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2007-05-16	Devising a system-level solution for EDA To create a solution that offers a true enterprise-wide system-level flow, the industry must develop a comprehensive methodology that leverages much of its success in hardware development.
2006-11-28	Development chassis eases MicroTCA design Molex has developed a MicroTCA backplane and development chassis to allow developers to build and debug MicroTCA designs before going to production.
2012-04-30	Design for power methodology: From architectural plan to signoff Here's a look at a holistic design for power methodology that spans from architectural decisions through front-end design to physical implementation and sign-off.
2013-01-15	Design experts weigh in on the future of electrical signalling Design engineers identify key trends at upcoming DesignCon such as the new generation of serial electrical signals zipping along at 25 Gbit/s.
2011-05-24	Depth-sensing is the future of mobile 3D Depth-sensing interfaces will ultimately revolutionize how we interact with our devices. Xbox Kinect features depth-sensing that allows a two-way "conversation" between user and device in the 3D world.
2005-08-23	Demoduator enables mobile TV Zarlink said its ZL10355 device offers the industry's smallest package, lowest power consumption and lowest software overhead, coupled with an extended temperature range uniquely suited for mobile DTV.
2007-08-24	Connectors offer flexibility for backplane designs By combining FCI's BGA technology with its shieldless high-speed connector design, the new AirMax VS vertical BGA headers offer system designers greater flexibility in backplane design and improved electrical performance.
2005-04-01	Connector suits 3.5-inch drives Tyco released an improved version of its SCA2 disk drive interconnect that features a number of mechanical and electrical improvements to address increased data rates and regulatory requirements.
2005-09-22	Connector offers space savings The new dual-row 0.50mm pitch CradleCon connector system from Molex provides about a 50 percent space savings compared to single-row docking solutions, while offering a smaller form factor than most competitive dual-row systems.
2009-07-23	Connector delivers optimum EMI shielding ITT Interconnect Solutions has introduced the high reliability 38999 series of connectors for both RF and signal contacts that supports up to 128 contacts and features superior EMI shielding while meeting stringent MIL-DTL-38999 series I, II and III standards.
2006-05-15	Compression connectors replace two-piece systems FCI has developed the Miniature Compression Connector, a one-piece, board-to-board or board-to-flex cable interconnect.
2015-06-23	Comparing position sensors for hydraulic cylinder feedback Know the strengths and weaknesses of magnetostrictive, variable resistance, and variable inductance sensors for hydraulic or pneumatic cylinders.
2007-04-09	Commentary: How to do an Intel in China What's the next 'cover charge' in China? A bleeding-edge fab? Processor technology? Supercomputers?
2008-01-11	Coming soon: Self-driving robotic cars In his keynote speech at the CES, General Motors CEO Rick Wagoner said people will soon be able to read and create e-mail messages, eat breakfast, apply makeup and read newspapers while safely "driving" to work.
2012-02-15	CMOS sensors expand lead against CCDs Shipments of CMOS sensors last year accounted for 92 percent of all area image sensors, reaching 2.1 billion units, up 31 percent from 1.6 billion in 2010.
2006-12-19	CMOS imager chips enable true machine vision New CMOS imager chips are emerging that directly sense depth—3D pixel-by-pixel—enabling machine vision to realize its goal of perceiving objects, and reacting appropriately.
2008-04-16	Class G amps key in driving ceramic speakers Today's portable devices drive a need for smaller, thinner and more power-efficient electronic components. Cellphone form factors have become thin that the traditional dynamic speaker has become the limiting factor in how thin manufacturers can make their handsets. Ceramic or piezoelectric speakers are quickly becoming a viable alternative to dynamic speakers.
2002-05-21	Chipmakers see early payoffs of design reuse In a testament to design-for-reuse, a 10-member Motorola Inc. design team took a chip to tapeout in a hectic two-and-a-half months, engineers told the Custom Integrated Circuits Conference.
2003-11-25	China Circuit Tech PCB features 1mm thickness China Circuit Technology (Shantou) Group has released its eight-layer High Density Interconnects (HDI) PCB.
2010-11-11	Car sensor chips improve safety Freescale's low-g MEMS accelerometers reduce the space and cost of implementing advanced electronic stability control systems that meet or exceed the requirements of emerging new safety standards.
2007-11-28	Car safety electronics go for system-level approach A promising market awaits those chip and EDA companies that help carmakers meet the demand for safety, comfort and infotainment using fewer MCUs by way of a system-level, whole-vehicle approach to design and electronics integration.
2013-07-03	Car HUD market to rise to 9.1M units in 2020 IHS revealed that head-up displays are finding their way into family cars, with navigation and driver-assist functions helping drive the market to expand by more than a factor of seven from 2012-20.
2013-04-04	Car apps boost embedded vision market IMS Research said revenue in 2013 for special-purpose computer vision processors used in under-the-hood automotive applications is seen to reach $151 million, up from $137 million last year.
2006-06-06	Bus bar connector assembly offers high current, low temp Molex has developed a bus bar connector assembly as a compact solution for the direct mating of two perpendicular power bus bars in power supplies or switching power supplies.
2006-06-01	Breaking the verification barrier Startup OneSpin Solutions believes it has technology that will usher in a new era of IC formal verification. But if this company is successful, the real breakthrough may be one of bringing internal technology from a large integrated device manufacturer into a global, commercial EDA market.
2012-02-01	Boost passenger safety, comfort through Ethernet As users become more digitally savvy and their needs become more sophisticated, the automotive industry can anticipate growing demand for in-vehicle bandwidth.
2016-02-16	Boost current control for better stepper motor motion Implementing internal, bi-directional current sensing inside a stepper motor driver IC results in improved motion quality with lower system cost than legacy solutions.
2013-10-02	Blue Pearl Software Suite v.7.1 boasts CDC enhancements Release 7.1 new features include the User Grey Cell, CDC Waivers, CDC checks more granular, Black box signal direction detection and FPGA-vendor specific options pages.
2002-01-14	Bivar CompactPCI guides comply with IEEE 1101.10, PICMG 2.16 specs The cPCI-T series transition guides are designed specifically for CompactPCI applications and are fully compliant with IEEE 1101.10 and PICMG 2.16 CompactPCI specifications.
2001-02-01	Biomorphics tech takes on electronic consumer market This technology news article describes the penetration of robotics in the field of consumer electronics, particularly children's toys.