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2011-05-09 Compound semiconductor dev't reflect diversification
Compound semiconductor companies are releasing new products that lead toward product diversification, according to Strategy Analytics
2005-06-20 Semiconductor technologies for power management (Part 2
Understand better why ICs and discrete transistors require very different methods of fabrication.
2014-12-17 Imec unveils 8bit MPU using complementary TFTs
Imec, Holst Centre and Evonik used a hybrid technology incorporating two types of semiconductor metal-oxide for n-type TFTs and organic molecules for p-type TFTs in a CMOS circuit operating at 2.1kHz
2005-05-10 Wi-Fi startup selects Atmel for SiGe foundry work
Fabless semiconductor company WiDeFi Inc. has selected Atmel Corp. as foundry partner for a family of 802.11 wireless LAN "repeater" chipsets implemented in silicon germanium, the company said
2009-02-04 The role of semiconductors in energy conservation
The most interesting thing is that underlying all of those technologies (and many others) are the semiconductors that provide the computational engines, the sensing and signal conditioning as well as the power conversion.
2005-11-24 TAEC power amp boosts WLAN, PHS and Bluetooth signals
Toshiba America Electronic Components released a new medium power Silicon Germanium BiCMOS power amplifier that is suitable for use in 1.9GHz to 2.5GHz band wireless apps.
2006-01-27 Snowbush rolls out new ADC IP core
Snowbush Microelectronics announced the availability of a 10bit, 140MSps ADC IP core in a foundry standard 0.18m CMOS.
2002-10-03 RF Micro, Jazz partner for silicon production
Jazz Semiconductor and RF Micro Devices Inc. have entered into an arrangement in which the latter will obtain a guaranteed, lower cost source of supply for wafers fabricated utilizing Jazz's manufacturing processes
2005-04-07 Philips, Penn State refine surface potential transistor model
Scientists from Philips Research and the Pennsylvania State University have developed a model of MOSFET behavior based on the extensive use of the surface potential measurements.
2015-03-17 Industrial semiconductors ride wave of surging economy
IHS predicted that the industrial semiconductor market will register a 9.7 per cent CAGR over the next several years as revenue increases from $34.8 billion in 2013 to $55.2 billion in 2018
2015-05-22 Industrial semicon market posts highest growth since 2010
The year-over-year increase follows solid growth of 13 per cent in 2013. The strong performance achieved last year represents the highest annual growth rate since the 36 per cent boom in 2010.
2005-10-03 Higher resolution 3.2MP image sensor targets camera phones
Toshiba America Electronic Components expanded its Dynastron CMOS image sensor product line with the addition of a new 3.2-Megapixel CMOS image sensor chip, aimed at high-end camera-enabled mobile handsets.
2015-09-23 Enable 10Gbit/s physical layer for single twisted pair
In this article, we introduce an elegant method to increase the data bandwidth in a single twisted pair (STP) cabling.
2005-12-22 Council chooses model to succeed BSIM
The Compact Model Council has selected the PSP model as the next generation industry standard CMOS transistor model, succeeding current industry standard BSIM3 and BSIM4 models.
1999-04-08 Considerations of bus termination in computing systems
This paper discusses how to use the push-down resistor to control logic levels on idle busses.
2005-04-14 Color sensor touts small size
Agilent claims to offer the industry's smallest CMOS color sensor that measures 5-by-5-by-1mm.
2005-05-12 Atmel, WiDeFi ink SiGe foundry partnership
Atmel Corp. has been chosen by fabless semiconductor company WiDeFi Inc. as its foundry partner for WiDeFi's Xtender family of 802.11 repeater chipsets
2002-09-16 AMD develops technology for transistor enhancement
AMD said that they have fabricated the smallest double-gate transistors reported to date using industry standard technology.
2003-02-04 Agilent strengthens CMOS imaging capabilities with IP acquisition
Agilent Technologies Inc. and Pixel Devices Int. Inc. have agreed for Agilent to acquire IP and other certain assets of Pixel Devices.
2006-06-14 Philips unveils next-gen LDMOS WiMAX solutions
Philips announced its next-generation LDMOS WiMAX line-up for base station solutions, which promises to deliver up to 3.8GHz over the 802.16e mobile WiMAX platform.
2013-12-06 Sony mulls Renesas fab buy to boost CMOS sensor share
Sony is considering buying a chip fab from Renesas in a plan to expand its complementary metal-oxide semiconductor (CMOS) image sensor production.
2013-09-19 Epitaxy process integrates GeSn MOSFET device on Si
KULeuven, Imec and AIST developed a solid phase epitaxy process to incorporate germanium tin metal-oxide semiconductor field-effect transistor devices on silicon
2014-11-11 TSMC envisions the next big thing
The framework for "the next big thing," according to TSMC, is being cast at advanced foundries that offer one-stop shopping for fabless innovators who want to integrate MEMS sensors and actuators alongside CMOS circuitry on the same SoC.
2006-07-12 Toshiba audio power amp gives 21W per channel
Toshiba America's first Class-D audio power amplifier IC, the TB2924FG, delivers up to 21W per channel in a heatsink-free design for audio consumer electronics applications.
2011-05-24 Test results exceed specs for new oscilloscope platform
A test done for ASICs designed in IBM's 8HP silicon germanium (SiGe) BiCMOS Specialty Foundry technology has shown promising results for a new oscilloscope platform of Tektronix Inc.
2012-12-27 Terahertz imaging chip paves way for versatile sensors
Researchers from Caltech have developed a miniature, low-cost, chip capable of terahertz imaging and scanning.
2012-04-18 Survival guide to high-speed ADC digital outputs
Learn about the key attributes of CMOS, LVDS, and CML outputs, and their performance tradeoffs.
2013-04-08 Richardson rolls out DACs for CATV from ADI
The AD9119 and AD9129 are 11/14bit RF DACs that support data rates up to 2.8GSPS and enable multi-carrier generation up to 4.2GHz.
2015-02-11 Researchers envision thermoelectric nanowires in chips
Researchers at Sandia National Labs have found a room-temperature electroforming technique that removes heat at the source and discovered methods of embedding thermoelectric nanowires into chips.
2013-10-02 Researchers demonstrate carbon nanotube powered computer
Stanford researchers hope to revitalise carbon-nanotube development efforts by surmounting its problems with a CMOS compatible process they call "imperfection-immune design".
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