Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > back-end

back-end Search results

total search579 articles
2002-08-09 Toshiba samples LSI for DTV back-end
Toshiba Corp.'s TC81240TB LSI integrates the company's upgraded versions of CPU, MPEG2 decoder, graphics IC, into a single-chip solution targeted at the back-end system of DTVs.
2009-12-03 Toshiba forms China back-end joint venture
Toshiba is transferring the back-end process of its System LSI business to specialist partners.
2006-02-13 TFT LCD back-end processing companies prep for business
A growing number of companies engaged in the back-end processing of small- and medium-sized TFT LCD panels are preparing for the rising demand coming from the mobile phone market.
2007-11-08 ST breaks ground on China back-end plant
STMicroelectronics this week broke ground on the site of its future chip packaging and test facility in Longgang, Guangdong Province, China.
2012-12-24 Rudolph buys Azores, enters back-end litho market
Rudolph has entered the back-end advanced packaging lithography market with the new JetStep Lithography System, a disruptive innovation featuring a 2X reduction stepper.
2005-09-08 LG.Philips to build 'back-end' LCD plant in Poland
Leading liquid crystal display maker LG.Philips LCD said that it plans to spend 429 million euros (about $535 million) building a "back-end" LCD module production plant in Wroclaw, a city in southern Poland.
2005-09-21 ICI unveils latest back-end capabilities
IC Interconnect (ICI) has revealed that its wafer test, laser marking, die singulation, and tape and reel capabilities are now available as standard service offerings.
2009-05-20 Hynix, Wuxi Industrial set up back-end JV
Hynix Semiconductor Inc. and Wuxi Industrial Development Group Co. Ltd have announced plans to establish a back-end joint venture in China.
2007-01-03 Back-end memory testing could tighten in '07, says analyst
The back-end memory testing industry may become tighter in the second half of 2007, as memory packaging and testing companies struggle to keep pace with a changing and rapidly growing market.
2001-04-01 Back-end copper metallization for flip chip
The IC industry's move toward the broad implementation of copper for back-end metallization is being driven by cost reduction that results from the use of an electroplating process.
2003-07-14 Artest, GCS jointly provide back-end IC services
Artest Corp., a test and engineering company, has formed a strategic alliance with Global Communication Semiconductors Inc. (GCS).
2002-07-17 Zoran samples sixth-generation DVD SoC
Zoran Corp. has announced that it is sampling its sixth-generation Vaddis DVD SoC, which integrates DVD front-end servo system with back-end MPEG decoding functions.
2010-02-19 Toshiba, Fujitsu form assembly, test JV in China
Toshiba Corp. and Nantong Fujitsu Microelectronics Co. Ltd will form a manufacturing joint venture in China for the semiconductor back-end process.
2002-04-10 STMicro unveils DVD solutions at IIC-China
STMicroelectronics has unveiled its DVD front-end and back-end solutions at the 7th annual International IC ? China Conference & Exhibition (IIC-China).
2004-10-12 STMicro to use GetSilicon MVC platform
STMicroelectronics will deploy GetSilicon's MVC platform to further improve its outsourced back-end semiconductor manufacturing execution.
2004-11-01 Standard interface eases partitioning
Engineers opt for smart partitioning in wireless systems instead of integrating all components into a single system chip.
2008-01-15 Renesas fortifies Malaysia operations, focuses on analog, discretes
Renesas Technology is stepping up its operations in Malaysia with the expansion of its back-end process plant and the establishment of a new design center.
2007-03-09 Qimonda to raise capacity in Suzhou facility
Qimonda AG will invest about $329 million over the next three years for the construction of a new facility at its back-end manufacturing site in China.
2003-02-24 PPT Vision, Ismeca ink OEM supply agreement
PPT Vision Inc. has entered into an OEM supply agreement with Ismeca Europe S.A.
2005-03-01 Physical synthesis in structured ASICs
How does a physical synthesis tool help ease front- and back-end design flow issues? Read on.
2006-10-02 Optimize C programs for embedded SOC apps
This article discusses how C programmers for embedded processor cores within SoCs can reduce both code-execution time and memory footprint.
2007-04-02 Oki starts 'fab lite' trend in Japan
With Darwinian economics pushing IC companies to shed fat and focus on delivering core value, budding outsourcing partnerships like the one between Oki Electric Industry Co. and Faraday Technology Corp. may offer a clue to the strategies that some of Japan's larger companies might pursue.
2005-07-18 New dry strip system from Mattson
Mattson introduced its new Aspen III eHighlands dry strip system designed for critical front-end-of-line (FEOL) and back-end-of-line (BEOL) process applications, including photoresist strip over low-k materials.
2002-08-30 Matsushita develops single chip LSI for DVD players
Matsushita Electric Ind. Co. Ltd has announced that it has developed a one-chip system LSI for DVD players that implements all analog front-end functions as well as back-end processing functions.
2005-03-21 King Yuan to run at full capacity by April
Due to increasing demand for flash and LCD driver ICs, Taiwan-based IC back-end provider King Yuan Electronics Co. Ltd announced plans to run at full capacity next month.
2003-11-10 King Yuan to deploy Credence networking test platform
King Yuan Electronics Co. Ltd, an integrated IC back-end service provider in Taiwan, has selected Credence Systems Corp.'s ASL 3000 RF test system as one of its wireless device test platforms.
2002-03-14 Intel Xeon processors boost server performance
Designed for mid-tier and back-end servers, Intel's line of Xeon processor MP operates at 1.4GHz, 1.5GHz, and 1.6GHz, and is claimed to boost server performance by at least 30 percent compared to existing multi-processing systems using the Pentium III Xeon processor.
1999-11-01 Integrating handling for test, inspection, marking and packing
Deploying individual handling systems for testing, inspection, marking and packing leads to inefficiency, under-utilization of IC test equipment, and can even cause bottlenecks that can slow down related back-end processes. Not only do multi-function automated systems circumvent these problems, they also improve throughput and occupy far less floor space.
2004-09-30 Infineon opens memory plant in Suzhou
Germany-based components maker Infineon Technologies AG recently opened its new back-end memory production line in China called Infineon Technologies Suzhou Co. Ltd.
2004-04-28 Greatek to acquire new IC-packaging equipment
Greatek Electronics Inc. will invest NT$120 million ($3.64 million at NT$33:$1) to acquire new wire bonders, testers and back-end equipment for its IC-packaging lines this year.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top