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2007-05-31 Macronix, Qimonda to partner on flash development
Macronix International and Qimonda have reportedly agreed to collaborate on the development of flash technology, a Digitimes report says.
2008-09-19 LDK, Q-Cells cooperate on solar-grade silicon processing
LDK Solar Co. Ltd has signed an 11-year processing service agreement to process upgraded metallurgical grade solar-grade silicon provided by Germany-based Q-Cells AG into wafers
2002-09-16 Intel, VeriSign to increase security for notebooks
Intel Corp. and VeriSign Inc. have partnered to improve wireless security for corporate notebooks based on Intel's upcoming Banias processor.
2009-03-04 Intel, TSMC to collaborate on Atom
Intel Corp. and Taiwan Semiconductor Co. Ltd have announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure and SoC solutions.
2009-03-25 Infineon, Bosch to collaborate on power ICs
Infineon Technologies AG and Robert Bosch GmbH are widening their cooperation to include power semiconductors.
2008-10-07 IMEC, TNSC co-develop green LED manufacturing tech
IMEC and Taiyo Nippon Sanso Corp. (TNSC) have signed an agreement to jointly develop manufacturing technology for high efficiency LED devices
2008-03-12 IBM, Hitachi forge joint 32nm chip research
IBM and Hitachi have signed a two-year joint semiconductor metrology research agreement to speed the pace of semiconductor innovation
2007-12-06 IBM, ATMI collaborate on implanted photoresists
A joint development agreement to demonstrate advanced chemical formulations for highly implanted photoresist strip applications has been forged between ATMI, Inc. and IBM Corp
2008-01-25 Honeywell, industry group collaborate on flexible electronics
An agreement to develop materials to prevent short circuits for flexible electronics has been forged between Honeywell International and the U.S. Display Consortium
2013-06-10 GEO, Eyevis close licensing deal for eWARP tech
Eyevis received certain license rights for GEO's patented distortion and warping correction technologies for use in its projection products.
2009-08-31 Fujitsu, TSMC collaborate on 28nm process
Fujitsu Microelectronics' 28nm logic ICs will be produced using TSMC's advanced technology platform.
2011-06-24 Freescale collaborates with three companies
Freescale has signed collaboration deals with Spansion, Wind River, and QNX. The deals include a memory module and advanced software solutions for embedded systems
2007-12-06 China, Finland ally on nanotech research
The Finnish National Nanotechnology Initiative and the China International Nanotech Innovation Cluster have signed an agreement that aims to foster nanotech research and put Sino-Finnish nanotech products onto the market by 2010
2009-10-23 Cadence, ARM co-develop next-gen SoC design flow
Cadence and ARM will combine their technologies to create a next-generation SoC design flow.
2004-06-22 Cadence offers PCB design data management
Cadence Design Systems announced that it is entering the collaborative design and library data management market.
2007-10-31 Atmel, ASTRI collaborate on MCU-based SoC solutions
Atmel and Hong Kong's ASTRI will join forces bringing together Atmel's CAP customizable ARM microcontroller and ASTRI's design expertise, IP blocks and software.
2010-06-22 TSMC invests in solar PV manufacturer
TSMC and Stion, a manufacturer of high-efficiency thin-film solar photovoltaic modules, have entered technology licensing, supply and joint development agreements.
2007-09-14 Novell-Microsoft Linux lab begins operation
Despite the controversies that erupted over their announced partnership, Microsoft and Novell announced that their joint interoperability lab is not open for business.
2011-02-08 Enea, Timesys to collaborate on multicore, Linux tools
Enea and Timesys Corp. are collaborating to accelerate the adoption of Linux in both standalone and heterogeneous multicore applications.
2009-06-02 UNESCO, Sun Micro team to drive open source tech
UNESCO and Sun Microsystems have signed a collaboration agreement that recognizes open source technologies as key to increase access to information, communication technologies and information and communication technologies skills training in under-served communities throughout the world.
2009-06-03 Trio to work on N-type solar cells
Yingli Green Energy Holding Co. Ltd, the Energy Research Centre of the Netherlands (ECN) and Amtech Systems Inc. have announced a three-party research collaboration agreement to develop next generation high efficiency solar cells.
2009-05-08 Trio to co-develop NAND controllers
Hynix Semiconductor Inc, Numonyx B.V. and Phison Electronics Corp. have signed a collaboration agreement to jointly develop controllers for the next generation of managed-NAND solutions based on the newly released JEDEC eMMC 4.4 industry specification.
2009-12-24 Solar Energy, ITRI Taiwan ink PV deal
Solar Energy Initiatives and the ITRI Taiwan have entered a business and technical collaboration agreement to build, integrate, test and commercialize solar products and solutions.
2009-12-23 RoodMicrotec, X-FAB collaborate online
Rood Testhouse International NV (RoodMicrotec) has signed a collaboration agreement with foundry company X-FAB .
2013-01-30 Qualcomm, Imec team up on CMOS advancement
Geared to accelerate scaling technologies for logic and memory devices, the organisations extended their collaboration in charting roadmaps for next-generation products
2010-05-25 Mentor, NetLogic team on multicore for Linux
Mentor and NetLogic have entered a collaborative agreement under which Mentor will provide its Linux technology on NetLogic's XLP, XLR and XLS multicore, multithreaded processors
2006-06-29 IME, SiOptical to develop fab tech with Chartered
The Institute of Microelectronics and SiOptical Inc. signed a research collaboration agreement to jointly develop fabrication technology for silicon-based photonics and circuits.
2007-12-14 Firms unite to deliver CMMB solutions for China's mobile DTV
Siano Mobile Silicon has entered a collaboration deal with China Mobile Broadcasting Satellite and Beijing Huaqi Information Digital Technology to provide advanced solutions for the CMMB standard based on STiMi, starting at the 2008 Olympics
2004-12-10 Ceva, SRS jointly market WOW XT on DSP cores
Ceva has signed a new strategic collaboration agreement with SRS Labs Inc. to market and deliver SRS audio and voice technologies to Ceva's DSP licensees.
2002-11-07 Cellport names Magna Donnelly as newest licensee
Cellport Systems has entered into a worldwide technology licensing, engineering and marketing collaboration agreement with Magna Donnelly Corp.
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