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2008-02-29 8bit flash MCUs feature 16MHz internal oscillator
Microchip Technology has announced a new family of low-cost 8bit Flash PIC MCUs that are capable of operation down to 1.8V and feature a 16MHz internal oscillator.
2008-03-25 700MHz plum goes to Verizon, AT&T
Verizon Wireless and AT&T won most of the spectrum in the U.S. Federal Communications Commission's 700MHz auction, according to FCC Chairman Kevin Martin.
2009-12-21 64Gbyte NAND flash packs dedicated controller
Toshiba Corp. launched a 64Gbyte embedded NAND flash memory module, claimed to achieve the highest capacity yet in the industry.
2009-01-14 60GHz, MoCA take center stage at CES
The Consumer Electronics Show demonstrated the latest advances home networking and interconnect but the 60GHz wireless and Multimedia over Coax (MoCA) showed the most traction.
2010-06-03 5V regulator extends battery life in portable apps
From Fairchild Semiconductor comes the FAN4860 5V 300mA TinyBoost regulator that offers power for USB On-the-Go and HDMI communication circuits.
2008-12-02 5Mpixel image sensor targets high-end handsets
Aptina Imaging Corp. has announced the launch of the MT9P013 5Mpixel image sensor, the company's third-generation 1.75?pixel image sensor.
2008-08-22 5Mpixel image sensor steps up low light sensitivity
Aptina Imaging announced the launch of its new MT9P014 5Mpixel image sensor.
2007-05-03 4-channel PMICs save 75 percent PCB space
Maxim Integrated has released the MAX8667/MAX8668 power-management ICs, which minimize total solution size by integrating two step-down DC-DC converters and two low-input, LDOs, as well as all feedback networks.
2008-05-20 3M, Sony ink optical film license deal
3M and Sony have signed a license agreement that grants Sony the right to use certain 3M optical film technology in its prismatic films for LCD TV products.
2009-02-23 3G solution banks on low-cost promise
According to Infineon, the XMM 6130 sets a new standard, offering a competitive, cost-optimized 3G solution for enhanced mobile Internet experience with higher data rates provided by 3G HSDPA.
2006-10-02 3D interconnects transmit at 100Gbps
NEC Electronics has launched a wafer-level packaging technology that allows more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
2010-01-15 3D displays revenue to hit $22B by 2018
DisplaySearch forecasts that the total stereoscopic 3D display market will grow from 0.7 million units and $902 million in revenues in 2008 to 196 million units and $22 billion in revenues in 2018.
2010-07-16 3D chip standard talks start at Semicon West
Participants of a Semicon West 2010 workshop took the first crack at outlining standards for 3D silicon chips to address design, yield and cost problems.
2003-06-26 32-bit segment to drive MCU growth
Bolstered by strong growth in the 32-bit segment, overall sales of MCUs are expected to rise 11 percent this year.
2006-04-03 3.5G wireless tester gets 1xEV-DO phone option
Willtek Communications' existing 4400 Mobile Phone Tester Series is now suitable for use by engineers at manufacturing sites, as well as by technicians at field repair centers.
2011-01-03 2011: Convergence, content everywhere tests innovation cycle
2010 saw significant innovation and 2011 promises a more aggressive pace. Many of the challenges will come from the trend towards convergence in the consumer electronics market.
2005-02-01 2.5G, 3G converge in a 'world handset'
While 2.5G systems rely on GSM, the transition to W-CDMA will involve the need for combined GSM/W-CDMA handsets.
2007-04-23 2.4GHz amp supports 802.11b/g apps
SiGe Semiconductor unveiled the SE2582L, a power amplifier based on an integrated architecture that boosts power efficiency, reduces system-level cost and optimizes Wi-Fi system performance.
2006-12-05 1V op amp delivers 2.7MHz bandwidth
National's new op amp is said to be the only 1V device capable of delivering 2.7MHz unity-gain bandwidth and maintaining its stability when driving a 500pF capacitive load.
2005-08-12 16Mbit DRAM targets mobile apps
Integrated Silicon Solution has available in production quantities a 16Mb SDRAM dubbed IS42VS16100C1, the first in a series of 1.8V low-power devices.
2007-05-02 16GB embedded NAND flash integrates controller
Toshiba today announced a new series of embedded NAND flash memory devices, which is compliant to eMMCTM and achieves the industry's largest capacity of 16Gbyte.
2001-05-16 1394: Still the best bus for network backbones
If imitation is the highest form of flattery, those who advocate the 1394 multimedia standard ought to feel proud. Every time a group or company touts a new specification, it claims the new spec will do what 1394 already does.
2006-02-28 1.3Mpixel sensor improves image quality for camera phones
Avago Technologies raises the price and performance bar with its 1/4-inch optical format, 1.3Mpixel CMOS image sensor for camera phones.
2011-04-18 'Smart' system CPUs to more than double by 2015
Smart systems will use over 12.5 billion processor cores in 2015, more than double the core consumption in 2010.
2007-05-08 'Smallest' UHF antenna chip rolls for mobile TV
Siano Mobile Silicon and Vishay Intertechnology have teamed up to develop what they say is the world's smallest UHF antenna chip for mobile DTV applications.
2008-08-14 'Smallest' audio device generates highest output power
Maxim has launched MAX9877, the industry's smallest audio subsystem. It provides high-efficiency, high-power, mono Class D speaker amplifier; a DirectDrive, stereo headphone amplifier; and a low-noise, bypass analog switch.
2009-03-06 'First' quarter-inch image sensors integrate EDoF
STMicroelectronics has introduced the market's first quarter-inch optical format, 3Mpixel raw Bayer sensors with integrated Extended-Depth-of-Field (EDoF) capabilities. The image sensors offer an alternative to auto-focus camera solutions.
2009-01-12 'First' 190V n-channel power MOSFET rolls
Vishay claims that its SiA850DJ the industry's first 190V n-channel power MOSFET plus co-packaged 190V power diode with a compact 2mm x 2mm footprint and an ultrathin 0.75mm profile.
2006-08-28 ?SerDes upgrade offers more ESD protection
Using the same footprint and base architecture as its predecessor, Fairchild's new ?SerDes device promises enhanced ESD protection and reduced EMI.
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