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2007-10-15 Altera, TSMC extend relationship to 45nm
Building on the successful partnership on 65nm node, Altera and TSMC will extend their collaboration to produce FPGAs in the 45nm node.
2007-11-19 Agilent teams with Elektrobit on FlexRay test tools
Agilent has announced a partnership to license certain automotive-network products in Elektrobit 's FlexRay product line, creating an integrated design and test toolset for software and test engineers.
2003-06-23 Agilent launches project to aid Taiwan-based manufacturers
Agilent Technologies has received a government grant from the Taiwan MOEA to spur communications product R&D through an initiative called the Agilent Integrated Platform Service Project.
2013-07-08 Addressing memory scaling concerns
Here are some promising research and design directions to overcome challenges posed by memory scaling.
2014-11-03 Adding 'smart' to Asia's power grid
The installation of modern electronics to assist in better generation, delivery and consumption of electrical energy is picking up within the region, promising to prevent power outages, conserve energy and support green undertakings.
2007-01-24 Actel, Mentor expand OEM partnership
Mentor Graphics and Actel announced the signing of a new OEM agreement between the two companies, expanding the companies' existing technology and marketing partnership.
2005-06-01 Acer's Stan Shih plans Indo-Taiwanese JVs, report says
Stan Shih, the co-founder and chairman emeritus of The Acer Group of Taiwan, has said he plans to start multiple joint-venture companies in partnership with Indian software firms, aiming to make digital products for the home and office markets globally
2006-07-17 A glimpse inside the Cell processor
Several years ago, IBM, Toshiba and Sony took the task on creating Cell, an amazing new multiprocessor microprocessor chip that will debut later this year in Sony's PlayStation 3 video game console, Toshiba's high-end televisions and IBM's blade servers.
2016-04-19 7.3 quake shakes Japan's IC, auto industries
Japanese manufacturing giants have suspended operations after two powerful earthquakes hit Kumamoto, Japan, last week, causing widespread damage and supply chain disruptions.
2011-01-18 7 growth areas for chip industry
Accenture discusses how the chip industry can overcome its current hurdles, capitalize on the market turnaround, build momentum and achieve growth. Among the growth areas cited are end markets, sales and operational planning, innovation, talent management and global operations.
2009-06-25 3M, SUSS MicroTec advance 3D packaging
3M and SUSS MicroTec have teamed up to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3D packaging.
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