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2009-07-16 Novellus, Albany NanoTech team on sub-22nm R&D
The College of Nanoscale Science and Engineering at the University at Albany and Novellus Systems Inc. have formed a $20 million partnership to conduct next-generation R&D sub-22nm semiconductor manufacturing technology
2004-02-10 Keithley, Albany NanoTech partner in optoelectronics
Keithley Instruments has collaborated with the Albany NanoTech to further their understanding of nanotechnology and optoelectronics technologies.
2004-12-07 IBM used Albany immersion tool to make power processor
IBM Corp. used a Twinscan AT:1150i lithography machine from ASML Holdings NV installed at the Albany Nanotech campus in New York state to make examples of a 64bit power processor,
2005-07-13 Honeywell invests in Albany Nanotech
Honeywell Electronic Materials will invest at least $5 million during the next five years into laboratory equipment and research activities at Albany NanoTech, as well as locate laboratories and researchers at the center to work on next-generation materials for the semiconductor industry.
2005-09-28 Albany NanoTech, IBM, Applied in $300 million chip research pact
Albany NanoTech, IBM, and Applied Materials have teamed on a partnership that will make more than $300 million available for research, development and economic outreach at the State University of New York's Albany NanoTech site and add over 80 research jobs.
2008-09-23 Albany NanoTech to open 22nm R&D fab
Albany NanoTech is set to open a new facility that will focus on 22nm R&D technology, post-CMOS processes and clean technology.
2008-09-24 Albany NanoTech beefs up cleantech efforts
Eyeing to achieve its success in semiconductors, Albany NanoTech, together with its parent organization, is bringing its collaboration model over to clean technology.
2008-07-29 Nanotech research encourages Russia-U.S. partnership
Executives from Rusnanotech have concluded their first visit to four U.S. nanotech centers, with an objective of promoting collaborative research
2004-02-03 Three firms partner for memory chip development
Infineon Technologies North America, Genus Inc. and Albany Nano-Tech (ANT) have signed a three-year partnership program worth $12M to develop next-gen chip memory devices
2003-02-19 EUV activity shifts to Sematech North
Developers of EUV lithography are looking north, specifically to the University at Albany, State University of New York, for their future
2010-06-08 Sematech, AZ work on EUV resist issues
AZ Electronic Materials has joined Sematech's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany
2010-02-17 Novellus, IBM, CNSE join forces on 22nm process
Novellus, IBM and CNSE have established a strategic partnership at CNSE's Albany NanoTech Complex targeting the development of semiconductor process solutions for 22nm and beyond.
2008-01-23 IMEC, U.S. university partner on EUV litho research
EUV litho experiments will be carried out in collaboration by IMEC and the College of Nanoscale Science and Engineering of the University at Albany as a means to accelerate the introduction of the process in manufacturing
2009-03-03 22nm chips to be developed by trio
IBM Corp., Applied Materials Inc. and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany have agreed to jointly develop process modeling technology for manufacturing 22nm logic and memory chips
2007-12-20 Toshiba, IBM extend R&D partnership to 32nm
IBM and Toshiba Corp. have extended their collaboration by entering into a joint development agreement on 32nm CMOS process technology.
2006-07-17 They're not the Valleyand that's the point
Silicon Valley is no longer the end of the rainbow for companies in search of R&D talent, advanced research opportunities, submicron-process expertise or applications development prowess.
2007-07-19 Startup brews 'perfect storm' for R&D
Intermolecular has unveiled a new platform of "fab in a lab" technologies, which it claims will facilitate R&D of IC materials, processes and device structures.
2009-07-22 ST, CEA-LETI launch Nano2012 program
STMicroelectronics and CEA-LETI, the French Laboratory for Electronics & Information Technology have announced the formal launch of the Nano2012 Research and Development program at ST's site at Crolles.
2013-05-10 Silver lining for Japanese fabs
The latest chatter on the streets of Tokyo is that at least one foreign company is bidding for a fab that a Japanese chip company is trying to dump.
2009-03-03 Sematech, Asahi Glass to improve EUV mask blank yield
Sematech and Asahi Glass Co. (AGC) have entered into a joint development partnership to accelerate mask blank commercialization.
2010-06-21 Sematech welcomes Qualcomm as first fabless member
Qualcomm Inc. has joined chip-making consortium Sematech to gain an edge in next-generation technology, reportedly including 3D chips.
2015-04-20 Samsung details 14nm FinFET strategy
The Korean company made significant headway when it shipped its first 14nm FinFET chip, beating TSMC to become the second chipmaker after Intel to pave the road for 14nm technology.
2012-11-26 Report: TSMC heading to New York
Rumour has it that TSMC may be opening its first commercial-scale wafer fab in New York soon. Reports have surfaced that a consulting firm has been enlisted to scout for a future location for a major production facility in the state and all arrows are pointing to TSMC as the searcher.
2009-09-10 R&D consortia help drive IC equipment growth
Semiconductor equipment R&D spending is set to be slashed, with an $8 billion decline seen over the next five years, according to market tracker Gartner.
2007-05-07 New IBM tech enables faster ICs
IBM scientists announced that they have devised a way to create vacuum spaces between copper wires in semiconductors, which will reportedly lead to chips that consume less power and run faster.
2004-04-12 Legislators seek DoD funds for Sematech
A trio of Texas congressmen is asking the Department of Defense (DoD) for $50 million in funding for International Sematech that could advance the chipmaking capability of the U.S. defense industry.
2008-07-17 Is chip R&D facing a dead end?
The IC industry still pours billions of dollars annually into R&D. But in recent years, as costs have skyrocketed, chipmakers have been outsourcing more of their R&D requirements to consortia, silicon foundries and third-party vendors.
2011-09-30 Intel, IBM invest $4.4B in R&D facility
Intel and IBM are leading the development of a chip R&D center in New York that focuses on next-generation ICs and process technologies.
2007-07-20 Intel, AMD pitch divergent formulas for industry progress
In their keynotes at Semicon West, executives from rivals Intel and AMD explored differing recipes for the survival of the semiconductor industry.
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs.
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