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chip scale package What does CSP stand for? Search results

What does CSP stand for?
CSP stands for chip scale package or chip size package. It is a chip housing that is slightly larger than the chip itself.
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2014-09-01 White-chip scale packages offer up to 80% cost reduction
Rated for input power up to 3W, the the ReadyMount Enhanced CSP from SemiLEDs is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2005-06-29 TI rolls LDOs in chip scale package
Texas Instruments Inc. (TI) announced a series of 200mA low-dropout linear regulators (LDOs) in a 1.5-by-1mm chip scale package, which is said to be 80 percent smaller than today's SOT-23 devices.
2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.
2007-07-19 Othello chip suits 3G TD-SCDMA wireless handsets
Analog Devices Inc. has unveiled the latest addition to its family of Othello direct conversion radios and its broad TD-SCDMA product portfolio, the Othello-3T AD6552.
2005-04-28 OPA277 op amp from TI now available in DFN package
TI introduced a 4-by-4mm DFN package version of the high-precision OPA277 operational amplifier from its Burr-Brown product line
2004-06-16 NanoStar & NanoFree 300?m solder bump wafer chip-scale package application
This app note provides the necessary design and reliability information to apply the NanoStar 300?m solder bump packages.
2004-06-17 Microfil wafer level underfilled chip scale package
This app note presents the Microfil wafer level underfilled chip scale package.
2002-11-20 Micro SMD Wafer Level Chip Scale Package
This application note describes the Micro SMD Wafer Level Chip Scale package.
2004-06-17 Micro SMD wafer level chip scale package
This app not describes the features of a micro SMD WLCSP.
2003-05-26 Leadless Leadframe Package (LLP
This application note discusses the attributes, specifications, and applications of the Leadless Leadframe Package
2007-07-13 Leadless leadframe package
The leadless leadframe package (LLP) is a leadframe based chip scale package that may enhance chip speed, reduce thermal impedance, and reduce the PCB area required for mounting.
2004-11-22 IntelFlash memory design for a stacked chip scale package
This app note provides system designers with a set of guidelines for designing an Intel flash memory device for a stacked chip scale package (SCSP).
2004-05-14 Intel Flash memory design for a stacked chip scale package
This app note provides system designers with a set of guidelines for designing an Intel Flash memory device for a stacked chip scale package.
2001-06-19 Inductance analysis of chip scale packages
This application note is intended to demonstrate a simple model that relates the maximum operating clock frequency of a CSP based on the IC's power dissipation, the typical lead equivalent inductance and the number of pairs of leads used for power and ground.
2014-11-12 GQFN package shrinks devices by up to 60
Aside from reducing package size, the grid array flat no-lead package also enables improved electrical performance through lower inductance and capacitance
2009-06-16 Flip-Chip 300?m recommendations for audio power amplifier
This application note describes the Flip-Chip CSP features and species how ST's customers can use them
2006-04-06 EMI filter housed in tiny package for wireless handsets
California Micro Devices offers its new generation Praetorian CM1452 EMI filter with ESD protection for wireless handsets.
2013-07-05 Diodes launches chip scale Schottky
Diodes' 30V, 0.2A SDM0230CSP Schottky diode has a typical thermal resistance of just 261C/W. and uses 70 per cent less board space than DFN1006 and SOD923 packaged Schottkys.
2005-06-13 Cellphone sound chip from Yamaha includes class-D amplifier
Yamaha recently started shipping its AudioEngine mobile phone sound chip that features the company's proprietary hybrid synthesizer, a high-quality sound processor, and an energy-saving Class-D amplifier
2008-10-06 Assembly and PCB layout guidelines for chip-scale packages
This application note provides general guidelines for proper board design and surface-mount process.
2005-08-17 Amkor, GEM ink chip package license agreement
Amkor Technology Inc. and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame patents.
2004-02-20 Amkor to expand semiconductor package output
Amkor Technology Inc. has revealed that it is increasing the capacity of its MicroLeadFrame (MLF) semiconductor packages by more than 50 percent within the next six months to stay ahead of the rising industry demand.
2005-07-13 Actel makes LGA package available to RTAX-S FPGA offering
Actel disclosed that it has expanded its package selection to include a Land Grid Array option for its RTAX-S FPGA family
2007-05-31 A design and manufacturing guide for Lead Frame Chip Scale Package
This application note provides design and manufacturing guidance on the use of the lead frame chip scale package. The LFCSP is compliant with JEDEC MO220 and MO229 outlines.
2014-04-09 TI unveils low-power MCUs in compact package
Developers can design smaller products with TI's FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3mm
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below
2005-04-07 Tessera, Hynix sign package license agreement
Packaging IP supplier Tessera Technologies has signed a new technology licensing agreement with Korea-based DRAM supplier Hynix Semiconductor.
2005-03-25 Tessera signs up Fujitsu as chip packaging licensee
Tessera Technologies Inc. has signed a technology licensing agreement with Fujitsu Ltd for packaging intellectual property.
2005-03-04 ST flash memory chip tailored for 3G mobile phones
ST rolled out a 256Mb NOR flash memory chip that uses a 2bit/cell architecture to provide increased memory density in a small-sized die
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