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2003-11-07 Chartered Semiconductor adopts MoSys SRAM technology
Chartered Semiconductor Mfg and MoSys Inc. have entered into an agreement to qualify and offer MoSys' quad density 1T-SRAM-Q technology on Chartered's 0.13&181;m process
2005-03-09 Cadence, X-Fab to build design kits for analog, mixed-signal ICs
FAB Semiconductor Foundries AG has signed a collaborative agreement with Cadence Design Systems Inc. X-FAB will work closely with Cadence to build and deliver comprehensive design kits for analog and mixed-signal ICs targeting mainstream and advanced process technologies
2005-10-10 Cadence, UMC develop reference design for wireless
EDA supplier Cadence Design Systems Inc. and Taiwan-based semiconductor foundry UMC have announced a collaborative agreement to develop a comprehensive reference solution for complex wireless designs
2010-05-31 Cadence, IBM co-develop 32nm SOI IP
Cadence Design Systems Inc. and IBM have entered a joint development agreement to create high-performance integration-optimized IP under 32nm silicon-on-insulator (SOI
2009-09-03 Cadence, GlobalFoundries sign multiyear pact
Cadence and GlobalFoundries have entered into a multiyear software and services agreement
2006-11-15 Cadence teams with IBM to accelerate ASIC design
Cadence Design Systems has inked an agreement with IBM to incorporate Encounter RTL Compiler global synthesis and Cadence Encounter Test technologies into IBM's 65nm ASIC design kit
2013-06-26 Atmel, Sensinode reach licensing deal for 6LoWPAN software
The agreement allows Sensinode to license its 6LoWPAN stack and router solutions, the NanoStack2.0 and NanoRouter 3.0, to be used Atmel's ultra-low-power wireless hardware platforms
2007-09-10 ASE, Mitsui collaborate on HMT packaging tech
ASE and Mitsui have entered into a cross-licensing agreement and technical collaboration for Mitsui's Hybrid Manufacturing Technologies (HMT) packaging technology.
2010-04-05 Ascent Solar ventures into India market via Kirloskar
Ascent Solar entered into a multi-phase agreement with Kirloskar Integrated for the integration, marketing and distribution of its PV modules in India
2014-02-12 ARM, SMIC expands partnership for high-performance SoC designs
The collaboration will offer the ARM Artisan physical IP platform for SMIC's 28nm process to deliver high-performance, high-density and low-power technologies for consumer and mobile applications
2013-10-30 ARM, Nordic partner to speed dev't of BLE-enabled devices
The collaboration will enable developers to easily create Bluetooth-connected devices and applications that leverage Nordic's SoCs that are based on the ARM Cortex-M processor series
2012-08-15 ARM, Globalfoundries team up on 20nm, FinFET process tech
The multiyear agreement aims to jointly deliver optimized SoC solutions for ARM processor designs that extend to include GPUs, which are becoming an increasingly critical component in mobile devices
2013-09-04 ARM incorporates display processor tech from Cadence
The sale and transfer of Cadence PANTA display controller cores to ARM aims to enhance the companies' long-standing ecosystem collaboration and strengthens their technical alignment
2008-04-04 ARC, Toshiba extend partnership to multicore tech
ARC International and Toshiba have extended their collaboration to develop configurable multiprocessor technology
2008-01-30 AMIS, IMEC ink new joint project on smart power tech
AMIS has entered into a new two-year collaboration program with European research center IMEC to develop future smart power technologies
2008-08-14 AMD powers Blizzard games with Radeon graphics
Advanced Micro Devices Inc. has entered into an agreement with Blizzard Entertainment that will allow the chipmaker to bundle Blizzard's best games across all ATI Radeon graphics products
2003-01-20 Akustica, GN ReSound co-develop hearing-aid chip solutions
Akustica Inc. has entered into a joint development agreement with GN ReSound Group
2003-01-27 Akustica, GN ReSound co-develop chip solutions for next-gen hearing aids
Akustica Inc. has entered into a joint development agreement with GN ReSound Group
2004-07-20 Agilent, Lumileds to codevelop on new LED series
Agilent Technologies Inc. and Lumileds Lighting have signed an agreement to collaborate on a new series of LEDs
2004-11-08 Agilent to provide Stats Chippac with 93000 SOC system
Agilent Technologies Inc. has been selected as Stats Chippac Ltd strategic test supplier in an agreement worth up to $125 million
2008-11-20 Adobe-ARM team up boosts ARM-powered devices
Adobe Systems and ARM have announced a technology collaboration to optimize and enable Adobe Flash Player 10 and Adobe AIR for ARM-powered devices
2008-08-29 3G mobile network JV taps tech partner
Mobile Broadband Network Ltd (MBNL), the network collaboration joint-venture between T-Mobile UK and 3 UK, has selected Nokia Siemens Networks as technology partner for 3G network integration
2009-02-11 'Project Independence' to bring Xen-based client virtualization
Under an agreement with Intel Corp., Citrix Systems Inc. will produce a new class of virtualization solutions that optimize delivery of applications and desktops to Intel Core2 and Centrino 2 processor-based devices
2002-08-29 Wintegra, Tundra collaborate to shorten design cycles
Wintegra Inc. and Tundra Semiconductor have entered into an agreement to enhance the performances of Wintegra's WinPath Access Packet Processor and the Tundra PowerSpan II, a PowerPC-to-PCI bus switch
2013-01-09 Wi-Fi, WiGig Alliance to operate under one roof
The Wi-Fi Alliance and WiGig Alliance have executed a memorandum of agreement outlining their plans to consolidate activity under one group
2011-07-14 Singapore, Korea companies partner in solar cell production
Jusung Engineering and MEMC Singapore have announced their collaboration to build and operate a high-efficiency solar cell production facility
2012-10-17 Broadcom, Hyundai team up for next-gen connected car
The collaboration will integrate infotainment, telematics and Advanced Driver Assistance Systems features such as surround view parking and lane departure warning into Hyundai vehicles
2015-03-04 Why digital power calls for more standards
Read about the move to come up with common standards that will encompass mechanical, electrical, communications, monitoring and control specifications.
2012-08-06 Team up aims to develop MTM antenna for high-end WIFI
Deal endeavors to improve wireless technology for high performance networking products.
2008-05-07 T-Mobile, Nokia unite to bring social nets to mobiles
T-Mobile and Nokia have announced that they are collaborating to accelerate the availability of new Internet services and personal social communities on mobile devices.
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