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2008-07-23 RS-232 transceiver isolates data, power lines on chip
Analog Devices Inc. is expanding its family of interface products with what it claims to be the industry's first fully isolated single-package surface mount RS-232 transceiver with integrated DC/DC converter to supply isolated power
2005-08-09 Ramtron unveils FRAM-based Processor Companion offering
Ramtron introduced its FRAM-based Processor Companion family featuring highly integrated support and peripheral functions for processor-based systems
2006-11-13 Qimonda intros 183MHz DDR Mobile-RAM
Qimonda AG has launched its 183MHz DDR synchronous Mobile-RAM offering a capacity of 512Mbit in a 60-ball FBGA package with 1.8V power supply
2013-09-05 QFN-type packages to boost flatpack/chip carrier category
IC Insights noted that with its low cost, small size and excellent thermal performance characteristics, QFN quickly became the mainstream package of choice for many low-to-medium I/O count ICs
2006-01-05 PWM controller offers extra flexibility
Intersil's ISL6420A PWM controller offers programmable switching frequency, programmable soft start, external compensation, a wide DC input, and two package choices
2007-02-19 Power resistors offer wide resistance range
Vishay has released a family of 20W thick-film power resistors featuring a compact, easy-to-mount TO-263 package and a broad range of resistance values
2009-04-16 Power controller delivers 250 picoseconds PWM
Texas Instruments Inc. has expanded its Fusion Digital Power controllers with a new dual-output, multiphase synchronous buck controller that can support various point-of-load configurations
2002-06-19 Peritek software speeds 3D rendering
Peritek Corp. has unwrapped an accelerated graphics-processing software package that speeds Solaris-based 3D rendering by as much as four times
2005-09-01 Packaging becomes problem-solving tool
Package technology provides improved electrical and thermal performance for today's single-die power products
2006-05-16 New power resistor packaging eases heat management
A molded SOIC-style package for surface mount power resistors features a metal lead frame with an integral heat sink directly under the resistor element
2006-06-05 National offers low-power DACs in tiny packages
National expanded its DAC portfolio with the addition of six low-power DACs in a 3-by-3mm LLP package as well as an MSOP package
2012-01-11 NAND flash touts embedded ECC
Toshiba's BENAND flash memory combines 4bit per 512B embedded correction code and 32nm process NAND flash memory are embedded in one package
2013-10-23 Multi-touch controller IC receives Windows 8.1 certification
The DA8901 multi-touch controller IC from Dialog Semiconductor is optimised to support both Microsoft Windows 8.1 and FlatFrog Laboratories' touch technology
2012-09-19 MoSys touts second gen Bandwidth Engine IC
Delivering up to 384Gb/s throughput in a single device, the MSR620 incorporates cycle selectable burst functionality to support variable packet sizes with improved interface efficiency
2013-10-29 Microsemi launches line circuit aimed at broadband gateways
The new Le9662 and Le9672 line circuits are designed for applications requiring shared or individual power supplies and support ringing and system power management
2006-09-28 Mentor rolls out low-cost development tools
Mentor Graphics said its Edge Development Suite lowers the price barrier for development tools, allowing developers to cost-effectively take advantage of a commercial-grade Eclipse-based package for the most popular 32bit processor architectures
2004-04-16 Memory-rich MCUs from Philips CAN do
Philips has added more memory and a new level of support for the automotive and industrial CAN bus to its ARM7 TDMI-based LPC2000 family of 32bit MCUs
2013-09-25 MCU evaluation platform comes with power measurement tool
Renesas' RX111 Promotion Board is geared to facilitate the evaluation of Renesas' RX111 MCUs in applications including mobile healthcare, smart meters and industrial and building automation
2005-07-13 MCU dev't kit priced at just $149
STMicroelectronics announced a development tool for its ST7Lite 8-bit microcontroller family from MCU-support company Raisonance
2007-10-09 Master the I/O planning puzzle
Systemwide I/O planning is an exercise in coordinating device placement with associated pin and net assignments across the chip-package-board system to maximize system quality for the target application. Achieving this goal is a multidomain balancing act of tradeoffs and iterations
2006-02-22 Magnetic device features dual-coil config for design flexibility
Datatronics introduced an advanced DR359 series of surface-mount inductor/transformer that combines a unique dual-coil design with a low-profile package
2011-10-25 LDOs improve battery efficiency
NXP has released a new family of LD6806 LDO series that includes the LD6806CX4, which features low noise performance, low standby current, and an ultra-small wafer-level chip-scale package
2006-11-07 Lattice expands clock distribution product line
Lattice Semiconductor has added two devices to its clock distribution product family featuring programmable clock skew, termination and interface standard support
2014-04-02 Issues in embedding components within PCB substrates
Embedding components within a PCB substrate provides a host of benefits, but this alternative approach demands support from the entire supply chain
2013-12-06 Interface IC supports highest screen resolutions up to 4K2K
TI's SN65DSI86 claims to support the industry's highest screen resolution up to 4K2Kp60 for tablets, clamshell notebooks and all-in-one PCs
2014-06-24 Intel bolsters massive parallel processor
Intel's Xeon Phi processor gets an upgrade, boasting 3TFLOPS capacity in a single package. Dubbed as Knights Landing, the massive parallel processor is set to debut by the second half of 2015
2008-09-25 Integrated PSoC, nvSRAM secure updated data logging
Cypress Semiconductor has released the industry's first device to integrate a non-volatile nvSRAM and a programmable SoC in a single package
2007-01-31 Infineon unrolls Vista-ready solution for TPM environs
Together with the currently shipping Infineon TPM v1.2, the company's new TPM Professional Package software suite builds a comprehensive and Windows Vista-ready secure solution compliant with the TCG 1.2 specification
2008-01-23 GUI MCU supports 'smart' control panel apps
Atmel has released the AT91SAM9RL64 MCU with high throughput and OS support to implement "smart" control panel applications that offers a robust interface to system control functions
2005-10-21 GSM/GPRS transceiver offers lowest BoM for ULCH market
Silicon Laboratories expanded its Aero GSM/GPRS transceiver family with the release of the Si4209, which requires one of the lowest external component count and smallest board space
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