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2008-06-05 ST, CEA concoct tiny fuel cell for wireless phones
Tapping miniaturized energy sources, the French Atomic Energy Agency and STMicroelectronics NV created a hydrogen fuel cell for mobile phones that is expected to reduce the use of electrical power supplies to recharge batteries.
2009-09-11 Plextronics, Novaled team up for organic light
Novaled and Plextronics will jointly develop doped and solution-processed organic materials for OLEDs
2008-02-19 Optimism stirs in mobile TV market
Calling 2007 'a rock-bottom year' for mobile TV, DiBcom CEO Yannick Levy said he is hoping that things will start to get a little better this year.
2012-06-28 Murata, Imec to work on radio ICs
Murata and Imec said they intend to assess the impact on antenna interface components and identify new opportunities for next generation front-end modules.
2007-07-26 Indian design center gets $20M in tools from Mentor
Mentor Graphics is donating a complete suite of EDA tools worth over $20 million to RV-VLSI Design Center in India for use in classroom instruction and academic research.
2010-05-27 IMEC China signs 65nm CMOS deal with Huali
IMEC China has signed a joint development project on advanced chip process technology with semiconductor company Huali.
2015-01-28 Harman acquires Red Bend, Symphony Teleca
Car audio maker Harman signs takeover agreements with car software companies Red Bend Software and Symphony Teleca to improve its offerings in the connected car market.
2012-02-01 Flight Focus, A*STAR team up on SDR-based comms system
Under the A*STAR Aerospace Program, Flight Focus and I2R will be developing a SDR-based cabin communications platform that will enable in-flight communications with different devices.
2009-07-09 Duo collaborates to push nanoimprint litho
Dai Nippon Printing and Molecular Imprints collaborate to push commercialization of nanoimprint lithography for high-volume semiconductor device manufacturing.
2007-08-02 DTS, SRS pump up VeriSilicon DSP audio muscles
VeriSilicon has revved up its DSP cores with DTS Digital Surround and DTS-HD Master audio, as well as SRS Labs' Wow HD and TurSurround HD technologies.
2007-11-28 Car safety electronics go for system-level approach
A promising market awaits those chip and EDA companies that help carmakers meet the demand for safety, comfort and infotainment using fewer MCUs by way of a system-level, whole-vehicle approach to design and electronics integration.
2010-06-21 Asia rollouts, IPTV services boost broadband subscription
Broadband subscription enjoyed an upswing during Q1, supported in part by healthy DSL growth in every region, strong fibre rollouts in Asia and aggressive IPTV service offerings.
2007-07-19 Amkor, IMEC sign 3D wafer-level packaging pact
Amkor has agreed to develop 3D integration technology with IMEC based on its wafer-level processing techniques.
2010-03-19 Zigbee, Wi-Fi groups bring wireless nets to smart grid
The Zigbee Alliance and the Wi-Fi Alliance announced are partnering to on wireless home area networks (HAN) for smart grid applications.
2010-03-11 Yingli ups 300MW monocrystalline capacity in Baoding
Yingli Green Energy Holding Co. Ltd is expanding its 300MW PANDA monocrystalline silicon-based manufacturing capacity at its Baoding headquarters.
2004-06-30 Xilinx announces distributor in Israel
Xilinx Inc. has appointed IES Electronics Agencies, a subsidiary of IES Electronics Ind Ltd, as its new distributor and technical representative.
2007-12-17 Windows Embedded CE 6.0 BSP rolls for Atmel's AT91CAP9 kits
Atmel and Adeneo have announced the availability of a Microsoft Windows Embedded CE 6.0 BSP for Atmel's AT91CAP9A-STK Starter Kit and AT91CAP9A-DK Development Kit.
2010-11-05 Wi-Fi, HomePlug seek common standards
Wi-Fi Alliance and HomePlug Powerline Alliance move to review specifications and standards toward interoperability
2009-06-26 What's in store for Intel-Nokia deal?
Nokia Corp.'s wireless chipset suppliers can rest easy. Intel Corp. is not going to be bumping anyone off the mobile handset manufacturers' supplier list anytime soon.
2006-12-22 Vivace, Huaqi partner on multimedia platforms
Vivace Semiconductor and Huaqi Information Digital Technology will co-develop high performance platform solutions for Huagi's Aigo products.
2010-04-19 Virage Logics sets sight on subsystems
Virage Logic no longer sees itself as just a provider of a collection of IP cores, instead, it's betting on becoming a supplier of 'subsystems' that can be quickly embedded in SoCs for its licensees.
2008-11-19 USB interface grabs a higher version
The commonly used USB interface has now been upgraded to ver 3.0 at a developers' conference where some companies announced product plans for the new specifications with data rates that could hit 400MBps.
2006-10-24 UMC, NDL to sponsor Taiwan nanotech research
UMC and National Nano Device Laboratories have agreed to support researchers in Taiwan's nanotechnology field with the establishment of the UMC-NDL Scholar Sponsorship Program.
2007-07-24 UMC, ATDF to bring promising new technologies to market
ATDF and UMC have collaborated to evaluate emerging-technology products and bring to market those that are most promising.
2007-06-22 Ubuntu, Red Hat reject Microsoft licensing deal
Red Hat and Ubuntu have refused to discuss with Microsoft a technology licensing deal similar to those the software maker has signed with other open source organizations.
2007-07-30 U.S., E.U. agree on common GPS-Galileo signal design
The U.S. and the EU have agreed to adopt a common civil signal design for their respective satellite navigation systems.
2009-08-25 Trio drives MEMS for aerospace, defense
Tower Semiconductor Ltd, Jazz Semiconductor Inc. and SVTC Technologies have signed an MOU that will expand Tower and Jazz's aerospace and defense (A&D) MEMS customer base.
2010-02-04 TowerJazz, Soitec join hands on backside illumination
TowerJazz and Soitec Group will develop turn-key solution for high-end backside-illuminated CMOS image sensors for industrial, medical and automotive applications.
2014-10-21 Toshiba, UTC ink deal to develop overseas manufacturing
The latest arrangement between Toshiba and UTC will centre on doubling the companies' profits by eyeing overseas manufacturing and targeting smart cities.
2007-11-29 Toshiba, NEC extend partnership to 32nm
Toshiba Corp. and NEC Electronics Corp. will collaborate on the development of a system LSI process technology for the 32nm generation.
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