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2002-01-25 Zhaoyuan Jinbao completes copper foil project
Zhaoyuan Jinbao Electronics Co. Ltd has completed its manufacturing project for electro-deposited copper foil with an annual capacity of 5,000 tons.
2007-04-16 Wiser use of copper beyond DSL pushed
With the expansion of large IP-networking carrier projects like Verizon's FiOS and BT Group's 21CN, it would seem all carriers want to show they are on a fiber-rich diet. But equipment that took center stage at the Comptel show in March indicated a focus on Ethernet services over copper.
2012-11-19 Versarien discovers ultra-porous copper
The VersarienCu boasts a heat transfer coefficient of approximately 150200 kW/m2K, making it ten times more effective than conventional heat sinks.
2001-04-06 Using HOTLink with long copper cables
This application note discusses the primary considerations, which include signal propagation, attenuation/dispersion and equalization, in using Cypress Semiconductor's HOTLink data communication devices with long copper cables.
2013-10-08 Uses of copper barrier capacitors in medical field
Read about the growing demand for capacitors for use in a various medical devices.
2002-01-30 Tin-silver copper alloy to be used in consumer applications
The National Electronics Manufacturing Initiative Inc. (NEMI) has reported the latest findings of its Sn3.9Ag0.6Cu lead-free assembly project during an industry forum held at the APEX conference in San Diego.
2013-01-17 Thick plated copper process for monolithic PMIC apps
UMC's TPC solution provides thick plated copper layers to achieve higher current flow and better thermal dissipation to cut chip resistance, extending battery life.
2007-10-11 Thermal pillar copper tech helps cool flip-chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat.
2010-12-01 STATS ChipPAC ships 100 millionth copper wire bond interconnect semiconductor packages
STATS ChipPAC expects continued surge in use of copper wire as interconnect material
2005-11-24 STATS ChipPAC offers copper process for passives
Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems.
2003-10-02 Startup prepares tools to predict copper variations
Seeking to head off a looming problem for sub-100nm ICs, startup Praesagus Inc. is preparing a suite of tools that will provide manufacturing data to help designers predict thickness variations in copper interconnect.
2004-01-12 Shin Way DIP switches have copper alloy contacts
Shin Way Electronics Co. Ltd has released its PI and PM series of single pole and single throw (SPST) DIP switches that come with copper alloy contacts, liquid crystal polymer, UL 94V-0 base and cover, nylon actuator, and copper alloy with 90/10 tin-lead plated terminals.
2006-04-03 SFP EMI cage supports copper, optical transceivers
dataMate Products expands its SFP product line with a four-port SFP EMI cage that can be used with both copper and optical small form-factor pluggable transceivers.
2002-03-27 Sapphire-based chip trades copper wires for light
A team at Johns Hopkins University in the U.S. has developed a prototype chip which uses light instead of wires as an interface.
2015-01-21 Remtec adds features to direct copper bond substrate
The DBC substrates from the company now boast solid copper-filled vias and copper-coated bore holes, thermal paths for better heat management, and solder mask and assembly options.
2007-12-14 Post amps tout LOS or SD for copper, fiber modules
Four low power post amplifiers featuring loss-of-signal (LOS) or signal detect (SD) circuits which are optimized to detect a wide input signal range have been added by Micrel Inc. to its family of post amplifiers.
2005-03-18 Platform built for combo of copper, fiber
Entrisphere has just officially rolled its Broadband Loop Multiplexer (BLM) 1500, which has been shipping to select carriers for several months.
2002-03-04 Nova, Applied Materials team for copper CMP process
Nova Measuring Int. Ltd has signed a joint development agreement with Applied Materials on integrated metrology for copper CMP processing.
2002-12-20 NEC increases copper wiring reliability
NEC Corp. has developed a technology designed to raise the reliability of multilayer copper wiring by enabling nanometer-scale interface control of the process.
2002-10-02 Mysticom sets watermark for 10GbE over copper
Mysticom Inc. demonstrated a transceiver that set a new watermark for high-end Ethernet signaling over copper wires at the Communications Design Conference, sending 10Gbps signals over 25m copper using Infiniband cables.
2002-07-01 Motorola, DA NanoMaterials to collaborate on copper CMP solution
Motorola Inc.'s Semiconductor Products Sector and DuPont Air Products NanoMaterials LLC have agreed to collaborate on an advanced copper chemical mechanical planarization formulation.
2010-06-29 MOSFETs utilize copper clip technology
International Rectifier expands HEXFET power MOSFETs to offer a complete family of mid-voltage devices available in a 5mm x 6mm PQFN package with optimized copper clip and solder die.
2008-08-20 Modules support USB 2.0 over copper, fiber optics
Icron Technologies has released the ExtremeUSB 2.0 Core 2100 Module daughterboards.
2006-10-03 MDKs ease deployment of copper-to-POF converters
Firecomms said its two new MDKs will enable the rapid deployment of copper-to-POF converters and repeaters for 1394b and Fast Ethernet.
2004-06-23 Linear switching regulator with exposed copper bottom
Linear Tech has launched a triple output monolithic switching regulator with an exposed copper bottom.
2003-12-03 Kobe, Mitsubishi to merge copper tube businesses
Kobe Steel Ltd and Mitsubishi Materials Corp. have agreed to combine their copper tube businesses in Japan and Southeast Asia into a new joint venture.
2010-07-29 Intel: Silicon photonics to replace copper
Silicon photonics will replace copper connections in everything from supercomputers to servers to PCs, according to Intel Corp. researchers who demonstrated 50-Gb/s optical transmitter and receiver chips that it plans to scale up to terabit-per-second speeds prior to commercialization.
2013-03-26 IME consortium examines reliability of copper interconnects
The Institute of Microelectronics has launched the second phase of a research project aimed at improving reliability of semiconductor devices by tackling corrosion-related problems of copper wire bonding.
2003-12-16 Huang Wei power sockets with copper alloy terminal
Huang Wei Precision Industries Co. Ltd has announced the release of its SC-8R series of ac power sockets that features a 15A/10A, 250Vac rating.
2002-04-18 Furukawa establishes copper strip subsidiary in Jiangsu
Furukawa Electric Co. has established a subsidiary in Jiangsu, China that will produce and sell copper strips used in the connectors of IT-related electrical equipment.
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