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2002-02-04 Xenicent develops "lab on a chip" technology
Xenicent Inc. is developing a "lab on a chip" technology for commercial testing applications within the food packing and veterinary industries.
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2005-02-22 Wireless company to license TSR technology to China Electronics
Wireless communications company TechnoConcepts Inc. announced Thursday it has entered into a license agreement with Chinese conglomerate China Electronics Corp. for its patented True Software Radio (TSR) technology
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below.
2006-11-13 TI chip makes multimedia phones affordable
Texas Instruments announced a new OMAP-Vox single-chip solution that will enable lower-cost multimedia-rich feature phones
2005-01-03 The edge of technology
The Microventures conference, which features hordes of startup CEOs pitching their companies to bored-looking venture capitalists, is a great place to check out the leading edge of chip technology.
2006-07-26 Tessera, Micron enter technology license agreement
Tessera Technologies Inc. announced a definitive technology license agreement with Micron Technology
2005-07-19 Techno Concepts woos Asia with SDR technology
Following up on a foray into China, U.S. software-defined-radio specialist company Techno Concepts Inc. is targeting one of Asia's most sophisticated wireless markets, South Korea.
2003-12-18 STMicroelectronics announces breakthrough chip technology
STMicroelectronics announced that they have developed a new semiconductor technology that eliminates a potential problem lingering among electronic equipment manufacturers in recent years: the growing vulnerability of silicon chips to so-called "soft errors.&quot
2010-12-15 STATS ChipPac flip chip biz grows over 50
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units
2005-09-02 Singapore packager to expand flip-chip capacity
Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly
2008-02-05 SIA: Chip sales hit new record with $255.6B in 2007
Global sales of semiconductors grew for the sixth-consecutive year, reaching a record $255.6 billion in 2007, up 3.2 percent from the $247.7 billion reported in 2006, according to SIA.
2007-06-26 SIA slashes 2007 chip sales forecast
SIA has lowered its 2007 growth sales forecast for microchips to 1.8 percent, citing price drops in the microprocessor, DRAM and NAND flash markets.
2004-03-10 Samsung joins chip technology alliance at Fishkill
In agreements that would allow Samsung Electronics (Seoul, South Korea) to share manufacturing capacity with IBM, Samsung announced Friday that it is joining an ongoing semiconductor technology alliance with IBM, Chartered Semiconductor Manufacturing, and Infineon Technologies
2014-10-20 Report: IBM to transfer chip-making ops to GlobalFoundries
IBM is set to make a "major business announcement," which according to insiders could indicate that the company is close to dumping its microchip manufacturing unit into the lap of GlobalFoundries.
2010-01-25 NXP, Intrinsic-ID team to boost chip security
NXP will utilize Intrinsic-ID's Quiddikey solution to secure SmartMX-powered assets against cloning, tampering, theft-of-service and reverse engineering.
2011-04-15 New flip-chip techs, apps loom ahead
Factors such as the rising cost of gold used for wire bonding, need for low-thickness devices and continued CMOS downscaling have triggered interest in flip-chip technologies
2014-07-07 Network-on-a-chip fast-tracks data exchange
The architecture uses wireless shortcuts to communicate between distant points on the multi-core chip. These single-hop shortcuts bypass intermediary nodes and directly connect one node to another
2002-10-08 Motorola optimizes chip technology for wireless apps
Motorola Inc.'s Semiconductor Products Sector (SPS) has noted that they have made enhancements on its SiGe:C technology for wireless applications
2008-04-24 Microfluidic lab-on-chip technology steps forward
Algorithms developed by a range of research groups aim to automate microfluidic lab-on-chip technologies that perform chemical identification and medical tests by shuffling nanoliters of samples and reagents around micron-sized channels
2016-04-01 Marvell to use SerDes technology for multi-die products
The Glasswing chip-to-chip technology from Swiss startup, Kandou, is based on the Chord signaling method, which produces an energy efficiency that enables architectural innovation.
2013-02-08 Luminus big chip LED comes in CBT-90 form factor
The CBT-90-UV LEDs come in a high-performance form factor at 405 nm and are designed to help accelerate the conversion to solid state UV light sources in industrial markets.
2012-08-17 Infineon to supply secure chip tech for e-passport program
The company revealed that the U.S. Government Printing Office awarded the company a new contract to supply security chip technology embedded in the U.S. electronic passport.
2007-10-02 Infineon licenses DirectFET technology from IR
Infineon will license from International Rectifier the latter's patented advanced power management packaging technology, DirectFET
2014-01-16 Imec modelling tool estimates cost of chip technology nodes
Imec and AlixPartners are co-developing a cost modelling solution to assess the cost of advanced semiconductor technology options. This modelling will assess the cost of various patterning options for N10/N7 nodes, advanced packaging solutions, and 3D NAND memory
2008-03-12 IBM, Hitachi forge joint 32nm chip research
IBM and Hitachi have signed a two-year joint semiconductor metrology research agreement to speed the pace of semiconductor innovation.
2003-10-10 Honeywell licenses Motorola MRAM technology
Honeywell and Motorola have signed a technology transfer and licensing agreement for Motorola to provide Honeywell access to its MRAM chip technology.
2008-12-04 Holographic technique could boost lab-on-a-chip
Purdue University researchers have developed an electrokinetic patterning technique that utilizes laser and holograms to quickly position numerous tiny particles.
2002-03-20 Furukawa, Mitsui form laser chip joint venture
Furukawa Electric Co. Ltd has formed a joint venture with Mitsui Chemical named MC Fitel for the production of high power 9.8?m laser chips.
2007-01-11 FP laser chip cuts costs of diplexers, triplexers
Avanex has unveiled what it claims is the first 1310nm Fabry Perot laser chip designed to minimize the cost of diplexers and triplexers by enabling the use of fully automated and scalable passive alignment techniques
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