Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > chip cooling

chip cooling Search results

?
?
total search188 articles
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors.
2008-06-06 Scientists gauge quantum states for chip cooling, settling
Scientists noted that in two-level quantum systems, like those used to represent qbits, these might control both temperature and entropy. The approach enables novel cooling schemes as well as instant settling for atomic, molecular and solid-state devices
2001-03-27 DC Cooling Fan Controller IC Eliminates Components And Failure Mechanisms
This paper presents a single-chip cooling fan controller solution that can replace up to 12 components used in conventional cooling fans.
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2008-09-16 Single-chip multiprocessing steps up
SoC design options for software-friendly multiprocessing have been limited. Now, SoC design components, such as the MIPS32 1004K coherent processing system, mean on-chip symmetric multiprocessing (SMP) under a single OS is a real option
2012-05-07 Single-chip drivers LIN-ready for BLDC motors, actuators
Melexis' new family of driver ICs claim highly efficient BLDC motor control from a single IC by combining the voltage regulator, LIN-transceiver, MCU, EEPROM, Flash, RAM and power FET pre-driver.
2012-12-26 Server cooling method attracts U.S. gov't interest
Clustered Systems originally set out to build a supercomputer built around its mesh networking technology but both it discovered that their approach to cooling was far more valuable
2014-04-10 Self-cooling chips operate up to 300°C
A team at Fraunhofer IMS developed a type of high-temperature process that allows the fabrication of compact microchips that can keep their cool even at 300°C.
2007-08-21 Purdue U: Ionic winds can cool that chip
Harnessing ionic winds to accelerate charged air between high-voltage electrodes can enhance a chip's heat-transfer coefficient by 250 percent, according to Purdue University
2001-09-25 Power and cooling of multi-chip SHARC DSP boards: Is it all smoke and mirrors?
This application note explains power consumption of the SHARC DSP and discusses Ixthos' 16 SHARC processor board solution developed to reduce power consumption and heat production.
2004-04-01 Optical switch benefits from off-chip drive
As more electrostatic MEMS-based optical-switch products penetrate the market, scalability, reliability and tilt precision take on increased significance.
2002-11-29 NTC chip thermistors suit cooling, heating apps
The company's NTC chip thermistors combine high electrical accuracy with improved humidity and thermal cycling features
2008-01-10 New packaging tech integrates cooling, power generation
Nextreme has integrated cooling and power generation into the copper pillar bumping process used in high-volume electronic packaging
2008-08-14 Military-qualified FPGAs 'first' with on-chip flash memory
Extending the low-power and reliability benefits of its higher density flash-based FPGA technologies, Actel Corp. has added new ProASIC3 and ProASIC3EL FPGAs to its military-qualified product offerings.
2005-05-03 March global chip sales hit $18.4 billion, says analyst
Handelsbanken Capital Markets expects the three-month rolling average of worldwide semiconductor sales for March, due to be announced by the U.S. Semiconductor Industry Association in the next few days, to be $18.40 billion, the financial analysis company said Thursday (April 28).
2006-03-23 IP core enables single-chip, closed-loop control systems
Actel introduced CorePWM, a flexible PWM intellectual property IP building block for D/A conversion, designed for the company's nonvolatile FPGAs.
2007-02-19 Intel's 80-core chip crunches 1Tflop at 3.2GHz
Intel's 80-core chip crunches 1 trillion flops when running at a 3.2GHz clock speed and consumes 62W, to yield a record 16Gflops/W
2007-07-02 Green chip lights up to 180 lumens
The new green chip in ThinGaN technology from OSRAM Opto Semiconductors has achieved a brightness in the laboratory above 180 lumens
2006-05-02 Engineers develop cooling device for computer IC
Engineers at Purdue University have developed a MEMS-based micro-pump cooling device small enough to fit on a computer chip that circulates coolant through channels etched into the chip.
2007-06-04 China chip market cooling down in next two years
Next year, China's chip market growth is expected to slow to about 18 percent and then to 10 percent in 2009. By 2010, growth will accelerate again to 14 percent, according to iSuppli
2006-07-31 AC process streamlines Pb-free flip-chip assembly
Henkel's NCP materials provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process.
2013-10-28 Squeezed light' on a chip overcomes MEMS quantum limit
The ORCHID programme from DARPA seeks to overcome thermal fluctuations and random quantum fluctuations, a barrier known as the standard quantum limit, in MEMS sensors.
2013-03-13 Electronic blood" developed for cooling effect
IBM is exploring the use of "electronic blood" to not only cool but also to power the cognitive computers of the future.
2003-06-05 Vishay expands WSL metal chip resistor line
Vishay Intertechnology expanded their WSL series of surface-mount power metal strip resistors with the addition of WSL1506E, WSL2010E, and WSL2512E.
2007-10-31 Graphics cards use fanless cooling method
The Millennium P690 Series fanless multidisplay graphics cards from Matrox Graphics Inc. are available in several form factors.
2008-10-01 Stacked microprocessor system promises better performance
Take a different approach to chill. A group of researchers just did, resulting in what may be the most efficient heat dissipation possible for stacked microprocessors.
2005-07-08 Quarter-brick IBCs extend to 450W
Georgia Institute of Technology researchers have developed a chip-cooling process that they hope will replace the bulky, bolt-on metal towers used with microprocessors like the G5.
2005-09-22 Toshiba readies Cell processor design platform
Toshiba Corporation is readying a hardware development platform for applications based on the Cell processor that it co-developed with Sony and IBM.
2008-01-07 Top 10 stories to keep track this year
ChannelWeb assembled a panel of industry experts comprising vendors, analysts and solution providers to discuss what they think will be the most important chip stories to watch in 2008
2006-12-12 Slow growth to push analog, FPGA firms to go private
The semiconductor growth will be less than ten percent a year on a compound basis, according to Gartner Dataquest chief chip analyst
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top