Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > collaboration agreement

collaboration agreement Search results

?
?
total search455 articles
2003-01-27 Toshiba, MKE collaborate for 1.8-inch HDD production
Toshiba Corp. and Matsushita Kotobuki Electronics Ind. Ltd have collaborated in the production of 1.8-inch and 2.5-inch HDDs.
2004-04-13 Toshiba rolls out first 4Gb single-die MLC NAND flash unit
Toshiba has disclosed that it has introduced the semiconductor industry's first 4Gb single-die, multi-level cell, NAND flash memory.
2005-11-10 Toshiba and NEC team up on 45nm system LSI
Toshiba Corp. and NEC Electronics Corp. have announced that they have agreed to collaborate on the development of CMOS logic process technology for the 45nm generation
2003-12-09 TI, STMicro offer modular CDMA 1x chipset
Texas Instruments and STMicroelectronics have jointly announced an open, modular cdma2000 1x chipset that they believe will drive innovation and differentiation in what has to date been a relatively closed market dominated by Qualcomm.
2004-07-15 TI, DoCoMo to codevelop 3G handset chips
Texas Instruments Inc. (TI) and NTT DoCoMo Inc. will jointly develop a cost-competitive, multimode UMTS (W-CDMA/GSM/GPRS) chipset to serve the worldwide 3G handset market.
2002-09-11 TI seeks embedded OS, FPGA partners
Texas Instruments Inc. is forming an alliance with WindRiver Systems Inc. and may seek to join forces with some FPGA vendors.
2008-07-31 Three giants collaborate on cloud computing
HP, Intel Corp. and Yahoo! Inc. have announced the creation of a global, multidata center, open source test bed for the advancement of cloud computing research and education.
2014-08-06 Things unsaid about the new Fujitsu-Panasonic Co.
The announcement last week revealed a few details of the new fabless chip companyincluding its CEO, its ratio of voting rights, and the number of employees.
2006-07-17 They're not the Valleyand that's the point
Silicon Valley is no longer the end of the rainbow for companies in search of R&D talent, advanced research opportunities, submicron-process expertise or applications development prowess.
2014-07-10 The semiconductor future according to tech bigwigs, Part 1
The industry is constantly evolving, forging a new path each time, and it is the semiconductor analysts and tech leaders who can indicate the path being taken.
2015-01-21 Team up expedites large-size, inkjet OLED TV time-to-market
Kateeva developed a novel inkjet printing equipment for OLED mass production and allows Sumitomo to pair its inks with Kateeva's YIELDjet platform to help speed uptake of affordable OLED TVs.
2016-01-26 TDK teams up with Qualcomm to form $3B RF joint venture
RF360 Holdings will acquire the filter and module design and manufacturing assets, plus related patents, owned by TDK, with certain assets being acquired directly by Qualcomm affiliates.
2005-03-14 Taiwan, India a good fit to lead in SOCs, says report
India's software and chip design expertise and Taiwan's manufacturing prowess are a natural fit that should allow the combination to lead the world in digital ICs for consumer electronics according to a NetIndia123 report, quoting executives speaking in Bangalore, India.
2007-01-01 Taiwan eyes better displays, comms
Last year, the trend in the electronic industry was integration. This year, Taiwan focuses on communication and consumer electronics.
2015-06-01 Synopsys to buy Quotium's app security testing biz
The Quotium Seeker complements the Coverity platform's static analysis technology by testing and analysing applications, providing customers with a solution to detect and remediate security issues.
2009-11-11 Suntech, Huadian build solar plant in Jiangsu
Suntech will develop a 10MW solar power plant in Dongtai, Jiangsu Province in conjunction with partner Huadian New Energy.
2002-12-04 Sunplus adopts Oridus Web solution
Oridus Inc. has entered into a licensing contract with Taiwan-based Sunplus Technology Co. Ltd.
2009-02-13 Still dreaming of a plug-and-play IP
Users continue to bemoan the dearth of standards and effective quality metrics that they say would help greatly in confidently selecting IP.
2012-07-20 Startups merge to form high-performance analog chip company
RedMere and Fresco have recently announced their merger which will form Spectra 7 Microsystems.
2010-06-23 ST, Tsinghua University expand R&D partnership
ST will provide the Tsinghua University with digital multimedia and advanced analog chips, expert support and advanced design tools, and jointly cooperate on applications engineering projects.
2014-05-16 ST finds FD-SOI partner in Samsung
Samsung will work with ST's 28nm FD-SOI design platform, making its foundry services accessible to the broader semiconductor industry. The companies hope their partnership will encourage designers to adopt the process.
2005-09-20 Sprint, Samsung to explore wireless broadband
Sprint and Samsung Telecommunications America have agreed to engage in joint wireless broadband technology efforts to test the IEEE 802.16e standard and drive the development of advanced wireless broadband services.
2009-06-25 SpringSoft, TSMC co-develop multi-node PDKs
Joint multi-node process design kit portfolio development is started by SpringSoft and TSMC.
2006-05-11 Spansion licenses Discretix CryptoFlash
Spansion has licensed the Discretix CryptoFlash security technology to enable secure Flash memory solutions.
2006-02-03 South Korea's T-DMB to debut in India
South Korea said it will begin trials this month of a homegrown terrestrial digital multimedia broadcasting system in India.
2009-12-16 Soitec breaks into solar with Concentrix acquisition
Soitec will leverage its expertise in engineered substrates to improve solar cell performance to meet the growing need of renewable energy.
2015-02-09 SK Hynix, Toshiba join forces for nanoimprint lithography
The companies inked a joint development deal that will allow them to successfully develop NIL by minimising risk and move up commercialisation of this technology.
2013-10-31 SK Hynix turns to BeSang for 3D IC tech
SK Hynix has licensed BeSang's 3D IC process that uses a low-temperature process to build multi-layer 3D integrated circuits one layer at a time using traditional vias.
2010-06-21 Singapore, South Korea ink e-government MOU
The Republic of Singapore and the Republic of Korea have signed a MOU on e-government cooperation to promote infocomm technology between the two countries.
2011-06-03 Singapore's A*STAR to develop 16Kbit RRAM
The development of a 16Kbit RRAM prototype and memory controller is being pursued under a strategic partnership between A*STAR's Data Storage Institute (DSI) in Singapore and 4DS Inc.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top