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| 2004-11-16 | Wireless chip-to-chip link shows promise Proximity Communication is an implementation of such a scalable I/O technology that uses the lithographic pitch of on-chip wires. |
| 2010-07-01 | USB hub cuts chip-to-chip link power consumption SMSC offers the USB4640, a combination two-port USB 2.0 hub and flash media reader controller that links to a host processor via a patented low-power version of USB 2.0 called HSIC. |
| 2004-11-01 | Options emerge for 10Gbps chip-to-chip interfaces When selecting a chip-to-chip interface, consider factors such as size, power, latency and the number of required package signal balls. |
| 2005-02-16 | Latency analysis of major chip-to-chip interconnects Compare and contrast the latency experienced by transactions carried over several of the leading chip-to-chip interconnect standards. |
| 2011-07-28 | Intel, Samsung, others license chip-to-chip spec Intel, Samsung and other mobile vendors have licensed the Chip-to-Chip Link specification which was developed by Arteris and Texas Instruments. |
| 2003-04-16 | Too many specifications confuse server design There seem to be more "industry-standard" technologies available than ever before for connecting together server sub-systems, but many of these technologies overlap. |
| 2003-12-16 | Rambus to purchase Velio assets Rambus Inc., a developer of chip-to-chip interface products and services, has entered into an agreement with Velio Communications Inc. to acquire certain Velio signaling assets. |
| 2011-05-06 | MIPI, USB 3.0 promoters collaborate on mobile chip interface Designed for next-gen mobile silicon, the Superspeed Inter-Chip spec unites MIPI Alliance's M-PHY spec with USB 3.0's media access controller and higher layer software. |
| 2016-04-01 | Marvell to use SerDes technology for multi-die products The Glasswing chip-to-chip technology from Swiss startup, Kandou, is based on the Chord signaling method, which produces an energy efficiency that enables architectural innovation. |
| 2004-11-01 | Inside the HyperTransport 2.0 Interface Get to know the evolution of HyperTransport as a useful interconnect technology in simplifying board-level designs. |
| 2007-01-30 | Sun acquires patent for Polychip's computing tech Sun Microsystems Inc. has acquired the patent rights for Polychip's capacitive coupling technology for direct chip-to-chip computer interconnect without wires. |
| 2002-07-16 | Speeding up internal data pipe connection The emerging 10Gbps specification promises to solve some tricky design headaches, particularly in chip-to-chip and interboard communications. |
| 2003-07-28 | Rambus XDR memory to run Cypress clock generators Rambus Inc., a provider of chip-to-chip interface products and services, has selected Cypress Semiconductor Corp. to provide XDR clock generators (XCGs) for its next generation XDR memory systems. |
| 2007-04-02 | New tech pares down I/O power draw Rambus Inc. and a group of leading academics have set a high-water mark in bringing fast chip-to-chip links into the era of low-power design. |
| 2012-08-27 | Interconnects enter Intel, ARM server battle Recent developments in interconnect technology could prove useful for various chip-to-chip uses such as high-speed networking and future stable memory interfaces. |
| 2005-10-13 | Interconnect standards set to flourish, says In-Stat Three emerging chip-to-chip interconnect standards—HyperTransport, PCI Express, and RapidIO—are being included in integrated circuits and systems at an increasing rate and their use will grow over the next several years according to market research company In-Stat. |
| 2009-02-16 | Intel ventures into optical interconnects Intel Corp. is looking into optical interconnects with an eye toward replacing chip-to-chip electrical interconnects to overcome looming bandwidth issues as microprocessors with an increasing number of cores usher in the era of tera-scale computing. |
| 2014-11-27 | How to achieve 200-400GE network buffer speeds Know how a serial chip-to-chip protocol, with 200-400 GE data rates and 4.5 B read/write transactions, can be used to eliminate throughput bottlenecks at the processor/external DDR memory interface. |
| 2008-08-20 | Group boosts viability of PCIe standard The HyperTransport Consortium speeds up to boost both its chip-to-chip interconnect as well as a board-to-board version that has yet to gain market traction. This is in relation to PCI-SIG's next big leap in defining the PCIe 3.0 standard. |
| 2012-10-25 | Fujitsu unveils ultra-high-speed short-reach data transmission The company demonstrated the transmission of more than 100Gb/s of data over a single CEI-28G-VSR channel, quadrupling the data rate throughput defined by the OIF for the chip-to-chip electrical interface. |
| 2003-01-16 | Denali ready to expand into chip I/O market Denali Software Inc. has taken what is has learned in building memory subsystems and applies it to chip-to-chip interfaces, backplanes, and other communications protocols. |
| 2005-11-17 | Altera announces new lightweight serial interconnect protocol Altera released SerialLite II, a lightweight serial interconnect protocol for chip-to-chip, board-to-board and backplane applications. |
| 2009-02-06 | Agilent rolls million-bit-per-minute SI simulator Agilent Technologies Inc. has developed a million-bit-per-minute SI Channel Simulator for multigigabit chip-to-chip data link design. |
| 2015-07-06 | 400GbE paves the way for PAM4 modulation scheme The 400GbE project includes electrical interfaces to address chip-to-chip and chip-to-module applications for 100-metre multimode fibre (MMF), 500m single-mode fibre (SMF), 2km SMF and 10km SMF. |
| 2004-03-19 | 'Over the top' routing boosts PCB speeds A new approach to PCB routing can boost chip-to-chip interconnect speeds to 20Gbps, dramatically speeding system performance, according to Joe Fjelstad, founder of technology startup SiliconPipe. |
| 2006-11-23 | Zarlink unrolls AMC optical extender for Serial RapidIO Zarlink has introduced an optical extender card for Serial RapidIO that delivers up to 25Gbps of ATCA and microTCA system interconnect in a hot pluggable, standard AMC form factor. |
| 2002-11-22 | Xilinx packs more I/O into its FPGA line Xilinx Inc. has upgraded its top-selling FPGA line by packing in more I/O pins and logic resources. |
| 2005-06-08 | Xilinx displays Virtex-II Pro FPGA based platform at SUPERCOMM At the SUPERCOMM 2005 communications conference programmable logic provider Xilinx Inc. has demonstrated its 10Gbps enabled packet processing solution, developed with CorEdge Networks and Yamaichi Electronics |
| 2011-05-24 | Xilinx buys Sarance Technologies, expands comms portfolio Xilinx Inc. has announced its acquisition of Sarance Technologies. The move completes Xilinx's technology portfolio for line card applications by adding connectivity communications capabilities. |
| 2003-07-15 | Xilinx architecture offers to 10.3125Gbps per channel Xilinx has unveiled its Virtex-II Pro X architecture and RocketPHY family of 10Gbps CMOS physical layer transceivers. |
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