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2004-09-20 Micron, ASML MaskTools to work on lithography
Micron Technology Inc. has formed a multi-year collaborative agreement with ASML MaskTools, a business unit of ASML Holding NV, to enhance the capability of lithography tools, Micron said
2005-03-14 Metrowerks, Xoreax to speed-up console game development
An exclusive agreement between Freescale Semiconductor's Metrowerks organization and Xoreax Software promises faster game development to run on console gaming platforms from Sony Computer Entertainment and Nintendo
2005-02-28 Mentor Graphics, USG to simplify electromechanical development process
Mentor Graphics and UGS signed a joint cooperation agreement to deliver tight interoperability between their products, which provide solutions to meet the emerging needs of complex electromechanical platforms such as automobiles, airplanes and trains
2004-10-29 Magma, LogicVision deliver integrated RTL-to-GDSII flow
Magma Design Automation Inc. and LogicVision Inc. have reached an agreement under which the companies will deliver complete interoperability between LogicVision's icBIST and Magma's Blast Create and Blast Fusion products
2004-09-10 M-Systems, SanDisk to promote next-gen USB flash drives
M-Systems and SanDisk Corp. have signed a strategic collaboration and patent cross-license agreement to jointly develop and promote the next-generation USB flash drive platform.
2005-01-06 LSI Logic, Gemstar partner in TV guide on screen design platform
LSI Logic Corp. and Gemstar-TV Guide Int. Inc. have signed a multiyear agreement under which they will develop a reference design platform for TV guide on screen, Gemstar-TV Guide's interactive program guide (IPG) for consumer electronics that is built directly into CE products
2008-11-06 LG, Microsoft join forces on mobile convergence
LG Electronics Inc. and Microsoft Corp. have signed of memorandum of understanding (MoU) to form strategic collaboration in mobile convergence
2013-11-15 Kyocera, Telenor Connexion partner to expand M2M offerings
The M2M supply agreement targets international markets that include car telematics, smart metering, telemetry, e-health and security applications
2004-08-12 Japan's TEL selected for European 'gate-stack' project
Chip equipment vendor Tokyo Electron Ltd (TEL) has signed an agreement with France's CEA LETI (Laboratory of Electronics and Information Technologies) to develop a CMOS gate stack that includes a high-k insulator and metal gate materials and deposition steps for 45nm and lower manufacturing process nodes
2004-11-04 Japan chip makers build LCD venture
Toshiba Corp., Matsushita Electric Ind. Co. Ltd, Hitachi Ltd, and Hitachi Displays Ltd, a wholly-owned subsidiary of Hitachi, have signed a joint venture agreement that would manufacture and sell LCD panels for flat panel TV receivers
2002-10-22 ISE Labs, MuAnalysis to provide test platforms in Canada
ISE Labs Inc. and MuAnalysis Inc. have signed an agreement to combine the latter's analytical expertise with ISE's testing capabilities in order to provide comprehensive analytical IC testing services to the Canadian semiconductor industry
2013-04-19 Intermolecular enters IP licensing deal with Micron
Focused on technology development and related IP for advanced memory technologies, the firms' collaboration will involve development activities at Intermolecular's R&D centre in San Jose
2007-08-02 Intel, SiRF to bring GPS to mobile devices
Intel and SiRF Technology have entered into a license and joint development agreement to bring GPS capability to mobile devices
2008-06-11 Intel, Rosnanotech collaborate on sub-45nm research
Intel Corp.'s Craig Barrett has signed an agreement with Rosnanotech, Russia's state nanotechnology organization, for co-development in several areas including sub-45nm ICs
2014-03-31 Intel, Cloudera get data centre tech boost
The collaboration between Intel and Cloudera is targeted at smart data mining for insights that inform businesses, as well as accelerating Hadoop data platform adoption
2005-05-27 Intel, Alcatel collaborate on AdvancedTCA platforms for mobile solutions
Intel Corp. and Alcatel have signed an agreement to improve time to market of Advanced Telecom Computing Architecture (AdvancedTCA) platforms for mobile service providers
2008-11-04 Intel's Moblin to spur Taiwan's mobile market
Intel has signed an agreement with the Taiwan Ministry of Economic Affairs to jointly establish an enabling center for Moblin, open source software and applications optimized for Intel Atom processor-based devices
2007-08-08 Intel taps Synopsys as EDA supplier
Intel Corp. has selected Synopsys Inc. as its primary EDA supplier and signed a multi-year technology agreement under which they will closely collaborate on advanced design flows
2015-06-03 Intel Keynote: Wireless everywhere
Intel's message yesterday at the Computex Taipei was mainly around "wireless," from wireless charging to collaboration to Atom-based mobile devices powerful enough for gaming
2009-03-09 Intel invests in high-performance computing R&D
Intel Corp. is investing in a new academic research facility dedicated to high-performance computing (HPC) in France, marking the start of a five-year collaboration and is the company's first major investment in academic research in France
2009-11-24 Infineon, ARM forge license deal on security apps
Infineon Technologies AG and ARM have entered a long-term strategic collaboration in the field of security microcontrollers for chip card and security applications
2003-07-04 Infineon gains inside track in German IT initiative
Infineon Tech has signed an agreement with the German Federal Ministry of the Interior (Bundesministerium des Inneren) for close cooperation on IT security
2012-03-15 Imec, Riber continue team up on next-gen III-V CMOS
Through the collaboration with Riber, Imec can integrate the power of UHV-systems into state-of-the-art semiconductors production equipment on large diameter wafers
2003-10-22 IMEC, EVG partner on packaging, bonding techniques
Inter-university MicroElectronics Center (IMEC) and EV Group (EVG) have signed a joint development agreement on wafer-level packaging and MEMS wafer bonding
2011-10-13 Imec, ASML deal offers advanced litho tech
The five-year collaboration will allow ASML to install its 193nm immersion lithography tool at Imec, speeding up its work on EUV lithography
2010-05-31 Imagination licenses GPU core to Renesas, TI
Imagination Technologies has signed a multi-use license agreement with Renesas Electronics and Texas Instruments for Imagination's POWERVR SGX Series5XT multi-processor core
2002-04-04 IBM, Sony and Toshiba to co-develop advanced chip processes
In a deal that will move SOI and other advanced semiconductor process technologies into cost-sensitive consumer electronics ICs, IBM, Sony Corp., Sony Computer Entertainment Inc. and Toshiba have signed a four-year process technology development agreement
2015-04-24 Huawei, NXP get ready for Industry 4.0
The partnership will fully integrate Huawei's ICT infrastructure and connectivity solutions and NXP's secure connectivity solutions. Collaboration will focus on Industry 4.0 applications
2004-03-04 Honeywell, Synopsys forge ASIC development pact
Honeywell Int. and Synopsys Inc. have signed an agreement to jointly develop a design infrastructure to support the creation of radiation-hardened and radiation-tolerant ASICs
2005-12-22 Hoku Scientific, Sanyo ink fuel cell testing pact
Hoku Scientific, a developer of membrane electrode assemblies and non-fluorinated membranes, has entered into a testing agreement with Sanyo Electric
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