Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > collaboration agreement

collaboration agreement Search results

?
?
total search455 articles
2004-08-10 ANI enters into R&D agreement with Alps
Applied Nanotech has entered into a research and development agreement with Alps Engineering, a Japanese equipment manufacturer, to expand the usage of current equipment designed and produced by Alps Engineering to various nanotechnology applications
2003-01-17 AMD, M-Systems expand development agreement
AMD and M-Systems have expanded their agreement to jointly develop a customer-specific suite of hardware and software solutions targeted for mobile data storage products
2002-09-11 Verification company in Japan formed thru collaboration
Tokyo Electron Ltd, Ebara Corp., and Dainippon Screen Mfg. Co. Ltd have entered into a memorandum of agreement to form a joint venture company, tentatively named E-Beam Corp
2014-06-09 Motion control collaboration opens up robotics, automation
The collaboration between XMOS and Synapticon involves joint development and marketing initiatives for the uptake of motion control technologies in areas including robotics and smart factories
2009-06-17 Man Yue, Tsinghua U extend capacitor collaboration
Man Yue International Holdings Ltd has signed a second five-year cooperative agreement with the Research Institute of Tsinghua University in Shenzhen on aluminum electrolytic capacitors and energy storage devices
2003-11-18 Keithley, Zyvex sign marketing collaboration
Keithley Instruments and Zyvex have signed an agreement to work together to develop new solutions for the nanotech marketplace
2011-05-27 IMEC extends 3D research agreement with Qualcomm
IMEC and Qualcomm will continue to be partners in researching for and designing advanced technologies related to 3D technology.
2003-07-22 Collaboration to offer hardware, software in Europe
ABB Ltd and Daifuku Co. Ltd has entered into an alliance that targets the materials handling business in the Scandinavian market.
2002-10-30 Collaboration to improve IC design chain connectivity
Synchronicity Inc. and The Virtual Component Exchange have signed a new joint marketing agreement aimed at better connecting semiconductor IP vendors to their customers and end users
2002-12-17 Collaboration to co-develop ICs for space computers
Honeywell Int. has signed an agreement with Cypress Semiconductor Corp. to jointly develop a new technology for ICs used in satellites, strategic missiles, and other space vehicles
2009-03-26 Collaboration aims to dig into organic TFT
Novaled AG and Holst Centre will collaborate under a joint development agreement to investigate the feasibility and benefits of Novaled's dopants in Holst Centre's organic TFT (OTFT) technologies qualified for displays and circuits
2004-12-08 Cambridge Broadband, Gemtek announce WiFi collaboration
Cambridge Broadband and Gemtek Systems are working together to enable broadband wireless operators to add carrier-grade WiFi to their service portfolio.
2011-05-30 NVIDIA joins IMEC's advanced CMOS scaling program
NVIDIA signed a 3-year research collaboration agreement with IMEC's advanced CMOS scaling program, enabling it to get insight about future design technology options on its next-generation products.
2008-02-05 Nokia Siemens, Ubiquisys enable 3G at home with femtocells
A collaboration agreement to provide mobile network operators with femtocell solutions that offer high-quality 3G services at home has been signed by Nokia Siemens Networks and Ubiquisys.
2008-08-04 Intel to power Facebook data center infrastructure
Facebook and Intel Corp. have partnered to optimize social networking site's hardware and software as it builds out its data center infrastructure.
2007-07-26 IBM, ST collaborate on next-gen process tech
STMicroelectronics and IBM have entered into an agreement to collaborate on the development of next-generation semiconductor process technology
2007-10-10 Alcatel-Lucent, Sagem co-develop femtocell base stations
Alcatel-Lucent and Sagem have partnered to develop a femtocell base station platform that enables mobile operators to provide consumers and enterprises with 3G UMTS/HSPA network coverage.
2009-10-22 Xilinx adopts ARM processors, interconnect tech
Xilinx and ARM are collaborating to enable ARM processor and interconnect technology on Xilinx FPGAs.
2008-08-14 Unidym, Samsung extend carbon nanotube partnership
Unidym Inc. and South Korea's Samsung Electronics have extended their joint development agreement for another year
2011-04-18 Teradyne, JTAG team up for boundary scan solution
Teradyne Inc. is collaborating with JTAG Technologies to design a boundary scan test option for manufacturers.
2007-11-28 Taiwan's Gintech to supply solar cells to Canadian firm
Canadian Solar has signed an annual solar cell supply contract with Taiwan's Gintech Energy.
2006-06-20 Spansion, Data I/O collaborate for automated flash memory programming
Data I/O and Spansion announced a collaboration to advance the use of automated flash memory programming in the production of wireless, consumer and automotive markets
2006-10-31 Soitec, ARM team on SOI devt program
Soitec announced that they have entered into a joint-development agreement with ARM to support the future development of SOI libraries for the fabless/foundry arenas
2012-08-15 Sharp-Foxconn deal stands in shaky ground
The agreement between the Taiwan contract manufacturer and the Japanese LCD maker has received both criticism and praise, but serious issues surround the deal
2006-06-06 Renesas, Powerchip broaden relationship on flash memory
Renesas and Powerchip have signed a manufacturing agreement and a technology and sales licensing agreement pertaining to Renesas' 4Gbit AG-AND flash memory devices
2008-11-06 Renesas, NXP partner to drive MIFARE contactless services
NXP Semiconductors and Renesas Technology Corp. have expanded the licensing agreement on NXP's MIFARE technology aimed to build momentum for the availability of advanced payment and NFC offerings in contactless infrastructures
2008-04-25 Rambus, Spansion collaborate on next-gen flash
Rambus and Spansion have entered into a collaboration for DDR engineering services and future development of MirrorBit flash memory solutions
2007-09-05 Osram, Seoul Semi ink cross-licensing deal
Osram has granted Seoul Semiconductors license to manufacture and sell white LEDs with conversion technology using patents owned by OSRAM Opto Semiconductors.
2007-11-07 Nokia, ST finalize 3G chipset deal
Nokia and ST have finalized their agreement to deepen their collaboration on the licensing and supply of IC designs and modem technologies for 3G and its evolution.
2011-10-27 Malaysia, U.K. team up on tech research
The collaboration sets off a bilateral research agreement focusing on nuclear energy, research commercialization and nanotechnology.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top