- Article
(539) -
Forum
(0) -
Blog
(0)
total search539 articles
2006-05-09 | Solution assists in developing PCIe systems Altera and Genesys Logic announced their x4 PCI-SIG-compliant solution, which uses Stratix II FPGAs, the PCI Express x4 MegaCore IP core and the GL9714 physical layer chip |
2006-11-24 | Signal conditioner IC enhances car sensor accuracy ZMD's new signal conditioner IC promises highly accurate amplification and sensor-specific digital correction of bridge sensor signals in automotive environments |
2014-12-09 | Reduce power SoC consumption in the interconnect Here's a modular approach to SoC interconnect for reducing power consumption. The modular concept is different because it consists of a distributed architecture of various components. |
2006-11-28 | Peripherals controller IC revs phone-to-PC downloads Cypress is rolling out a dedicated peripherals controller that is said to boost the transfer rates for complex data and media files from a handset to a PC via a USB link at speeds up to 480Mbps. |
2006-01-04 | Motor driver IC keeps an eye on the camera Freescale's MPC17C724 is a dual-channel, motor driver IC that delivers 400mA per channel for controlling the camera lens and shutter. |
2011-09-01 | Meggitt rolls piezoresistive shock accelerometer The Endevco model 72-60K offers 60,000g measurement range, light gas damping and four times over-range shock survivability. |
2015-03-19 | Marvell pushes for FLC-MoChi approach Marvell President Weili Dai explained that the FLC-MoChi approach will significantly reduce the cost, power and size of electronics systemswhether PC, server, smartphone or wearable. |
2011-05-09 | Intel transistor uses 3D structure Intel has released a 3D transistor design called Tri-Gate into high-volume manufacturing at the 22nm node in an Intel chip codenamed 'Ivy Bridge.' |
2012-06-08 | Intel finFETs show variability, need SOI for scaling GSS has concluded that Intel may need to turn to SOI wafers to scale its FinFETs below 22nm, which may have implications for foundries that are yet to introduce FinFET technology into their chip manufacturing processes |
2013-04-12 | InnoLas completes second 450mm system installation As an optional Bridge-Tool Variant, InnoLas Semiconductor's new system can mark 450mm and 300mm wafers on either side |
2012-11-20 | Impact of crystal electrodes on PCM (Part 1) Part 1 tackles the seeded-bridge model that allows the novel use of elevated-temperature data-retention results to explore the set parameters of PCM devices |
2007-10-19 | HDTV transcoder handles multiple standards Horizon Semiconductors intends to bridge the gap between the number of different HDTV protocols and standards with its Hz4010 multistandard transcoder chip. |
2003-07-04 | HDD delivers 20MBps to 35MBps data transfer rate The portable FireWire hard drives from Trans Intl. are offered with OXFW911 interface chips that promises faster bridge control |
2003-07-22 | Good-Ark rectifier has 5V peak reverse voltage Suzhou Good-Ark Electronic Co. Ltd has released the DF08 bridge rectifier that has a peak overload rating of 50A |
2014-10-29 | FTDI driver upgrade challenges counterfeiters A driver update unintentionally bricks fake FTDI parts, offering a rare chance for the company and buyers to weed out counterfeits. |
2007-12-26 | EPIC with Joule effect ignition debuts A thin-film resistor chip specifically designed as an electro-pyrotechnic initiator chip (EPIC) has been introduced by Vishay Intertechnology, Inc |
2005-07-01 | DFM litho tool aims for two worlds Sigma-C's Solid+ acts as a virtual exposure tool to simulate microlithography and identify problem areas in the design process. |
2006-06-27 | DC/DC controller, rectifier work as a chipset Vishay released a new 500kHz half-bridge DC/DC controller and synchronous rectifier driver that work together as a chipset to enable more efficient power supplies |
2005-04-28 | Cypress PSoC selected by LSI Logic for software development kit Cypress Semiconductor Corp. announced that LSI Logic is offering a Serial Attached SCSI (SAS) software development kit (SDK) based on Cypress's Programmable System-on-Chip (PSoC) mixed-signal array devices and programming software |
2007-11-13 | Conditioning network eases sensor calibration Microbridge Technologies has introduced the MBW-303 Wheatstone bridge offset conditioning network that integrates four electronic temperature compensation rejustors |
2010-06-08 | Coming soon: Atom processors for tablets Intel Corp. disclosed at Computex plans for next-generation Atom processor for tablets and netbooks. |
2007-06-29 | Analog ICs gear up for automotive engine control Freescale unveils six standard SMARTMOS analog products designed for automotive engine management apps to meet the industry's performance, fuel efficiency and environmental requirements. |
2012-10-24 | Advances in wireless bonding LED technology Know how this LED technology provides greater brightness, superior heat dissipation and enhanced durability, while maintaining small footprints. |
2014-06-05 | Address SoC routing congestion with 2.5D SiP The best of both worlds approach that the electronics industry has come up with to solve a design dilemma is the System in Package (SiP) in a 2D package. |
2002-10-16 | Adaptive biasing offsets temp drift The solution that will compensate for thermal drift and thereby increase system reliability and performance is adaptive biasing. |
2007-06-05 | 3-in-1 chipset supports DTT reception in PCs DiBcom has developed a PC chipset that integrates an embedded RF tuner with a demodulator linked to a USB 2.0 bridge for high-quality digital TV reception |
2006-10-24 | 'Combo' ballast IC enables brighter fluorescent lamps STMicroelectronics says its L6585 "combo IC," which integrates a power factor correction stage with a half-bridge controller and all the relevant drivers and logic for an electronic ballast IC, delivers higher efficiency and ultimately makes for fluorescent lamps that shine brighter |
2003-08-11 | UMC developing niche 130nm aluminum process United Microelectronics Corp. said that it is developing an aluminum-based 130nm process for customers that don't need the speed of copper. |
2000-06-16 | The L6569: A new high voltage IC driver for electronic lamp ballast This application note examines the L6569, a high-voltage driver IC that is capable of driving the floating transistor of a symmetric half-bridge inverter in electronic lamp ballasts |
2010-06-29 | Low-cost organic ICs close gap with silicon McGill University researchers claim a breakthrough that could help organic semiconductors bridge the considerable performance gap with silicon chips |
Bloggers Say
See what engineers like you are posting on our pages.