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2007-07-05 Nokia Siemens wins lucrative network expansion deal in India
Nokia Siemens Networks and Bharti Airtel will undertake a $900-million multiplatform network expansion project in India.
2014-10-21 Toshiba, UTC ink deal to develop overseas manufacturing
The latest arrangement between Toshiba and UTC will centre on doubling the companies' profits by eyeing overseas manufacturing and targeting smart cities.
2014-10-29 SMIC, ASML ink volume purchase deal
The deal is part of a strategic partnership between the companies that will help ease the expansion of SMIC's advanced technology capacities
2007-04-03 China's IPR protection strategy: Stricter laws, global cooperation
Stricter enforcement measures and international cooperation for the protection of intellectual property rights (IPR) were the highlights of the Global Forum on Intellectual Property Rights Protection and Innovation held in Beijing last week
2010-01-18 Canadian Solar inks JV deal with Japan firm
Canadian Solar Inc. has entered a joint venture and an 18MW distribution deal with West Holding Ltd of Japan
2010-07-12 Analyst: Nokia-Renesas deal is a surprise
The move by Nokia to dispose of its wireless modem operations to Renesas has surprised Didier Scemama, head of European technology research with Royal Bank of Scotland.
2015-11-27 Abu Dhabi takes active role over GloFo deal
A Bloomberg report stated that Mubadala Development has talked with potential buyers for all or part of Globalfoundries, where it could fetch $15 billion or $20 billion if a deal goes ahead
2008-11-11 Yingli Green, Wacker Chemie extend polysilicon supply deal
Yingli Green Energy Holding Company Ltd has entered into a new long-term polysilicon supply agreement with Wacker Chemie AG.
2009-12-10 Yingli Green bags PV supply deal in Germany
The sales agreement extends the cooperation between Yingli and Payom that has been successful for the pas years
2007-06-29 Winbond, Qimonda extend memory production deal
Winbond Electronics and Qimonda AG have signed an agreement to further expand their existing cooperation for the production of memory chips
2008-07-29 Vishay, Yosun ink distribution deal
Vishay Intertechnology Inc. has signed a distribution agreement with Yosun, a major Asian distributor of electronic components.
2008-07-18 Rambus, Qimonda revise patent license deal
Rambus Inc. has signed an amendment on its current patent license agreement with Qimonda AG, the memory spin-off of Infineon Technologies Inc.
2007-08-24 Qimonda, SMIC expand DRAM foundry deal
Qimonda AG and Semiconductor Manufacturing International Corp. (SMIC) have expanded their existing cooperation on the production of standard memory chips
2008-07-15 Nokia Siemens wins China Mobile network deal
China Mobile Communications Corp. has entered into a frame agreement with Nokia Siemens Networks for its network expansion project.
2006-11-24 Microsoft inks three-year deal with Vietnam IT provider
Microsoft Corp. has signed a three-year strategic alliance with Vietnam's largest information technology provider, FPT Corp.
2010-02-03 MEMC, Conergy settle spat with supply deal
MEMC Electronic Materials and Conergy AG have reached an out of court settlement of a lawsuit related to a solar wafer supply contract between Conergy and MEMC Singapore Pte Ltd.
2008-04-28 Macronix, Qimonda scrap flash development deal
Macronix has announced that the termination of its Jan. 3 agreement with Qimonda to jointly develop advanced flash process technologies.
2002-11-04 Lumileds, Nichia sign LED licensing deal
Lumileds Lighting and Nichia Corp. have entered a cross-licensing agreement in which the two companies will share LED IP rights.
2009-04-22 Infineon, Ident ink license deal for game consoles
Ident Technology has signed up Infineon Technologies AG as a license partner from the semiconductor industry.
2009-11-24 Infineon, ARM forge license deal on security apps
Infineon Technologies AG and ARM have entered a long-term strategic collaboration in the field of security microcontrollers for chip card and security applications.
2013-06-10 GEO, Eyevis close licensing deal for eWARP tech
Eyevis received certain license rights for GEO's patented distortion and warping correction technologies for use in its projection products.
2002-04-05 eMagin signs investment deal with ROHM
OLED developer eMagin Corp. has entered into a strategic investment agreement with Japan's electronic component manufacturer ROHM Co. Ltd.
2009-11-11 Elpida, ProMOS ink DRAM foundry deal
Elpida will provide DRAM process technologies to ProMOS, while ProMOS will provide manufacturing capacity to Elpida.
2013-05-06 ARM, Sonics ink licensing deal for next-gen interconnects
Sonics and ARM will cooperate to support Sonics' power management technologies, which are intended to deliver power savings by the intelligent control of power to cores
2003-03-07 ARM, Cadence ink five-year design chain optimization deal
ARM will provide direct access to ARM intellectual property to facilitate optimization of design and verification solutions from Cadence's design and verification solutions on ARM core-based SoCs.
2013-05-10 Aptina, Sony ink patent license deal for image sensors
The cross-license agreement enables Aptina and Sony to operate freely and use each other's patented inventions to advance the pace of development for cameras and other imaging applications.
2008-02-21 AMD deal to rev up IC industry in Shandong, China
AMD has signed a memorandum of understanding with Shandong Provincial Government for the development of an IC industry in the province.
2010-07-08 Nokia transfers wireless modem biz to Renesas
Nokia will sell its wireless modem business to Renesas for about $200 million. The two companies plan to carry out long-term joint research on future radio technologies.
2012-08-27 Vietnam university partners with NI
The deal between RMIT University Vietnam and NI aims to support the university's technology and engineering programs through joint training and educational activities
2006-03-07 U.S., India seek closer military, technology ties
The U.S. military is dangling a range of new weapons and technologies before the Indian government as part of a Bush administration plan to expand Indo-U.S. security cooperation
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