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2008-04-30 Singapore inventor gets patent for flip-chip IC assembly tech
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device
2005-01-04 Hitachi Chemical obtains patent for IC mount assembly tape
Hitachi Chemical Co. Ltd has acquired a basic patent for assembly tape used for its quad flat non-leaded package (QFN) method, a type of IC packaging mount.
2009-03-23 Nanorods simplify 3D chip stacking
Interconnecting bare die to form 3D chip stacks is best done through low-temperature wafer bonding before dicing, according to Rensselaer Polytechnic Institute researchers, who described how to perform the process with nanoscale copper rods.
2014-02-18 The lowdown on batteries: Alkaline batteries
In this instalment, we will delve on the rechargeable types of alkaline batteries.
2008-04-04 Source-level Codelink supports multicore debug
An integrated, source-level debug environment targeting processor driven tests has been launched by Mentor Graphics Corp. as an expansion of its Questa Functional Verification Platform.
2002-02-19 Researchers close to delivering molecular circuits
Although it's a little like watching a chess match in slow motion, molecular electronics researchers are converging on viable circuit-fabrication methods.
2014-07-01 MEMS startup focuses on Chinese ODMs for growth
Ben Lee, CEO of mCube, said it secured $37 million of Series C venture capital to enter phase three of its progress, and will target Chinese ODMs, not a design win from either Apple or Samsung.
2012-10-22 Embedded software devt: The disciplined way (Part 2)
Only one tool is needed to make huge improvements in both the quality and delivery time of your next embedded project.
2002-01-15 ACE Technology to open wafer plant
Advanced Chip Engineering Technology Inc. (ACE Technology)'s newly established 28,000-square-meter plant is scheduled to begin mass production this week.
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