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2006-03-16 Comms recorder-interface handles optical, electrical signals
Priced at less than $5,000, Technisys' DRI de-serializes high-speed data streams for parallel interfacing to recorders.
2007-10-17 Codec touts power management, 'no compromise' audio
Wolfson Microelectronics has started sampling the first device in a planned family of power management products that are part of the Edinburgh, Scotland-based company's AudioPlus strategy.
2006-10-06 Coalition seeks to unify IC power standards efforts
The Silicon Integration Initiative launched the Low Power Coalition which may help unite two disparate efforts for standardizing a power specification format.
2006-06-08 CMOS process tech features high-density EEPROM
Atmel announced the AT35700 high-voltage process technology with double-poly, high-density EEPROM for IC foundry customers.
2006-02-13 Clockless processor targets real-time chip designs
ARM and Handshake Solutions, a business unit of Royal Philips Electronics, have jointly launched the ARM996HS processor using Handshake Solutions' clockless IC design technology.
2009-01-06 Clock multiplier IC supports 10G line encoding rates
Silicon Laboratories Inc. has introduced an expansion of its Any-Rate Precision Clock family with the Si5315, a jitter-attenuating clock multiplier IC that meets or exceeds the performance, integration, frequency and jitter requirements for the 1G and 10G Synchronous Ethernet (SyncE) market.
2006-11-28 Clear Shape solution promises fast DFM hotspot detection
Clear Shape Technologies has announced InShape, said to be the first model-based full-chip Design Manufacturability Checker that predicts accurate silicon shapes, providing designers the ability to do fast, accurate DFM hotspot detection of catastrophic failures.
2006-12-04 Clear Shape offers electrical DFM analysis solution
Clear Shape Technologies has announced OutPerform, said to be the first complete and silicon-correlated electrical DFM analysis and optimization product to enable designers using sub-90nm processes to control the impact of lithography, mask, etch, RET, OPC and CMP effects on their chip parameters.
2009-07-23 Cisco, Intel help boost smart grids
A broad group of companies including giants Cisco Systems and Intel Corp. are working with utilities to draft proposals for smart grid, competing for $3.9 billion in grants recently announced by the Department of Energy.
2004-01-30 Cisco pushes transport platform into cable
Cisco Systems is using the Multi-Service Transport Platform in a bid to move beyond the cable TV headend.
2002-03-20 Cirrus' digital entertainment bet may pay off
It may be too soon to tell whether venerable Cirrus Logic Inc. can ride the digital consumer wave to another crest of prosperity. But early reviews of CEO David French's bold move appear for the most part to favor Cirrus' chances.
2007-01-15 Choose the right OS for your consumer devices
The explosive growth of the CE market has led to a proliferation of hardware platforms, operating systems and development tools. In response, the consumer products industry is embracing the concept of DSO which involves optimization of technologies and processes on an enterprise basis rather than project by project.
2009-07-23 Chips save 50% power in optical transport nets
PMC-Sierra Inc. launched the PM5420 HyPHY 20G and PM5426 HyPHY 10G devices that enable convergence of high-bandwidth data, video and voice services over Optical Transport Network-based (OTN) Metro infrastructures.
2008-11-03 Chips reembrace multicore architecture
DSPs are now beginning to reembrace multicore architectures, but mainly for specific applications possessing well-partitioned processing tasks.
2008-11-26 Chips aim to resolve H.264/AVC issues
From digital TVs to portable electronics, the H.264/AVC next-generation video compression standard is becoming mainstream.
2007-05-16 Chipmakers urge lower ESD target levels
The Industry Council on ESD Target Levelscomposed of 16 major chipmakersis pushing to cut down on-chip ESD stress target levels by more than half.
2003-09-17 Chipmakers look for new ways to take PC's temperature
As processors get hotter and the desktop systems they go into get smaller and more complex, some engineers believe it's time for a new way to track the PC's internals.
2002-11-05 Chipmakers differ on migration to TD-SCDMA
Chipmakers took different views on how much their development work will be affected by China's drive to use TD-SCDMA technology in a regional 3G mobile network, with assessments of the impact ranging from slim to severe.
2007-10-01 Chipmakers are eyeing 700MHz prize
Chip designers for cellular and WiMAX networks are sharpening their pencils on plans for 700MHz support in the wake of new guidance from the U.S. Federal Communications Commission on the spectrum.
2008-07-21 Chip industry preps for 'More than Moore' era
Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore."
2010-11-15 Chip industry faces turning point
Emerging trends could transform the semiconductor sector from a vibrant, innovative engine of the technology economy to a slow-moving purveyor of “me too? products.
2005-07-19 China will demand automotive electronics technology
Around the world, technology is becoming more pervasive in people's everyday lives.
2006-05-16 China IC design industry reaches stability
After several years of rapid development, China's IC design industry has reached a period of stability, according to the China IC Design House Survey by EE Times-China.
2009-07-14 Chartered expands 65nm foundry portfolio
Expanding its foundry portfolio, Sinsgapore's Chartered Semiconductor Manufacturing Pte. Ltd has rolled out separate low-power and RF processes, based on its 65nm technology.
2007-08-16 Car systems call for secure memory
Today's cars comprise several dozen processors, a wide range of sensors, and various types of control, safety, comfort and communications systems. All these systems have one thing in commonthe need for non-volatile storage.
2013-12-13 Cadence: Europe to abandon digital for mixed-signal chips
An executive from Cadence said that Europe will concentrate its efforts toward biomedical, automotive and mixed signal chip design, and will give up on leading edge digital chip design.
2005-10-10 Cadence, UMC develop reference design for wireless
EDA supplier Cadence Design Systems Inc. and Taiwan-based semiconductor foundry UMC have announced a collaborative agreement to develop a comprehensive reference solution for complex wireless designs.
2006-09-01 Cadence, Mentor spar in high-speed realm
The EDA rivals find themselves at odds as the quest for a single simulation approach suitable for high-speed designs continues.
2010-05-17 Cadence, Denali ink merger deal
Cadence Design Systems Inc. and Denali Software Inc. have entered into a definitive merger agreement, under which Cadence will acquire Denali for $315 million in cash.
2005-02-01 Cadence tool aims to tackle parasitics in RF design flow
The new release from Cadence Design Systems Inc. addresses the leading cause of wireless design failures.
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