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2008-10-31 Ziptronix heralds 3-D chip stacking technique
Ziptronix unveiled details of its patented Direct Bond Interconnect (DBI) technology, which employs a low-temperature process for 3-D chip stacking without thermal compression
2016-02-02 World's fastest CMOS wireless transceiver at 56Gbit/s
Tokyo Institute of Technology and Fujitsu Laboratories created a CMOS wireless transceiver that can process signals at high speeds with little loss across a range of frequencies, from 72GHz to 100GHz
2005-07-15 Wisair rolls out first UWB-based wireless USB baseband chip
Wisair has released the first multiband OFDM-compliant baseband chip for wireless USB based on the WiMedia specification
2007-08-02 Wisair fields single chip for belated wireless USB spec
A startup is announcing a single-chip device for wireless USB interconnects at a time when the standard continues to face delays coming to market
2005-09-28 UWB PHY device combines RF, BB components in single chip
Realtek Semiconductor announced it is entering the UWB market with the RTL8170, a highly integrated, high performance UWB PHY solution based on the WiMedia Alliance PHY specification.
2010-11-29 UCSD demos silicon photonic pulse compressors on CMOS
Researchers at the University of California at San Diego (UCSD) demonstrated silicon photonic pulse compressors were demonstrated on CMOS chips recently
2006-08-21 Researchers focus on integrating MEMS unto CMOS
The world's first microelectromechanical systems directly integrated onto a CMOS chip is the aim of a new joint effort among U.S. laboratories, industry and academia.
2004-03-29 Power Integrations expands dc-dc chip line for PoE apps
The IEEE approved the 802.3af standard for power over standard Ethernet cables in June last year.
2004-05-14 Philips claims new 90nm chip is 'right-first-time
Philips Semiconductors has achieved what it claims is right-first-time silicon at its 90nm CMOS production lines in France and Taiwan
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die
2003-03-05 Micron breaks mega-pixel barrier with CMOS image sensor
Micron Technology Inc. launched its most significant salvo yet against the charged coupled device (CCD) camp, introducing its first mega-pixel CMOS image sensor
2013-01-29 Kotura taps CMOS foundry for 100G photonics chips
Kotura is in the early stages of the R&D process with its unnamed CMOS foundry partner and will be ready to sample its product by late 2013
2007-06-15 InGaP HBT vs. CMOS for mobile handset power amps
Selecting the right type of PA is one of the key decisions that can help achieve a compelling design that delivers a competitive advantage.
2010-05-27 IMEC China signs 65nm CMOS deal with Huali
IMEC China has signed a joint development project on advanced chip process technology with semiconductor company Huali
2015-03-02 imec announces WDM hybrid CMOS silicon photonics transceiver
The SiPh chip, fabricated on imec's 25Gb/s Silicon Photonics Platform, includes an array of four compact 25Gb/s ring modulators, coupled to a common bus waveguide to allow WDM transmission
2016-02-15 How to prevent latchup in CMOS chips
Latchup becomes a real problem when you try to power up and down different sections of your design to save power. Find out how to address this issue.
2016-04-25 Guard against latchup in CMOS chips
Find out how to deal with latchup, which becomes a real problem when you try to power up and down different sections of your design to save power.
2005-10-31 GSM/GPRS monolithic radio integrates complete phone on one chip
Silicon Laboratories' AeroFONE Si4905 integrates a power management unit, battery interface and charging circuitry, digital baseband, analog baseband and a quad-band RF transceiver in a 12-by-12mm package.
2006-07-31 Dispersion chip warms up new 10GbE form factor
Quake Technologies Inc. may be the first signal-conditioning company to bypass an XFP module solution completely in favor of SFP+.
2006-04-03 Digital MEMS mic put on single chip
Microelectromechanical systems are the best possible successor to analog electret technologies; but so far, analog MEMS microphones have been largely relegated to a single market: hearing aids.
2006-12-19 CMOS imager chips enable true machine vision
New CMOS imager chips are emerging that directly sense depth3D pixel-by-pixelenabling machine vision to realize its goal of perceiving objects, and reacting appropriately
2008-04-08 CMOS harmonic oscillator eliminates quartz crystals
Mobius Microsystems Inc. has unveiled its CMOS Harmonic Oscillator (CHO) technology that eliminates the need for quartz crystals in many applications. By integrating an oscillator onto an ordinary CMOS chip, the company claims to have removed the last moving part from electronics circuitry.
2003-01-20 CMOS chip suits multichannel RF
A single-chip CMOS RF transceiver is available from Chipcon AS for narrowband and multichannel applications.
2006-06-09 CMOS chip provides twice the functionality in half the space
ZMD's new CMOS chip incorporates two of the company's ZMD31010 sensor signal conditioners into one SSOP14 package to provide twice the functionality in less than half the real estate.
2011-05-26 ClariPhy's 40G coherent chip now sampling
Based on its own ADC and DSP technology, ClariPhy's single CMOS chip dissipates about 16W and uses the coherent technique, which treats light like a radio wave, and uses phase and amplitude information.
2005-04-20 Chinese startup preps CMOS RF chip, with VC support
A Shanghai-based communications start-up is slowly unveiling its plan to ride China's large and rapidly growing market for wireless devices.
2006-10-30 China ministry funds Spreadtrum's CMOS project
The Electronic Development Fund of the Ministry of Information Industry of China publicized recently that it would provides funding for a core CMOS Chip and another project of Shanghai-based Spreadtrum Communications Co. Ltd.
2006-11-09 Broadcom Wi-Fi chip provides full Layer 3 routing
Broadcom Corp. has introduced an 802.11g Wi-Fi chip that integrates its 54g radio and a MAC block with an Ethernet switch and a MIPS processor, providing full Layer 3 routing
2002-02-05 Agilent CMOS chip integrates 36 serdes channels
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2014-05-08 3D chip-making technique utilises metallisation layers
The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs
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