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What is a multimedia IC?
Chip or chipset designed specifically for use in multimedia applications such as handsets, displays, etc.
total search17330 articles
2012-07-05 Toumaz acquires fabless DAB radio chip firm
Ultralow power wireless technologies pioneer Toumaz Ltd intends to raise about $46 million before expenses to put toward the purchase of Frontier through a placing of 285.6 million shares.
2005-02-10 Toshiba, SanDisk to enable 8Gbit of storage on a chip
Toshiba Corp. and SanDisk Corp. on Monday (Feb. 7) announced an 8Gb NAND flash memory chip fabricated with 70nm process technology.
2007-07-27 Toshiba, NEC, Fujitsu mull next-gen chip alliance
Japanese semiconductor makers Toshiba, NEC Electronics and Fujitsu are looking to jointly develop ultra-fine ICs, the Associated Press reported.
2008-05-15 Toshiba, MasterCard partner on contactless chip module
MasterCard Worldwide and Toshiba have partnered to deliver the MasterCard PayPass-enabled chip module, a contactless payment feature deployed globally by MasterCard.
2016-01-25 Toshiba to sell chip business except NAND
The company will consolidate its investment and business operations on flash memory and nuclear energy businesses, and has now positioned them as the two pillars to carry the company's future.
2003-05-22 Toshiba single-chip RF/IF receivers eye wireless apps
Toshiba Corp. has broadened its wireless product lineup with the introduction of the TA31275FN and TA31273FN devices for short-range, low-power wireless applications.
2015-12-01 Toshiba plans to sell part of chip business to raise capital
Observers say there is a deal to be done between Toshiba and China's state-controlled Tsinghua Unigroup, which has made an unsuccessful informal bid of $23 billion to Micron Technology.
2003-07-23 Toshiba notebook to be powered by Nvidia chip
Toshiba's Computer Systems Group has selected Nvidia Corp.'s GeForce FX Go5200 GPU for its latest Satellite P25-S607 notebook.
2002-05-02 Toshiba chip package is 30 percent smaller
Toshiba Corp. has announced that it has developed a stacked multi-chip package (MCP) that measures 7-by-10mm30 percent smaller than the company's current MCPs that measure 9-by-12mm.
2004-01-26 Torex chip has 300kHz oscillation frequency
The XC9303 series from Torex USA Corp. is a highly efficient, synchronous PWM, PWM/PFM switching step-up and down dc/dc controller IC.
2007-02-23 Top OEMs drive global chip sales
Ten of the largest OEMs consumed a third of all semiconductors purchased in 2006, according to early results from a recent study by Gartner Inc.
2004-02-02 Toolset eyes process test-chip design
Silicon Canvas released a platform for process test-chip development that is designed to help foundries create test chips to verify, optimize and calibrate silicon processes.
2009-05-07 Tool simplifies on-chip interconnect design
EDA vendor Sonics Inc. has rolled out a new tool to ease the job of building on-chip interconnects using the ARM Amba bus.
2003-12-10 Tool set eyes process test-chip design
Silicon Canvas Inc. will release a platform for process test-chip development that the company calls the first commercial product of its kind. The Laker T1 platform is designed to help foundries and integrated device manufacturers create test chips to verify, optimize and calibrate new silicon processes.
2006-11-16 Tool makes ADI chip evaluation easier
Analog Devices Inc. has developed a Web-based evaluation tool for direct digital synthesis (DDS) ICs sold by the company.
2006-12-14 Tokyo university, Taiwan firms develop 512-core chip
The University of Tokyo recently finished up work on a 512 core chip in collaboration with Taiwan Semiconductor Manufacturing Co. and Alchip Technologies, a fabless ASIC company also from Taiwan.
2001-05-15 TMS320C6000 expansion bus interface to PCI bus through PLX PCI9080 bridge chip
This application note describes how to interface Texas Instruments' TMS320C6000 DSP expansion bus to the PCI bus using the PCI9080 bridge chip from PLX Technologies.
2002-11-05 Timing delay chip targets high-frequency clock apps
The MC100EP196 ECL programmable delay chip operates at frequencies >1.2GHz and offers delay timings between 2.2ns to 12.2ns in 10ps units.
2004-04-16 Tight DSP and NP integration produces enhanced VoIP chip solutions
This technical paper discusses how VoIP has altered the landscape of telecommunications by adding a new level of intelligence to networks.
2005-09-30 TI's Templeton dismisses alliances with other chip vendors
Texas Instruments' boss is betting the company's future on the strength of its advanced CMOS process technology and analog expertise rather than seeking alliances with other chip vendors.
2005-11-25 TI's single chip A-GPS solution delivers low BoM, small size
Texas Instruments introduced what it touts as the industry's first single-chip assisted global positioning system (A-GPS) solution in 90nm process technology for mobile phones.
2006-10-06 TI unveils 'highest-power' single-chip Class D amp stage
TI says its TAS5261 is the industry's highest power single-chip Class D amplifier stage, delivering more than 300W into a 4-ohm speaker (or 220W into 6 ohms, 125W into 8 ohms) for AV and DVD receivers and home theater systems.
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below.
2007-04-05 TI taps Indian university for R&D, chip innovation
Although the prospect of setting up a manufacturing facility is far from his plans in India, Texas Instruments CEO Rich Templeton is certainly excited about the Indian semiconductor policy that was announced a few weeks ago.
2007-05-14 TI takes single-chip cellphone offerings to 65nm
Seeking to stay one step ahead of its competitors, TI will be shipping single-chip cellphone offerings manufactured in the 65nm process.
2004-10-18 TI sharpens decoder chip for high-end displays
The TVP5160 chip translates analog video signals and deploys image improvement features for high-end DVD recorders and TVs.
2005-06-29 TI rolls LDOs in chip scale package
Texas Instruments Inc. (TI) announced a series of 200mA low-dropout linear regulators (LDOs) in a 1.5-by-1mm chip scale package, which is said to be 80 percent smaller than today's SOT-23 devices.
2004-11-12 TI rolls 90nm Bluetooth chip for mobiles
Texas Instruments announced that it has developed a single-chip 90nm Bluetooth radio for 2.5G and 3G mobile phone architectures.
2005-10-07 TI power conversion chip targets OMAP-based mobile handsets
Texas Instruments has unveiled a power conversion IC that supports power supply requirements for OMAP-based mobile handsets and XScale-based multimedia devices.
2004-06-18 TI outlines new options for chip scaling
Texas Instruments Inc. (TI) revealed that its semiconductor research teams have developed cost effective techniques to lower chip power consumption, and a new approach to increase overall performance.
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