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2002-04-26 Nippon Steel, ThyssenKrupp forge electrical steel collaboration
Nippon Steel Corp., ThyssenKrupp Steel AG, and ThyssenKrupp Electrical Steel GmbH have signed an electrical steel collaboration agreement to further expand their more than thirty years of technical alliance into a broader and more comprehensive collaboration in the field of grain oriented and non grain oriented electrical steel.
2004-04-12 Microsoft, Sun Microsystems form technology collaboration
Microsoft Corp. and Sun Microsystems Inc. have entered into a broad technology collaboration arrangement to enable their products to work better together and to settle all pending litigation between the two companies
2011-01-13 TSMC, Centrosolar ink solar module agreement
TSMC has firmed up plans to venture into solar and LED manufacturing by signing a contract with Centrosolar that makes the German company its exclusive European manufacturer of crystalline solar products.
2010-07-22 TSMC, ARM agree on long-term collaboration
TSMC and ARM signed a long-term strategic agreement to achieve optimized Systems-On-Chip (SoCs
2014-06-06 Synopsys joins in ST-Samsung FD-SOI collaboration
The extension of the collaboration facilitates the provision of Synopsys' Galaxy design flow for ST's 28nm FD-SOI technology, the adoption of which is expected to be accelerated
2003-09-18 STMicroelectronics inks IC development agreement
STMicroelectronics has signed an agreement with Alien Technology Corp. to collaborate on the development and manufacturing of ICs for RFID tags
2009-11-19 ST, NXP ink Mifare license agreement
The ST-NXP licensing agreement gives operators and vendors widened availability of contactless smart card ICs
2006-09-08 Spansion, Saifun extend flash memory agreement
Spansion and Saifun have extended its product design agreement, wherein Saifun will provide engineering support for the development of MirrorBit Quad products based on Spansion's MirrorBit technology
2005-08-30 SoC collaboration network signs agreement with CSIP
Design and Reuse (D&R), a global collaboration network for sharing system-on-chip (SoC) design resources, said Friday that it has formed a partnership with China Software and Integrated Circuit Platform (CSIP
2008-11-26 SiliconBlue, Magma bolster tech collaboration
SiliconBlue Technologies has formalized a technical partnership with Magma Design Automation.
2005-11-03 Samsung inks codec agreement with Vimio
Ireland-based Vimio plc, a developer of mobile content distribution software, has signed an agreement to license its audio and video codecs to Samsung Electronics Co. Ltd for use in mobile phones
2012-05-30 Renesas, TSMC detail MCU platform collaboration
The new MCU platform integrates Renesas' 40nm embedded flash (eFlash) technology with TSMC's CMOS logic and analog IPs.
2006-08-31 Qimonda, Winbond extend DRAM agreement
Qimonda and Winbond have signed an agreement to expand their existing cooperation on the production of standard memory chips
2004-03-12 Philips, IMEC renew agreement on research collaboration
Royal Philips Electronics NV has signed an agreement to provide its researchers inside and outside the semiconductor division with access to research facilities and expertise at the Interuniversities MicroElectronics Center (IMEC) through to 2008
2011-03-03 NXP, ARM expand MCU collaboration
Under the strategic licensing agreement, NXP and ARM will work to develop future MCU cores, focusing on areas such as performance and energy efficiency
2005-11-23 Nu Horizons and Midcom announce global distribution agreement
Midcom Inc. and Nu Horizons Electronics Corp. announced a partnership agreement throughout the Americas and Asia-Pacific. This agreement is effective immediately and involves the distribution of Midcom's complete line of transformer and inductor products
2011-06-24 Nokia, Accenture settle Symbian agreement
Nokia and Accenture have already finalized their outsourcing agreement on Symbian software development andÿsupport services. More than 2,000 Nokia employees will transfer to Accenture this year
2005-02-15 Nokia signs licensing agreement with Macromedia
Nokia and Macromedia have announced a licensing agreement that will integrate Macromedia's Flash technology into Nokia's Series 60 Platform
2007-06-11 Microsoft, LGE ink patent-licensing agreement
Microsoft Corp. and LG Electronics have entered into a patent cross-license agreement to further the development of the companies' current and future product lines
2007-09-21 Microsoft, Cadence enter cross-license patent agreement
Microsoft and Cadence Design Systems have established a cross-licensing agreement which enables both companies to foster further innovation in areas of common interest
2002-01-02 Micronic expands SLM licensing agreement with German group
Micronic Laser Systems AB has expanded its cooperation with Fraunhofer Institute for Microelectronic Circuits and Systems (IMS).
2009-06-05 IMEC, TSMC expand research collaboration
IMEC has signed a new and expanded research agreement with foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. TSMC will also base its extended European research efforts at the IMEC premises
2006-09-11 Fujitsu, Hopling ink WiMAX SoC agreement
Fujitsu and Hopling Technologies have signed an MoU on the mutual goal of enabling faster and smoother integration of the WiMAX baseband SoC into a Linux-based wireless equipment environment.
2003-06-18 Ericsson, Telecom Italia extend collaboration
Ericsson has signed a LoI with Telecom Italia Group to further extend the commercial relationship regarding the supply of mobile comms solutions.
2006-04-06 EMC, Intel ink OEM agreement for SMBs
EMC and Intel announced a multi-year storage OEM and expanded technology agreement focused on the growing storage requirements of small- and medium-sized businesses
2003-05-26 Elpida, ProMOS ink technology alliance agreement
Elpida Memory and ProMOS Technologies have signed a MOU regarding the technology transfer and joint development of next-gen DRAM processes.
2009-03-11 Collaboration to deliver enterprise 10GbE adapters
Chelsio Communications Inc. and IBM Corp. have agreed to develop high-speed Ethernet connectivity solutions for networking applications. This agreement is expected to accelerate the development and industry availability of 10GbE adapters and ASIC solutions enabling the next-generation I/O designs targeted at the enterprise
2011-07-14 Collaboration focuses on IC process tech R&D
GlobalFoundries has decided to join forces with Intermolecular on semiconductor technology R&D to address integration challenges and transfer IP-protected solutions into high-volume manufacturing.
2007-10-24 Collaboration by Elpida, UMC to boost low-k, PRAM
Japan's Elpida Memory has formed a joint development program with Taiwan's UMC for copper low-k and PRAM.
2008-04-04 Chartered-IBM collaboration moves to 22nm node
Chartered Semiconductor Manufacturing and IBM have expanded its joint development collaboration with IBM to include 22nm bulk CMOS technology
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