hitachi halt Trecenti joint venture agreement
United Microelectronics Corp. and Hitachi Ltd have agreed to discontinue the joint management of Trecenti Technologies Inc. located in Ibaraki, Japan.
2006-02-06 U.S. seeks free trade agreement with South Korea
U.S. Trade Representative Rob Portman announced the initiation of negotiations with South Korea on a free trade agreement that would remove tariffs and other trade barriers between the two countries.
2003-08-27 Tyco, Samtec ink source supplier agreement
Tyco Electronics and Samtec Inc., a manufacturer of PCB level interconnects and flex circuitry, have entered into a licensing agreement.
2002-07-16 TwinMOS, ACE forge alliance agreement
Taiwan memory module company TwinMOS Technologies Inc. has signed a production agreement with Advanced Chip Engineering Technology Inc.
2003-01-21 Tundra, Future Electronics enter distribution agreement
Tundra Semiconductor Corp. has signed Future Electronics to sell Tundra system interconnect chips as part of a whole product solution across Europe, with the exception of Germany, the Benelux region, and Israel.
2011-01-13 TSMC, Centrosolar ink solar module agreement
TSMC has firmed up plans to venture into solar and LED manufacturing by signing a contract with Centrosolar that makes the German company its exclusive European manufacturer of crystalline solar products.
2013-06-26 TSMC, Apple lock three year FinFET agreement
According to a report from Digitmes, TSMC is expected to begin supplying Apple with a processor called A8 in July 2013 made on 20nm CMOS.
2008-04-29 Trina Solar inks supply agreement with Silfab
Trina Solar, a China-based maker of solar photovoltaic products, has signed a long-term polysilicon supply agreement with Silfab.
2005-12-20 TranSwitch, Eastele ink franchise agreement
TranSwitch announced that Eastele Technology has signed a franchise agreement to be a TranSwitch distributor, providing full coverage for the company's devices throughout China.
2004-08-18 TransAKT, Global Telecom ink distribution agreement
TransAKT Corp. has entered into a distribution agreement with Global Telecom Unlimited Inc. (GTC).
2006-02-14 TPV, BOE announce TFT LCD screen purchase agreement
TPV Technology announced recently that it will be acquiring TFT LCD screens from mainland China-based BOE Technology Group Co. Ltd.
2002-01-11 Tower signs technology transfer, licensing agreement with IMEC
Tower Semiconductor Ltd has signed an agreement with IMEC for the technology transfer and licensing of analog modules and applicable technologies for Tower's Fab 2.
2002-05-31 Toshiba, Tessera sign expanded agreement for CSP
Tessera Technologies Inc. has signed an expanded technology licensing agreement with Toshiba Corp. that enables Tessera to act as a licensor of Toshiba's FBGA assembly process for "face-up" CSP.
2006-10-13 Toshiba, Rambus expand memory interface agreement
Toshiba Corp. and Rambus Inc. have expanded their memory-interface licensing agreement.
2004-04-01 Toshiba unveils serial link cell agreement with Rambus
Toshiba Corp. has signed an agreement with Rambus Inc. to incorporate the RaSer serial link cell technology from Rambus into the Toshiba 90nm process technology library.
2011-01-20 Toppan-IBM photomask agreement to cover 193nm immersion lithography
Toppan Printing Co. Ltd and IBM have agreed to extend their joint photomask process development efforts involving the 14nm technology node for logic devices. The companies will now collaborate on ArF immersion lithography for the 14nm node.
2007-03-07 Tokyo Electron, Nu Horizons ink distribution agreement
Tokyo Electron Device Ltd announced a global partnership agreement with Nu Horizons Electronics Corp. to distribute TED's inrevium brand line of Xilinx development boards and IP products.
2002-02-01 Three-Five, China Display sign microdisplay agreement
Three-Five Systems Inc. has signed an agreement with China Display Digital Image Technology (Shanghai) Co. Ltd to develop high-performance light engines using Three-Five's Brillian microdisplays.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top