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What is a multimedia IC?
Chip or chipset designed specifically for use in multimedia applications such as handsets, displays, etc.
total search17330 articles
2008-09-16 TV chip market up for growth, consolidation
The global market for TV ICs was 29.8 million units in Q2 08, up 21 percent on the same period last year, with shipments 7.8 percent better than in Q1 08, according to DisplaySearch. However, the market researchers warn that vertically integrated players like Samsung and Panasonic are set to force consolidation in the market.
2009-04-08 TV chip manufacturing competition sizzles
While the flat-panel TV market is beginning to consolidate, that process has not yet begun in TV chip manufacturing, according DisplaySearch's "Q1 09 Quarterly TV Electronics Report". Competition is as fierce as ever, and no clear market leader has yet emerged.
2011-02-22 TSMC, Taiwan university create multi-angle 3D chip
The 3D TV chip allows TV viewers to see an object in stereo from various angles. It also comes with traditional HDTV and 3DTV functions.
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2015-10-21 TSMC sees zero growth in global chip industry
The company attributed the dismal performance to the sluggish smartphone market in China as well as the struggling global economy, which directly resulted in excess inventory.
2011-05-13 TSMC reduces 2011 chip market growth forecast
TSMC has reduced its global semiconductor growth forecast from 4 percent to 2 percent even as it eyes an 11 percent growth for the foundry chip market and a 20 percent growth for the company.
2011-12-15 TSMC pushes thru with 3D chip
The semicon firm claims its approach will be simpler, cheaper and more reliable, focusing on creating TSVs early in the process, then adding packaging capabilities to its fabs.
2006-08-15 TSMC posts 32% growth in chip sales last month
Sales at Taiwan Semiconductor Manufacturing Co. Ltd continue to run more than 30 percent ahead of where they were a year before.
2011-01-18 TSMC is among chip industry's biggest R&D spenders in 2010
TSMC has joined the ranks of the semiconductor industry's top R&D spenders in 2010. Analysts attribute TSMC's increased R&D spending to the success of the fabless-foundry model and the increase in IDMs migrating to fab-lite models
2014-09-26 TSMC fabricates networking chip with 16nm FinFET
The 32-core ARM Cortex A57-based processor is fabricated using TSMC's 16nm FinFET technology, and boasts a three-fold increase in performance compared with the previous processors.
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2013-11-18 Tsinghua's merger plan seen to boost China's chip industry
The firm's plan to acquire Spreadtrum and RDA Microelectronics could pave the way for China's local chip industry to get a consolidated entity powerful enough to compete with Taiwan's MediaTek.
2002-04-19 Trumpion shows multimedia chip products at IIC-China
System chip design house Trumpion Microelectronics Inc. exhibited its latest video and multimedia memory and interface chip developments at the 7th annual International IC ? IC Conference and Exhibition.
2010-11-23 True single-chip motor controller integrates digital, analog and power
High-performing motor drives for equipment may now be realized more quickly, utilizing a complete motor-control system on a chip designed by STMicroelectronics. The 'digital SPIN', or dSPIN, integrates all the necessary digital control, analog measurement, and power electronic circuitry for controlling stepper motors using ST's advanced BCD fabrication process.
2003-08-27 TriQuint, Amkor partner on flip-chip process
TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors.
2008-08-11 Trio seeks to cut costs in chip packaging
Infineon has granted licenses for its embedded Wafer-Level BGA chip packaging technology to competitor STMicroelectronics as well as STATS ChipPAC to lower costs and achieve higher market acceptance.
2008-08-07 Trio collaborates on mobile TV chip for Olympics
SMIC announced that Telepath Technologies Co. Ltd successfully integrated its demodulator chip, TP3001, in a majority of mobile TV phones distributed at the 2008 Beijing Olympics.
2008-05-16 Trimmable chip resistors available in 0402, 2512 sizes
Stackpole Electronics has expanded the FCR series of trimmable chip resistors with the addition of 0402 and 2512 case sizes.
2002-03-13 Trident encoder chip enables TV display of PC apps
The TVXPRESS TM II NTSC/PAL TV encoder chip is claimed to provide sharp text and graphics while substantially reducing dot crawl and color bleeding, and enables PC applications to be displayed on television.
2006-05-30 Tri-Vision awards chip license to Chinese OEM
Tri-Vision announced that it has licensed its U.S. and Canadian patent to an OEM in China.
2005-07-06 Trends point to monthly chip market in annual decline from June
Steadily declining annual growth rates for the actual semiconductor sales in the months of January through May, both globally and for the Asia-Pacific region, indicate that year-to-year growth will have evaporated in June and that the market could be in for a period of annual decline, according to statistics from the Semiconductor Industry Association (SIA).
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2002-07-05 TranSwitch offers single-chip solution for DS3/DS1/E1 access systems
TranSwitch Corp. has introduced the TEPro device, a RISC processor-based SoC with embedded DD-AMPS firmware and host API, to support next-generation channelized DS3/DS1/E1/DS0 applications.
2004-10-05 TransDimension unveils single-chip USB OTG controller
TransDimension released what it claims as the industry's first single-chip USB OTG controller that supports high-speed peripheral and full-speed host functionality.
2002-04-12 TransDimension to offer Agere PCI-based chip
TransDimension, a developer of embedded and mobile connectivity solutions, will market and resell Agere System's PCI-based chip known as the Agere USS312TC, using the TransDimension brand name.
2007-06-18 Transcoder chip converts MPEG-2 to H.264
Promising relief for bandwidth-constrained professional broadcast and video applications, LSI Logic Corp. has introduced a high-definition MPEG-2-to-H.264 transcoder chip.
2003-07-22 TransChip rolls out a single-chip CMOS imager
TransChip is targeting mobile handset vendors seeking to upgrade cellphones to popular camera phones with a single-chip CMOS image sensor that integrates image processing and compression along with LCD controller functions.
2002-08-05 Traco chip LEDs have 40mcd luminosity
Traco (Shanghai) Electronic Co. Ltd's 190 series of blue chip LED has a peak emission wavelength of 470nm and features a 40mcd luminosity.
2007-09-28 Tower in talks with India chip manufacturing groups
Tower Semiconductor is currently in talks with SemIndia and HSMC, two leading proponents of Indian chip manufacturing, on the two companies' use of Tower's manufacturing capability.
2006-01-04 Tower churns out Zoran Cascade2 chip
Tower Semiconductor announced that it has begun manufacturing Zoran's Cascade2 demodulator chip at Tower's FAB2, using 0.18?m process.
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