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| 2015-02-27 | Glimpse at 5G highlights role of air interface This year's ISSCC revealed a prototype 5G base station, as well as a number of 5G cellular research projects racing to a conclusion so proposals for formal standards can begin as early as next year. |
| 2003-04-30 | Futuremark expands Beta Program Futuremark Corp. has forged strategic alliances with Gateway, Transmeta Corp., ExtremeTech, and Beyond3D. |
| 2006-10-09 | Fujitsu takes back 287k batteries in FMV-Biblio, Lifebook Fujitsu said it will recall 287,000 Sony-made battery packs in its laptops as part of the voluntary replacement program that Sony announced. |
| 2012-08-17 | Fujitsu identifies U.S. market opportunities This interview with the CEO of the Japanese firm's U.S. arm details the significance of tapping resources in the region to better serve its Asian partners. |
| 2006-06-23 | FSA establishes IP trading center The Fabless Semiconductor Association signed a memorandum of understanding with three other groups to establish the Greater China Semiconductor Intellectual Property Trading Center. |
| 2008-04-30 | Freescale teams with China's Chery on car electronics Chery Automobile and Freescale Semiconductor will establish a joint automotive lab aimed at co-developing silicon, software and system-level solutions for use in Chery vehicles for China and export markets. |
| 2012-01-03 | FPGAs in the era of silicon convergence Altera continues, at 28nm and beyond, to seek process, device, and circuit innovations with their foundry partner, ensuring continued technology leadership at the silicon and circuit level. |
| 2006-09-11 | Foxconn drops iPod libel suit against Chinese journalists Foxconn has dropped its libel suit against two Chinese journalists and their newspaper for publishing a report claiming that workers at an iPod manufacturing plant were mistreated. |
| 2009-05-19 | Firms team to advance China handset market China Telecommunications Technology Labs (CTTL) and Spreadtrum Communications (Shanghai) Co. Ltd have partnered on researching new technologies and services in wireless communications and multimedia terminals to promote innovative research of new technologies and services that meet the requirements of the Chinese mobile handset market. |
| 2006-05-12 | Firms reportedly to settle DRAM pricing-fixing suit Samsung, Hynix and Infineon have reportedly agreed to pay fines totaling $160 million to resolve a class-action lawsuit alleging DRAM price fixing. |
| 2011-06-17 | FCI, Fujikura team up for IC packaging tech FlipChip International and Fujikura Ltd are collaborating in innovating advanced semiconductor packaging technology. |
| 2009-07-22 | Fab tool collaboration: Mission impossible? Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projectsjust to help the industry keep pace on Moore's Law? |
| 2004-03-26 | Experts talk about power solutions in IIC-China In a forum about embedded systems during the recent IIC-China Event, Michael Wang manager of portable device power management application from Texas Instrument, Bill Weinberg technical director from MontaVista Software, and Dr. Zhou Dongyan application's engineer from Linear Technology presented their lectures on power solutions to hundreds of participants from related groups. |
| 2009-01-12 | Execs see bright future for India IC industry India's portion of a $250 billion semiconductor market is marginal, yet for LSI Corp. president and CEO Abhi Talwakar, the nation remains firmly in the driver's seat of its own semiconductor and engineering design destiny. |
| 2003-11-20 | EV Group made strategic supplier by DALSA EV Group has been selected by Dalsa Semiconductor as the strategic supplier for MEMS wafer bonding and thick polymer lithography production equipment. |
| 2003-12-17 | Europe's Medea+ faces cash crunch Medea+, an industry-initiated pan-European program for microelectronics R&D, faces the cancellation or drastic curtailment of newly selected projects as deficit-squeezed European national governments threaten to choke off funding. |
| 2012-01-24 | ETSI rolls smart grid protocol ETSI has recently published two specifications for smart grid that will help drive the development and deployment of open, interoperable smart grid technologies internationally. |
| 2002-02-13 | ERSO develops active-matrix technology Electronics Research & Service Organization has developed an active-matrix technology for the manufacture of OLEDs. |
| 2005-08-23 | EPCOS inks sensor technology partnership EPCOS has joined the Strategic Partnership for Sensor Technology in Regensburg, Germany. |
| 2006-08-23 | EPCGlobal gaining ground as China's RFID standard The chances of success for China's national RFID standard are diminishing as the government stays flat-footed in the face of an aggressive campaign by EPCGlobal to see its standard adopted by local manufacturers, according to a recent report from ABI Research. |
| 2005-08-02 | ENEA strengthens business in Asia With the booming of cell phone and other communications devices in Asia, Sweden-based embedded software provider ENEA Embedded Technology revealed plans to expand business in the region. |
| 2012-04-02 | Elpida quandary boosts DRAM contract price DRAM contract price continued to grow in 2HMar with average 4GB DDR3 module price increasing by 2.7 percent, arriving at $19, while average 2GB price hit $10, a 2.6 percent increase. |
| 2007-10-03 | EC investigates antitrust allegations vs. Qualcomm The EC has decided to open formal antitrust proceedings against Qualcomm, over allegations that the company's licensing terms and conditions are not fair, reasonable and non-discriminatory and, therefore, may breach EC competition rules. |
| 2009-01-26 | Dongfeng, Freescale to put up auto electronics lab in China Dongfeng Motor Corp. and Freescale Semiconductor Inc. plan to establish a joint automotive electronics lab in China. The lab will be aimed at jointly developing silicon, software and system-level solutions to be used in next-generation Dongfeng Motor vehicles for the China and export markets. |
| 2014-02-20 | Differential pairs provide higher bandwidth across two wires Kandou Bus founder Amin Shokrollahi demoed a 40nm chip at the ISSCC last week, sending 12Gbit/s per wire at less than 4picojoules/bit and dispersing eight bits across eight wires. |
| 2007-11-19 | Dell, Sun Micro ink Solaris distribution deal Dell and Sun Microsystems have signed an agreement for Dell to make the Solaris OS and Solaris support services available directly to customers for select Dell PowerEdge servers. |
| 2011-06-01 | Consortium takes 3D TV to the next level The TritonZ consortium, together with EUREKA, will make a great leap forward toward 3D TV broadcasting as they develop a new 3D standard called the CoaXPress. |
| 2005-07-07 | Compal set to make, design Motorola 3G phones, says report Taiwan's Compal Electronics Inc. has received contract orders for third-generation (3G) mobile phone handsets from Motorola Inc. according to a China Economic News Service report, which cited Hsu Sheng-hsiung, chairman of the Kinpo-Compal Group, as its source. |
| 2009-07-07 | Comment: Will LTX-Credence survive ATE arena? Mark LaPedus opines on the LTX-Credence's chances of competing against ATE big shots such as Advantest, Verigy and Teradyne. |
| 2007-10-24 | Collaboration by Elpida, UMC to boost low-k, PRAM Japan's Elpida Memory has formed a joint development program with Taiwan's UMC for copper low-k and PRAM. |
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