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2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products
2008-05-29 OmniVision tips backside illumination for CMOS imager
OmniVision touts it has found the answer to shrinking pixel size in CMOS image sensors without degrading performance and image quality through adopting backside illumination (BSI) technology
2012-06-07 A*STAR, UMC team up on TSV tech
The resulting technology will substantially enhance performance, lower costs and shrink the size of multimegapixel image sensors found in mobile applications, the companies said.
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