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2006-12-27 Shanghai firm preps chip for China DTV spec
Shanghai High Definition Digital Technology said it wrapped up development on its 3G video processing platform.
2006-10-11 SGA camera chip sensor targets 3G video phone market
OmniVision Technologies has unveiled a high-performance Square Graphics Array (SGA) 400 x 400 resolution camera chip sensor aimed at secondary cameras in the 3G video phone market
2005-04-01 Semtech chip with low propagation delay dispersions
A low power, four channel BiCMOS pin electronics IC designed to bring high-end features to low-cost logic, memory or mixed signal ATE systems was unveiled by Semtech.
2015-07-21 Semicon West highlights 10 chip trends
During the recent Semicon West, executives from a number of chip companies discussed the ongoing developments on semiconductors technology
2004-05-11 Semicon Singapore reflects chip industry optimism
Growing semiconductor demand estimated to be worth some $210 billion this year lent an air of optimism to this year's Semiconductor Equipment and Materials International (SEMI) exhibition.
2010-01-11 SEMI: China could double IC production in 10 years
China is committed to narrow the gap between its IC production and consumption, leading to doubling the country's global equipment and materials market in ten years
2008-10-10 SEMI implores EU initiatives to boost chip market
Amid the seemingly dwindling role of Europe in the global IC industry, SEMI industry association urges initiatives from the EU and the national governments to promote the region's chip industry
2008-04-23 Seiko touts 'thinnest' chip-type double-layer capacitor
Seiko Instruments will introduce the world's thinnest and smallest chip-type electric double layer capacitor, part number CP3225A, in October
2004-04-30 See-Power kicks off mass production of surface-mount LEDs
See-Power Technology Co. Ltd's third production line for surface-mount LEDs begins mass production this month
2007-10-17 Seamless-switching mobile TV chip tipped for Japan
To meet the needs of the rapidly growing Japanese mobile TV market, MediaPhy Corp. introduced the second member of its product family, the J-Solo.
2004-10-29 SDK blue LED features flip chip structure
Showa Denko K.K. announced that it has developed a blue LED based on gallium nitride.
2002-02-12 Scaling debate stalks chip conference
From the wide range of panels and tutorials at the International Solid-State Circuits Conference, from the myriad papers, from the conversations in the hotel halls, a single gnawing issue grew from hints and whispers to a groundswell of concern: Will IC technology continue to scale?
2003-01-23 Sanyo schedules production of 35mW blue-violet laser
Sanyo Electric Co. Ltd will begin production this spring of a 35mW laser for next-gen writable optical disk systems
2007-10-02 SanDisk opens SiP production facility in China
SanDisk has announced the opening of its production facility in Shanghai, China, which produces a flash memory-based chip package called SiP.
2006-10-30 Samsung unveils 'first' 50nm DRAM chip
Samsung Electronics recently announced that it has developed what it touts as the industry's first 50nm DDR2 DRAM chip, which promises to increase production efficiency from the 60nm level by 55 percent.
2006-10-20 Samsung touts 'first' 50nm DRAM chip
Samsung Electronics announced that it has developed the industry's first 50nm DDR2 DRAM chip, touted to increase production efficiency from the 60nm level by 55 percent.
2006-09-05 Samsung starts 1Gbit DDR2 DRAM mass production
Samsung Electronics announced the mass production of 1Gbit DDR2 DRAM memory using 80nm process technology
2009-07-27 Samsung ramps up 40nm 2Gbit DDR3 production
Samsung Electronics Co. Ltd has begun mass production of 2Gbit DDR3 devices using 40nm class process technology
2006-06-30 Samsung makes 'fastest' memory chip in 60nm tech
Samsung announced it has developed a faster, higher capacity version of the OneNAND, touted to be the world's fastest memory chip, using the 60nm process technology
2015-12-29 Samsung launches chip for health-related wearables
The South Korean company claims that the new processor is the first in the world to be able to take multiple measurements, including body fat, skin temperature and heart rate.
2004-03-10 Samsung joins chip technology alliance at Fishkill
In agreements that would allow Samsung Electronics (Seoul, South Korea) to share manufacturing capacity with IBM, Samsung announced Friday that it is joining an ongoing semiconductor technology alliance with IBM, Chartered Semiconductor Manufacturing, and Infineon Technologies.
2005-02-23 Samsung completes prototype DDR3 memory chip
Samsung Electronics said it has finished work on a prototype DDR3 DRAM memory prototype.
2005-06-24 Samsung commences 90nm 1Gb DRAM production
Samsung Electronics Co. Ltd has begun mass production of a monolithic 1 Gigabit (Gb) DRAM chip using more operationally efficient and performance-enhancing 90nm processing.
2006-02-20 Samsung claims fastest graphics memory chip
Samsung Electronics is claiming the world's fastest graphics memory chip
2007-03-05 Samsung begins production of 1Gbit DRAM at 60nm
Capitalizing on the increasing demand for large density DRAMs, Samsung Electronics Co. Ltd has started mass production of the industry's 'first' 1Gbit DDR2 DRAM using 60nm process technology
2012-09-21 Samsung begins production of 128GB embedded NAND
Touted by the company as the industry's highest density storage, the memory solution is geared for next-generation smartphones, tablets and other mobile devices.
2006-11-03 Samsung announces 16-chip MCP technology
Samsung Electronics announced that it has developed the industry's 'first' process to enable the manufacture of a 16-chip multi-chip package of memory
2008-07-23 RS-232 transceiver isolates data, power lines on chip
Analog Devices Inc. is expanding its family of interface products with what it claims to be the industry's first fully isolated single-package surface mount RS-232 transceiver with integrated DC/DC converter to supply isolated power.
2015-04-09 ROHM's single-chip PMIC targets ultra-thin tablets
The BD2613GW, a successor to the BD2610GW power management integrated circuit, targets the Intel Atom processor Z3700 series for Android and Windows-based tablets.
2007-08-31 RISC MCU rolls with on-chip dot matrix LCD driver
The S1C17701 from Seiko Epson Corp. is a single-chip MCU featuring on-chip flash ROM and a high-resolution dot matrix LCD driver
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