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2002-01-23 ARM, Faraday extend relationship into SoC design
ARM Ltd and Faraday Technology have extended their relationship with a licensing and collaboration agreement for the ARMv4 architecture.
2010-06-07 Apollo, CECS ink solar partnership
Apollo Solar Energy has entered into a non-binding collaboration agreement with China Energy Conservation Solar Energy Technologies (CECS) to build scaled thin-film solar energy power stations.
2005-02-24 Alcatel, Microsoft to collaborate on IP television
Alcatel and Microsoft Corp. announced Tuesday (Feb. 22) a global collaboration agreement to accelerate the availability of Internet Protocol Television (IPTV) services for broadband operators worldwide.
2003-10-30 Zyray, Infineon extend partnership on wireless solutions
Zyray Wireless has extended their relationship with Infineon Technologies, building upon a prior collaboration to provide a dual mode handset solution
2005-05-11 Zoran to acquire demodulator IC provider
Zoran Corp. has signed a definitive agreement to acquire Israel-based Oren Semiconductor, a provider of demodulator ICs for HD TV market
2007-06-29 Winbond, Qimonda extend memory production deal
Winbond Electronics and Qimonda AG have signed an agreement to further expand their existing cooperation for the production of memory chips
2006-04-11 Wi-Fi Alliance, CTIA partner in converged Wi-Fi/mobile phones
The Wireless Association announced a partnership agreement to develop and promote certification programs for converged Wi-Fi/mobile handsets
2006-07-06 Universal Display, Mitsubishi Chemical partner on OLED display R&D
Universal Display has signed an agreement with Mitsubishi Chemical Corp. and Mitsubishi Chemical Group Science and Technology Research Center on the R&D of phosphorescent OLED displays accessible to ink-jet printing
2003-01-22 UMC extends licensing deal with Numerical Tech
United Microelectronics Corp. has extended its phase-shifting technology licensing agreement with Numerical Technologies Inc. as UMC migrates to the 90nm process-generation
2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.
2004-10-19 TSMC, Freescale to develop 65nm SOI technology
Taiwan Semiconductor Mfg Co. (TSMC) and Freescale Semiconductor Inc. have signed an agreement to jointly develop a next-generation silicon-on-insulator (SOI) transistor front-end technology targeted for the 65nm advanced CMOS process node
2010-03-04 TowerJazz helps boost Korea IC design
TowerJazz has signed an agreement with Korea's IC Design Education Center (IDEC) to accelerate the country's specialty IC design expertise
2009-02-17 Tower, Triune to collaborate on power management platform
Tower Semiconductor Ltd and Triune Systems LLC have announced an agreement to collaborate on developing what they claim as the "most complete" power management platform in the industry
2004-01-28 Toshiba, Sonics team in SMART interconnect IP products
Toshiba Corp. and Sonics Inc. have expanded their business relationship with a joint technology collaboration
2007-12-20 Toshiba, IBM extend R&D partnership to 32nm
IBM and Toshiba Corp. have extended their collaboration by entering into a joint development agreement on 32nm CMOS process technology.
2006-05-18 Toshiba, ARC collaborate on configurable processor
Toshiba and ARC have entered into a strategic collaboration intended to grow the worldwide semiconductor industry's adoption of configurable technology
2008-06-23 Toppan, IBM extend photomask partnership to 22nm
Toppan Printing Co. Ltd and IBM Corp. have entered a new development agreement on the last phase of 32nm and all phases of 22nm photomask process development
2008-04-07 TI, India medical school team on health care monitoring
Texas Instruments Inc. has entered a collaborative agreement with Indian Institute of Technology Kharagpur, to develop semiconductor technologies that will help improve the quality, comfort and accessibility of health care
2008-12-17 TerreStar, Qualcomm collaborate on comms tech
TerreStar Networks Inc. has inked an agreement with Qualcomm Inc. to develop integrated satellite-cellular communications technologies for conventional-sized mobile devices designed for government, public safety, enterprise and consumer users
2003-11-21 Team-up focuses on photolithography processes
ASML Holding NV and Dainippon Screen Mfg Co. Ltd have entered into an agreement to develop seamless litho-clustering methods
2008-05-02 SUSS, Philips cooperate on new imprint litho tech
SUSS MicroTec has entered a license agreement with Philips Research for a new enabling technology called Substrate Conformal Imprint Lithography
2008-11-07 Sun fuels multicore design in Europe
Sun Microsystems Inc. and Europractice announced a three-year collaboration to promote OpenSPARC Chip Multithreading technology as a reference design among 650 universities and research institutions across 38 countries in the European region
2007-07-03 ST, French tech org team on mini energy sources
STMicroelectronics and CEA, a French public technological research organization, have signed an agreement to collaborate on the development of new miniaturized energy sources
2007-07-09 ST touch sensors use ATLabs capacitive technology
STMicroelectronics unveils a new family of ultralow-power touch-sensor chips, following the signing of a technology-licensing agreement with the Korea's ATLab Inc
2011-05-31 SPTS, Griffith University to develop SiC-on-Si wafers
A joint agreement has been forged between SPTS and Griffith University for the commercial development of SiC-on-silicon wafers as viable semiconductor material for LED, power and MEMS devices
2005-08-15 Spansion seeks TSMC manufacturing capabilities
Spansion LLC and Taiwan Semiconductor Mfg Co. (TSMC) have signed a manufacturing agreement that will augment Spansion's internal production of its 110nm MirrorBit technology
2008-01-31 South Korea partners with NASA on satellite R&D
The Ames Research Center of NASA has agreed to work with South Korea's Institute of Science and Technology to explore possibilities for collaboration on small satellite research and development
2003-06-19 Sony, SanDisk move closer on Memory Stick
Sony Corp. and SanDisk Corp. announced an expanded cross licensing agreement that will make SanDisk the first full partner in Sony's Memory Stick business
2004-05-11 Sony, Nichia agree on laser diode cross-license patents
Sony Corp. has forged an agreement with Nichia Corp. on the cross licensing of their blue-violet laser diodes used in rewritable optical memory discs
2010-05-05 Sony, IPWireless partner on 4G R&D
Sony Corp. of America and IPWireless have signed an agreement to jointly research and develop wireless technologies for 4G and beyond
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