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2009-08-11 HKSTP, IBM ink PowerPC IP core tie-up
Hong Kong Science and Technology Parks Corp. (HKSTP) and IBM Corp. have signed an agreement to make the latter's PowerPC SoC IP available through HKSTP's new Secure Virtual IP Chamber
2005-02-09 Hitachi, Matsushita to collaborate on PDPs
The reshuffling of order in the flat-panel display industry continued Monday (Feb. 7) with Japanese companies Matsushita and Hitachi agreeing to form a comprehensive collaboration on plasma display panels
2003-08-15 Hitachi, HP extend high-end disk array partnership
Hitachi Ltd and Hewlett-Packard Co. (HP) have extended their joint technology agreement for the foundation hardware used by HP to develop the HP StorageWorks Disk Array XP family
2007-12-27 Hitachi, Canon, Matsushita forge LCD tech alliance
Hitachi, Canon and Matsushita announced Dec. 24 that they have reached a basic agreement on a comprehensive alliance aimed at reinforcing and growing the LCD panel businesses and technologies
2011-07-04 Harris, Tektronix strengthen alliance in military apps dev't
Harris and Tektronix are strengthening their collaboration in military apps development to improve their product offerings for the defense industry
2003-07-29 Harris enters R&D deal with the University of Florida
Harris Corp. has approved a research development agreement with the University of Florida's College of Engineering
2008-06-06 Global Mobile, NextWave launch WiMAX trial in Taiwan
Taiwan WiMAX operator Global Mobile Corp. and NextWave Wireless Inc. have entered a joint technology collaboration to make end-to-end mobile WiMAX solutions a reality for the global market
2002-11-15 Fujitsu, Toshiba extend partnership to SoC IP
Partners Fujitsu Ltd and Toshiba Corp. plan to extend their semiconductor collaboration to include SoC technology
2003-01-31 Fujitsu, AU Optronics forge strategic LCD partnership
Fujitsu Ltd and its subsidiary Fujitsu Display Technologies Corp. have entered a memorandum of agreement with AU Optronics Corp
2003-05-08 Fujitsu sells interest in Kanda Tsushin
Fujitsu Ltd has reached an agreement with Privee Zurich Turnaround Co. Ltd regarding the planned sale of all of Fujitsu's 8,017,000 shares in Kanda Tsushin Kogyo Co. Ltd to Privee Zurich Turnaround
2002-02-05 Fonix, parvus to boost speech apps for embedded systems
Fonix Corp. and parvus Corp. have signed a collaborative agreement to promote mutual opportunities for implementing voice recognition technologies in embedded computer systems
2009-04-24 Firms to deliver design, test services in Japan
LogicVision Inc., Toppan Ltd and Syswave Corp. have signed a three-way agreement for turn-key design and test services in Japan
2004-09-13 Figure 8, Freescale announce Z-stack partnership
Figure 8 Wireless Inc. has reached a partnership agreement to provide Freescale Semiconductor the Z-stack software for their ZigBee-ready platform
2010-02-03 Farnell, On Semi fortify distribution partnership
Premier Farnell and ON Semiconductor are expanding their existing distribution agreement of the latter's products and solutions to India, Australia and New Zealand with no minimum order requirement (MOQ
2010-12-08 European, Australian certifying bodies sign MoU
An agreement between the IEC, ILAC and IAF renders a single reassessment sufficient and accepted by all three bodies
2002-03-25 ERSO, TSMC to jointly develop MRAM technology
The Electronics Research and Service Organization of the Industrial Technology Research Institute and Taiwan Semiconductor Mfg. Co. Ltd have signed a joint R&D agreement for magnetoresistive random access memory technology
2002-04-05 eMagin signs investment deal with ROHM
OLED developer eMagin Corp. has entered into a strategic investment agreement with Japan's electronic component manufacturer ROHM Co. Ltd
2010-11-08 Elpida, Intermolecular grow R&D partnership
Elpida Memory Inc. has signed another R&D agreement with research partner Intermolecular Inc. focusing on manufacturing process integration in the 30nm to 40nm nodes
2003-10-27 Elcoteq, Siemens sign manufacturing pact
Elcoteq Network Corp. and the networks division of Siemens Mobile have signed an agreement under which Elcoteq will provide EMS for products that are part of Siemens' GSM basestations
2003-01-27 Duraswitch, UTEK announce alliance for tech transfer
Duraswitch Ind. Inc. and UTEK Corp. have entered a strategic alliance agreement
2002-12-13 DuPont, UDC to co-develop next-gen displays
DuPont Displays and Universal Display Corp. have entered a joint development agreement to create a new-generation of soluble OLED materials and technology
2009-11-17 Dow, Caltech tie up on photovoltaic R&D
Dow and Caltech enter a four-year research agreement that will initially focus on less expensive and more available direct band gap materials
2008-08-12 Dolby boosts multimedia features of LG handsets
LG Electronics and Dolby Laboratories Inc. have signed an agreement that grants LG a license to embed Dolby Mobile technology into its handsets
2002-07-08 Dialog Semiconductor, Bosch codevelop CMOS technology
Dialog Semiconductor has signed an agreement with Bosch to develop high-voltage options for CMOS technology for automotive apps
2005-06-15 Design chips the Intel way; on Centrino, says Intel
Intel Corp., IBM Corp. and Synopsys Inc. have announced a collaboration to bring EDA tools onto Centrino-based wireless LAN capable mobile computers, aimed at increasing the productivity and flexibility of design engineers
2002-12-10 CSR, BlueGiga partner for Bluetooth product development
CSR and BlueGiga have signed a non-exclusive partnership agreement
2014-08-29 Cree, Lextar join hands in $83M supply deal
Lextar and Cree will enter into a long-term LED chip supply partnership, as well as an agreement for certain Cree LED chip and component intellectual property
2006-10-30 Cisco to acquire mobile software developer
Cisco announced a definitive agreement to acquire privately-held company Orative Corp. which provides an application that will allow the former to extend its Unified Communications portfolio to mobile devices
2010-07-01 Cisco helps Abu Dhabi become connected Emirate
Cisco and ADSIC, the ICT arm of Abu Dhabi government, they have entered into a frame agreement to help transform Abu Dhabi into a sustainable knowledge-based connected Emirate
2008-03-12 China Digital TV, Intel to bring advanced DTV to China
A collaboration has been forged between China Digital TV Holding and Intel for the mutual development of advanced DTV products for the China market
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