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2002-04-23 TDK chip inductors have 40 percent less dc resistance
The MLZ2012 series of multilayer chip inductors from TDK Corp. has a dc resistance ranging from 0.12 ohms to 0.4 ohms40 percent lower than that of the company's previous products.
2003-10-08 CoEv Magnetics inductors, chokes suit SMPS apps
CoEv Magnetics, a unit of Tyco Electronics, has announced its SMT series of surface-mount inductors and chokes.
2005-07-20 Transceiver acts as low-cost, low component count CAN repeater
AMIS' CAN transceiver IC provides the interface between two physical CAN lines, allowing the device to act as a low-cost and low component count CAN repeater.
2005-08-08 Taiyo Yuden debuts industry first 100nH chip inductor in 0201 package
Taiyo Yuden unveiled two significant performance improvements with the launch of its expanding series of high-frequency multi-layer chip inductors
2012-04-11 Resistive RAM based on silicon dioxide
Researchers have developed a resistive-switching memory device based on silicon dioxide that shows a simpler material structure compared to those using metal-oxide films.
2005-07-12 Reference design boosts green chargers
Power Integrations' 3W charger reference design, the DI-84, consumes <30mW of no-load power, which easily meets the requirements of the California Energy Commission, whose no-load standard is 0.5W.
2007-01-03 PFC control IC implements interleaved operation
Renesas Technology America has announced a critical-mode PFC control IC for AC/DC power supplies, said to be the first device of its type to implement interleaved operation.
2008-06-03 LSI integrates embedded FRAM, EMI protection
Fujitsu Microelectronics Ltd has expanded its product line of spread-spectrum clock generators with the MB88R157 that provides countermeasures against EMI on high-frequency clock signals.
2004-06-15 Lambda switcher claims no compromises
Lambda touts its NV-Power series as a no-compromise solution to power, size, efficiency and acoustic-noise issues.
2015-04-30 Ensuring EMC-compliance of USB applications
Although the connectors used in daily life may seem robust, those who develop USB applications must still not neglect protection of their interface. Here are guidelines on developing EMC-compliant designs.
2014-09-02 Enable low-cost isoSPI coupling for battery systems
By using an AC-coupling method, we can eliminate the double insulation requirement, and therefore mitigate the cost impact of high voltage isoSPI systems.
2011-11-18 Dealing with internal noise in touchscreens
Learn about the impact of charger and display noise on touchscreens, and what can be done about it.
2008-06-24 Converters with an active front end
This application note offers two different application examples of active front end converters to show what filter solutions for such converters might look like.
2015-05-14 Connecting passive components to logic gates
By adding a few passive components, you can make circuits such as level converters, frequency multipliers, phase detectors, line drivers, and pulse changers.
2011-05-20 Ballast IC offers standard, low-cost power circuitry
STMicroelectronics unveils the L6520, a ballast controller capable of reducing design time and costs and fulfills 'Energy Star' energy-saving regulations.
2004-07-07 AMI CAN transceiver offers 3.3V or 5V logic
AMI Semiconductor has expanded its family of CAN ICs with a high-speed CAN transceiver that combines true 3.3V or 5V logic interfaces.
2003-04-24 AMI 1Mbaud CAN transceiver eyes vehicular apps
AMI Semiconductor's AMIS-X660 high-speed CAN transceiver provides differential transmit/receive capability between the bus and the CAN protocol controller.
2013-11-12 3D IC success hinges on major foundries
3D chip stack technology is real and has users, but not high-volume ones, according to a panel of experts.
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