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2010-11-09 TI, Maxim push 300mm analog
Texas Instruments and Maxim Integrated Products have made recent advances in manufacturing 300mm analog devices, prompting analysts to ask how much impact the move will have on the segment
2010-04-29 TI to double 300mm analog fab capacity
Texas Instruments Inc. plans to double the manufacturing capacity in its 300mm analog fab in Richardson, bringing its revenue capability to about $2 billion.
2012-01-25 TI plans fab closure, ends 2011 in the black
The company disclosed vibrant sales for 4Q11 and plans to close two older chip fabs in the next 18 months.
2009-10-02 TI opens 300mm analog fab in Texas
The Richardson manufacturing facility will use 300mm silicon wafers to manufacture analog chips
2011-03-30 TI dominates 2010 analog IC market
Because of its 42 percent sales increase, TI has remained on top of the analog IC market
2007-05-22 TI bares details of new 'hybrid' fab strategy
Moving to remain competitive in what has become a brave new world of IC manufacturing, TI had disclosed details of its revised 'hybrid' fab strategy
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2009-10-06 Analysis: TI fab deal is good for IC tool vendors
Equipment executives and analysts say that the TI fab deal isn't a blow to the equipment industry. Some suggested that it might even be a positive for gear suppliers
2010-05-05 Analog vendors face shortages, extended lead times
Analog chipmakers continue to wrestle with part shortages and extended lead times, and in some cases, vendors must turn away business because they cannot meet strong customer demand
2002-04-02 Zarlink to sell wafer fab to X-FAB Semiconductor
Zarlink Semiconductor has disclosed plans to sell its wafer fabrication facility in Plymouth, U.K., as well as IP and related foundry businesses to companies controlled by X-FAB Semiconductor Foundries AG for about $30 million
2008-01-18 X-FAB turns Malaysia facility to analog/mixed-signal fab
X-FAB Silicon Foundries is transforming its Sarawak, Malaysia facility into an analog/mixed-signal foundry operation.
2006-09-08 X-Fab Semi, 1st Silicon complete merger
X-FAB Silicon Foundries announced completion of the merger of X-FAB Semiconductor Foundries AG with 1st Silicon Sdn. Bhd. effective on Sept. 1, 2006
2008-09-05 X-Fab Sarawak all set to start 0.35?m process tech
X-Fab Silicon Foundries' Malaysian facility in Kuching, Sarawak, with its 200mm production line, now is fully qualified for volume production and second sourcing of the company's 0.35?m high-voltage process technology called XH035
2010-01-19 X-FAB puts $1.5M into Semprius
Semprius' technology for "point-of-use electronics" enables a faster and less expensive manufacturing process.
2011-02-07 X-Fab buys stake in MEMS Foundry Itzehoe
X-Fab and MFI will combine their foundry activities in the MEMS market
2004-03-05 Virtuoso unifies mixed-signal, analog flows
Cadence Design Systems' Virtuoso Custom Design Platform is now able to handle analog and digital blocks in the same design flow
2007-05-10 UMC scores Sparc deal in new TI fab scheme
In TI's new fab scheme, UMC appears to have scored a major victory, as that company will make Sparc processors on a foundry basis at the 45nm node for Sun Microsystems Inc
2002-06-14 Tower Semi adopts Celestry analog device models
Tower Semiconductor Ltd has selected Celestry Design Technologies Inc.'s device-model parameter extraction products and characterization services for its 0.185m process and Fab-2 technologies
2007-03-21 TI to shake up 'corporate culture' and revamp fab strategies
Amid stinging losses of its baseband chip monopolies at Docomo, Ericsson and Nokia, Texas Instruments is moving with a new sense of urgency to shake up its corporate culture and revamp its fab and product strategies
2010-07-19 TI buys Japan wafer fabs to grow analog biz
Texas Instruments Inc. is purchasing two Japan wafer fabs and other manufacturing equipment as a cost-effective way to increase capacity.
2011-05-05 Telefunken buys Renesas Electronics's U.S. fab
Telefunken has bought the semiconductor wafer fab of Renesas Electronics America in Roseville, California and is planning to use the facility to further improve their production
2010-06-18 ST muses 300mm wafer for analog
STMicroelectronics is considering making analog ICs on 300mm wafers at its Crolles-2 wafer fab near Grenoble, France, according to CEO Carlo Bozotti.
2011-09-26 Specialized foundry processing yields high-performance analog IC
Learn about the impact of foundry process on achievable specifications.
2010-03-09 Signs point to NXP going fab-lite on mixed-signals
With NXP closing down wafer fabs ICH in Germany and ICN5 in the Netherlands, and announcing plans to close ICN6 by early-to-mid 2011, the fab-lite movement is gathering pace at the chip company
2007-10-25 Signs point to fab-lite route for Renesas
Renesas Technology is quietly altering its fab and foundry strategies, seeking to make up ground at the 65nm node and beyond
2007-04-12 Service kicks off at Fujitsu's new 300mm fab
Fujitsu Ltd. has begun operating its second 300mm wafer fab for 65nm chip fabrication. Volume shipments will begin in July
2009-12-23 RoodMicrotec, X-FAB collaborate online
Rood Testhouse International NV (RoodMicrotec) has signed a collaboration agreement with foundry company X-FAB
2007-07-17 Rise of mixed-signal SoCs hints at changing analog market
Despite such well-reasoned doubts, market statistics show an analog IP market on the rise. The analog and mixed-signal IP market grew 34 percent in 2006, accounting for 16 percent of the overall design IP market, says Gartner
2008-06-23 Reports point to bleak IC, fab-tool markets
The mid-year data from market research firms indicate gloomy IC and fab-tool industries for 2008
2004-09-06 Renesas, Mitsumi agree on transfer of 200mm wafer fab
Mitsumi Electric Co. Ltd will acquire a 200mm wafer fab from Renesas Northern Japan Semiconductor Inc., a wholly-owned affiliated company of Renesas Technology Corp
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