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2013-08-29 BCDMOS evolves to handle broad range of UHV apps
Learn how LDMOS and JFET transistors do the heavy lifting when it comes to handling high voltages.
2014-09-03 Automotive-grade audio amp aimed at eCall, telematics apps
By using the TAS5421-Q1, TI said designers can remove multiple discrete components, shorten automotive-grade diagnostic design and extend battery back-up power.
2013-10-17 Ams reveals method for Li cell monitoring, balancing
The architecture has been implemented in the AS8506 to perform distributed cell monitoring and balancing operations for stacked cell modules, including SOA check and passive or active cell balancing.
2013-08-01 Amkor buys Toshiba Electronics Malaysia
Amkor announced it has completed its purchase of Toshiba's Malaysian semiconductor packaging and test operations.
2015-09-14 Addressing PCB size limits in wearables
Wireless wearable applications call for a degree of IC, package, and board size reductions that only wafer-level chip-scale integration can solve.
2013-04-01 Add multi-cell battery system to single-cell designs
Front-end power management units will unite multi-cell battery stack designs of future systems and single-cell-based designs of past systems.
2013-02-08 Accelerate tester-based silicon debug (Part 1)
Learn about the silicon test and debug phases an SoC must undergo, as well as the techniques and tools available to the test engineer.
2013-07-12 8-channel LED backlight driver enables better TV screen
The iW7019 from iWatt intends to deliver better screen performance and lower cost in next-generation 2D and 3D LCD TVs to render a more lifelike viewer experience.
2015-03-25 3mm tuners from Silicon Labs target digital televisions
The 3mm Si2144/24 digital tuners from Silicon Labs offer loop-through as well as support for international cable and terrestrial STB standards including ATSC/QAM, DVB-T2/C2/T/C, ISDB-T/C and DTMB.
2014-10-15 200mm fab lives on, end nowhere in sight
Despite the upgrade to larger wafer sizeswith fabs that transitioned to 300mm over a decade agothere is still plenty of life remaining in 200mm fabs, and the introduction of MEMS-based accelerometers for motion tracking has been a boon to eight-inch wafers.
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