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2014-11-26 Soitec, SK team up to innovate semiconductor materials
Although the first phase of the agreement targets semiconductor materials development, the alliance could be extended to include manufacturing and commercial development
2003-12-29 SMIC, Elpida sign deal for DRAM production in China
Semiconductor Mfg Int. Corp. (SMIC) and Elpida Corp. have signed a five-year foundry agreement under which SMIC will produce Elpida's 0.10?m DRAM products at its 300mm fabrication facility in China
2013-05-08 Shikino, A*STAR to develop gyro-sensor ASIC IP block
The research agreement will see the development of a low power and high performance gyro-sensor ASIC IP block for commercial hand held applications
2002-11-14 Semtech grants Richardson international distribution rights
Semtech Corp. has expanded its distribution agreement with Richardson Electronics
2003-07-08 SAP, Sharp to deliver mobile solutions for business apps
SAP AG and Sharp Corp. have signed an agreement for the joint technology development and marketing of mobile solutions for corporate users
2007-04-23 Samsung, Microsoft ink patent licensing pact
Samsung Electronics and Microsoft have entered into a broad patent cross licensing agreement to accelerate their respective product development efforts
2010-01-22 Samsung to pay Rambus $900M settlement
Samsung Electronics and Rambus have reached an agreement that settles all the claims between the two companies
2003-05-09 SAIT partners with Millennium Cell on fuel cell systems
Samsung Advanced Institute of Technology and Millennium Cell Inc. have formed a cooperative development agreement to advance fuel cell powered portable computers and communications devices
2010-03-03 RFMD, SELEX extend GaAs MMIC partnership
SELEX Galileo and RFMD have extended of their collaboration to develop high-frequency GaAs MMIC solutions focused on SELEX's electronically-scanned phased array radar systems
2005-04-19 Rambus, NEC ink memory controller patent license deal
Rambus Inc. has signed a patent license agreement with NEC Electronics Corp. that follows the development and manufacture of memory controllers based on various Rambus innovations
2013-06-20 Rambus settles with ST, signs IP deal
Agreement covers FDSOI design, security, memory and interface technologies and settles all outstanding claims
2002-12-09 QUALCOMM, China Unicom forge joint venture
QUALCOMM Inc. and China Unicom, a major wireless service provider in China, have signed an agreement to create a joint venture aimed to foster the growth of the developer community
2006-10-16 Qimonda hands 80nm DRAM tech to Winbond
Qimonda and Winbond Electronics have extended their DRAM manufacturing partnership. The new agreement calls for Qimondato transfer its 80nm DRAM trench technology to Winbond's 300mm facility in Taichung, Taiwan
2007-08-09 ProMOS licenses color filter tech for CIS production
ProMOS Technologies has signed a technology license agreement with Toppan Printing to manufacture CMOS image sensors using Toppan Printing's on-chip color filters and micro lens technologies
2003-02-13 PLX, Rambus partner on PCI Express technology
PLX Technology Inc. and Rambus Inc. have inked a collaboration and licensing agreement for advanced PCI Express I/O technology.
2002-02-27 Plexus inks licensing, services deal with Tessera
Plexus Corp. and Tessera Technologies Inc. have signed a licensing and services agreement under which Plexus will utilize Tessera's CSP and multichip packaging solutions to develop and manufacture miniaturized electronic devices
2005-06-20 Philips, TI team on EPC Gen 2 RFID deployment
Semiconductor suppliers Royal Philips Electronics and Texas Instruments Inc. have announced an agreement to cooperate on conformance testing for the technical interpretation of the EPCglobal Electronic Product Code Generation 2 RFID standard
2012-08-15 Philips, Daintree focus on ZigBee for wireless lighting tech
According to Daintree, the collaboration will generate a full complement of ZigBee-based products, as well as best-of-breed technologies from both companies
2004-05-14 Philips' CoolFlux DSP to be distributed in Synopsys' DesignWare Library
Synopsys Inc. and Royal Philips Electronics have announced a collaboration that gives designers access to Philips' ultra-low power CoolFlux DSP core through Synopsys' DesignWare Star IP program
2008-12-15 Peugeot, Bosch team up for diesel hybrid tech
PSA Peugeot Citro?n and Robert Bosch GmbH have signed an agreement to team up for diesel hybrid technology. The partnership agreement calls for Bosch to co-develop, industrialize and supply electric motors and power electronics for PSA Peugeot Citro?n's four-wheel-drive diesel hybrid powertrain
2006-04-11 Panasonic, Square Enix to hasten "ubiquitous network era"
Panasonic and Square Enix announced an agreement to co-develop a solution that will provide seamless content applications for digital consumer electronic devices
2006-12-08 Oki, Huawei partner on mobile WiMAX in Japan
Oki Electric Industry Co. Ltd and Huawei Technologies Co. disclsoed an agreement to collaborate in the mobile WiMAX business to the telecom carriers in Japan
2003-10-20 Novellus Systems co-establishes research center in China
Novellus Systems Inc. has signed a partnership agreement with Fudan University of Shanghai to establish a semiconductor technology research center
2003-06-03 NEC, PCI partner on computing environment solution
NEC Corp. has entered into a comprehensive OEM agreement with PCI, in which NEC will offer Platform Computing's software on its IA Server Express5800 Series
2005-10-27 NEC and Unisys to collaborate on delivering solutions
NEC Corp. and Unisys Corp. have signed a memorandum of understanding to create a partnership for joint R&D, manufacturing and solutions delivery. The collaboration will focus on server technology, software, integrated solutions and services
2007-12-19 Navteq joins Wavefront as founding member
Navteq has signed an agreement to become a founding member of Wavefront, a non-profit organization in British Columbia that provides test and commercialization services to developers of mobile applications
2002-12-11 Nanosys, Matsushita to develop nano-based solar cells
Nanosys Inc. and Matsushita Electric Works Ltd have entered into a collaborative agreement for the development of nanotechnology-based solar cells for the Asian building materials market
2006-07-31 Motorola, Huawei create new UMTS venture
Motorola and Huawei Technologies announced a new collaboration to bring an enhanced and extensive portfolio of UMTS and HSPA infrastructure equipment to customers worldwide
2005-07-14 Motorola, Freescale band together on 3G technology
Motorola and Freescale signed a multi-year agreement to develop new platforms for third-generation universal mobile telecommunications system technologies to be used on products reaching the mass market through 2008
2003-01-08 Micronetics, Yokogawa to offer complete test solution
Micronetics Inc. has entered into an OEM agreement with Yokogawa Corp. of America to sell the latter's wideband demodulator and vector signal generator test equipment
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