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2010-02-04 TowerJazz, Soitec join hands on backside illumination
TowerJazz and Soitec Group will develop turn-key solution for high-end backside-illuminated CMOS image sensors for industrial, medical and automotive applications
2008-05-29 OmniVision tips backside illumination for CMOS imager
OmniVision touts it has found the answer to shrinking pixel size in CMOS image sensors without degrading performance and image quality through adopting backside illumination (BSI) technology.
2014-12-03 3D QVGA ToF image sensor offers backside illumination
The EPC660 from Espros Photonics has a 320 x 240 CCD pixel field and control logic that allows the device to deliver about 66 full frame ToF images that can be increased to more than 1,000.
2014-11-06 Backside-illuminated CMOS image sensor optimised for UV light
Imec developed an innovative anti-reflective coating (ARC) for BSI CMOS image sensors to target new markets such as life sciences and industrial inspection.
2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products.
2011-10-13 Sony, Ziptronix team up on image sensors
Sony has been licensed to use Ziptronix's oxide bonding technology for backside illumination imaging sensors.
2010-05-20 Mobile image sensors support parallel, MIPI interfaces
Aptina Inc. has launched a line of CMOS image sensors, based on a 1.4? pixel scheme and its third-generation frontside illumination (FSI) technology
2012-02-15 CMOS sensors expand lead against CCDs
Shipments of CMOS sensors last year accounted for 92 percent of all area image sensors, reaching 2.1 billion units, up 31 percent from 1.6 billion in 2010.
2010-08-18 VGA camera is 1.95mm for ultra-thin portables
OmniVision's 1.95mm VGA sensor is built with the company's backside illumination technology for integration into sub-2mm LCDs for next generation notebooks, netbooks and tablet computers.
2013-01-02 Toshiba introduces 20MP BSI CMOS sensor
Toshiba's TCM5115CL claims to offer the industry's highest resolution in the 1/2.3in optical format, using backside illumination technology to improve sensitivity and imaging performance.
2010-02-18 5MP image sensor delivers 720p HD video at 60fps
OmniVision Technologies Inc. has launched the OV5647 1/4-inch, 5Mpixel RAW CMOS image sensor based on its 1.4?m OmniBSI backside illumination (BSI) technology.
2015-03-12 Toshiba unveils smallest CMOS image sensor
Toshiba introduces the world's smallest CMOS image sensor with 13Mpx and HD video support. The device integrates the Bright Mode technology, which boosts image brightness four-fold.
2012-11-14 Teardown: The 4th-Gen iPad unraveled
UBM TechInsights takes a peak into what makes Apple's 4th generation iPad tick.
2012-10-16 Tablets, cars to drive CMOS market growth
CMOS image sensor market is expected to grow at an 11 per cent CAGR in revenue from 2012-2017, growing from $6.6 billion this year to $11 billion in 2017.
2015-01-22 Report: CMOSIS mulls IPO
CMOSIS is a fabless CMOS image sensor vendor and has developed IP related to high-end CMOS image sensors such as global shutter pixels, fast and low-noise ADCs, BSI and increased dynamic range.
2013-02-08 Peering under the BlackBerry Z10 hood
UBM TechInsights' Allan Yogasingam goes inside Blackberry's last, best hope for relevance in the smartphone market C the Z10.
2008-10-01 OmniVision claims first 1/3-inch 8Mpixel CMOS sensor
OmniVision touts the world's first 1/3-inch, 8Mpixel CMOS image sensor.
2010-06-28 iPhone 4 teardown reveals design reuse
The new Apple iPhone 4 could very well be called an iPad since it uses at least seven chips from the popular Apple tablet, according to analysts from UBM TechInsights.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2012-06-25 Image gallery: Tearing down Samsung Galaxy S3
In this teardown, UBM TechInsights probed the inner workings of the European version of Samsung Galaxy S3 smartphone.
2014-04-01 CEO of China's SMIC talks about global expansion
EE Times correspondent Junko Yoshida sat down with SMIC CEO Tzu-Yin Chiu in a one-on-one interview that revealed the company's interest to expand globally.
2009-03-02 Camera platform features enhanced processing
OmniVision Technologies Inc. has introduced its latest 8Mpixel solution based on its OmniBSI architecture, which features 1.4?pixel with superior low-light performance, enhanced processing and distortion compensation.
2012-06-07 A*STAR, UMC team up on TSV tech
The resulting technology will substantially enhance performance, lower costs and shrink the size of multimegapixel image sensors found in mobile applications, the companies said.
2010-06-09 5Mpixel sensor brings 1080p HD video to handsets
From OmniVision Technologies Inc. comes a complete 5Mpixel SoC camera solution aimed at penetrating the high-volume autofocus camera phone market.
2011-05-23 5MP image sensor enables slimmer mobile devices
OmniVision Technologies launched the OV5690, the first 5-megapixel image sensor built on the OmniBSI-2 pixel architecture, designed for slimmer mobile phones, smartphones and tablet computers.
2010-01-11 14.6Mpixel image sensors enable HD video at 60fps
OmniVision Technologies Inc. launches two 14.6Mpixel image sensors capable of delivering high-resolution still photography and full 1,080p HD video at 60fps.
2010-05-24 1080p sensor delivers HD recording in small form
OmniVision has unveiled the OV2720 1/6-inch, native 1080p/30 high-definition CMOS image sensor designed for notebook, netbook, webcam and video conferencing applications.
2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface.
2002-06-26 Nanometrics rolls out 300mm wafer inspection technology
Nanometrics Inc. has launched the NanoUDI technology for 300mm wafer processing, which meets requirements for yield management.
2015-04-28 Exploring the failure analysis process
Determining the root cause of electronic system failures requires a disciplined and systematic analytical process, along with sophisticated tools for testing and visualizing the behaviours of sample devices.
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