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2008-07-28	White LEDs come in CLCC-2 flat ceramic package Vishay Intertechnology Inc. claims the industry's first series of high-intensity white power SMD LEDs in the CLCC-2 flat ceramic package.
2008-09-01	Vishay offers amber and yellow power LEDs in CLCC-2 package Vishay Intertechnology Inc. claims it the industry's first series of high-intensity amber and yellow power SMD LEDs in the CLCC-2 flat ceramic package with driving currents up to 400mA.
2010-07-15	Soldering recommendations for the ceramic vertical mount package This application note describes soldering recommendations for the ceramic vertical mount package (CVMP). The CVMP can be mounted either vertically or lying flat.
2002-09-09	Kyocera develops ceramic package for SMT LEDs Kyocera Corp. has developed what it claims to be the industry's first surface-mount ceramic package for blue and white LEDs, offering improved heat dissipation, reliability, and lifespan.
2007-08-31	High-intensity LEDs come in CLCC6 ceramic package Vishay Intertechnology has introduced what it claims to be the first series of high-intensity yellow, amber and white power SMD LEDs in CLCC6 ceramic package.
2005-06-29	TI rolls LDOs in chip scale package Texas Instruments Inc. (TI) announced a series of 200mA low-dropout linear regulators (LDOs) in a 1.5-by-1mm chip scale package, which is said to be 80 percent smaller than today's SOT-23 devices
2011-10-11	SMT package designed for transistors, diodes Microsemi's hermetic surface mount package is made from aluminum nitride ceramic and touts a power rating of 5-15W.
2012-07-27	Power tip: Avoid common multilayer ceramic capacitor issues Learn about the potential pitfalls with ceramic capacitors and know how to avoid them
2007-06-01	Power amp drives ceramic speaker at higher voltages National Semiconductor has developed a single-chip Boomer audio power amplifier that delivers the highest voltage for driving ceramic speakers used in portable devices
2006-10-17	Micrel intros ULDO regulator in ultrasmall package Micrel has launched a single LDO offering an ultralow dropout of 40mV at 150mA, more than 75db PSRR and ultralow output noise—all in an extremely compact form factor.
2006-08-28	LDO delivers high output current in small package Said to be the first in the industry, Microchip's MCP1727 is an efficient, low-power 1.5A LDO that provides high output current and low output voltage in small, thermally capable packages.
2012-10-29	Imaging BGA package at multiple depths Understand how to come up with a slide show of acoustically visible features at increasing depths.
2009-01-29	High power LED, ceramic base SMD, VLMxxx Series Driving high power LEDs while minimizing lowest possible heat for any given IF, provides not only the advantages of efficiency on its electro-optic properties but would also extends its service life.
2006-04-06	EMI filter housed in tiny package for wireless handsets California Micro Devices offers its new generation Praetorian CM1452 EMI filter with ESD protection for wireless handsets.
2006-08-11	Dual ULDOs tout 'smallest' MLF package Micrel's new dual ULDOs are offered in one of the industry's smallest packages, a tiny 1.6-by-1.6mm 6-pin MLF package, making them suitable for advanced portable applications
2004-12-02	Dongguan Richwell ceramic capacitors rated at 4kVac Richwell disclosed the release of its new JN11E152 ceramic capacitors that are available with a capacitance of 1.5nF ±20 percent
2006-11-29	DC/DC delivers up to 500mA from tiny package Linear Technology has announced a high-efficiency, 2.25MHz synchronous buck regulator that delivers up to 500mA of continuous output current from either a 2-by-2mm DFN or ThinSOT package
2007-03-09	DC/DC delivers 500mA from tiny package Linear Tech has announced a high efficiency, 2.25MHz, synchronous buck regulator that can deliver up to 500mA of continuous output current from a 2-by-2mm DFN package
2006-02-09	Cypress' CY25701 SSXO available in new package Cypress introduced a new packaging option for its CY25701 programmable spread spectrum crystal oscillator with a high-accuracy reference crystal in a single package
2004-06-08	Coventor, Kyocera deliver package libraries for MEMS apps Coventor Inc. and Kyocera America Inc. have teamed up to provide software libraries for MEMS applications.
2008-04-16	Class G amps key in driving ceramic speakers Today's portable devices drive a need for smaller, thinner and more power-efficient electronic components. Cellphone form factors have become thin that the traditional dynamic speaker has become the limiting factor in how thin manufacturers can make their handsets. Ceramic or piezoelectric speakers are quickly becoming a viable alternative to dynamic speakers
2008-10-01	Chip package options abound When creating a new IC, device packaging is often overlooked until the end of process. However, choosing the right package can reduce time-to-market and create tangible benefits for customers. Here is a look at some of the available options and what they have to offer
2006-06-01	Charge pumps come in 3-by-3mm DFN package Linear Tech's mode-selectable 500mA step-up charge pumps are offered in a 3-by-3mm DFN package
2006-09-27	Ceramic resonators tout 'tightest' tolerance Murata Electronics North America said its new ceramic resonators aimed at USB 2.0 high-speed applications offers the industry's tightest tolerance at ±500ppm
2008-10-01	Ceramic column grid array CCGA packages are becoming increasingly popular as an alternative to CBGA packages for applications requiring very high-density interconnections with higher board-level reliability.
2004-02-12	C&D dc-dc converters based on ceramic PCB C&D Technologies' family of miniature, surface mount dc-dc converters is based around a ceramic PCB
2008-07-30	Boost converters combine switches in mini package Linear has launched the LT3495/-1 low-noise boost converters with integrated power switches, Schottky diodes and output-disconnect circuitry. The LT3495 employs a 650mA switch, whereas the LT3495-1 has a 350mA switch.
2005-08-15	AVX's RF capacitor packs high performance in mini package AVX Corp. has developed a porcelain and ceramic dielectric multilayer capacitor (MLC) that is said to provide industry-leading performance for high Q, low equivalent series resistance (ESR), and high self-resonance in a 0603 package.
2002-11-11	Amkor expands CMOS sensor package offering Amkor Technology Inc. will be expanding its VisionPak CMOS image sensor assembly capabilities in order to meet the demand for video and digital camera features in digital and PC cameras, cellphones and other handheld applications.
2004-03-25	Agere puts LDMOS in plastic package Agere Systems' line of lead-free overmolded plastic-packaged LDMOS transistors will reduce the cost of RF transistor packaging by up to 25 percent.