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What does CSP stand for?
CSP stands for chip scale package or chip size package. It is a chip housing that is slightly larger than the chip itself.
total search326 articles
2004-04-16 Zymet underfill encapsulants eyes CSP, BGA apps
Zymet has developed a reworkable underfill encapsulant that is designed for CSP and BGA encapsulation.
2003-10-03 Universal Evaluation Board for High Speed Op Amps in CSP Packages
This application note describes the Evaluation Board for High Speed Op Amps in CSP Packages.
2002-05-31 Toshiba, Tessera sign expanded agreement for CSP
Tessera Technologies Inc. has signed an expanded technology licensing agreement with Toshiba Corp. that enables Tessera to act as a licensor of Toshiba's FBGA assembly process for "face-up" CSP.
2001-04-01 Solder joint reliability of BGA/CSP for mobile phones
A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.
2001-04-01 Solder joint reliability of BGA/CSP for mobile phones
A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.
2005-09-16 Smallest single-port USB 2.0 analog switch in MicroPak CSP?
Fairchild Semiconductor introduced what it touts as the smallest single-port USB 2.0 "Hi-Speed" (480Mbps) analog switch in a MicroPak chip scale package.
2002-01-02 Sharp stacked CSP memory boasts 200Mb capacity
The company has developed a four-chip stacked CSP memory device that integrates two 64Mb NOR Flash memory chips, a 64Mb RAM and an 8Mb low-power SRAM into a single package.
2008-05-14 RF amplifier housed in ultrasmall CSP
Touted as the industry's smallest RF amplifier, Avago Technologies has unveiled its VMMK-2x03 amplifiers in a chip-scale package with 0402 package dimensions (1mm x 0.5mm x 0.25mm).
2000-11-01 Profiling for successful BGA and CSP rework
This technical article discusses how to successfully profile a PCB when reworking BGA and CSPs.
2012-05-16 P-Channel WL-CSP MOSFETs cuts board space in mobile apps
Fairchild Semiconductor's 0.8 x 0.8mm P-Channel PowerTrench WL-CSP MOSFETs claim improved thermal characteristics.
2002-09-23 MAS ships regulator in 1-by-1.3mm CSP casing
Micro Analog Systems' MAS9123 low-noise regulator comes in a CSP casing that occupies a footprint of 1-by-1.3mm and a profile of 0.65mm.
2006-07-11 MagnaChip introduces CSP to CMOS sensor line
MagnaChip Semiconductor announced that it will introduce chip-scale packaging to all lines of its imaging products.
2002-07-26 Kingston develops CSP technology for memory modules
Kingston Technology Co. Inc. has introduced the Elevated Package Over CSP (EPOC) 3D memory module technology.
2004-12-15 Jiangyin Changdian begins WL-CSP, FC package production
China-based Jiangyin Changdian Advance Package Co. Ltd, a joint venture of Jiangsu Changjian Electronics Technology Co. Ltd and Singapore APS Inc., announces that it already started operations at its IC bump, WL-CSP and FC package lines.
2006-06-02 ISL84684ii CSP to DIP converter board with mounted IC
The ISL84684ii CSP to DIP converter board was design to provide customer's with a quick and easy method to handle and evaluate the ISL84684ii dual SPDT switch.
2005-04-28 IC substrate suppliers ramp up CSP production
Taiwan chip substrate suppliers are increasing capacities for chip scale package (CSP) substrates as demand for Window ball-grid array (BGA) packaging services surge, which is mostly attributed to DRAM makers now shifting from DDR to DDR2.
2006-05-31 FlipChip, Engent to develop 3D wafer level CSP tech
FlipChip and Engent announced an alliance aimed at accelerating the development and deployment of 3D wafer level CSP technologies for stacked die packaging applications.
2007-09-12 Firms form forum to promote wafer-level CSP
Major industry firms have joined hands and formed the WLCSP Forum to promote the adoption of semiconductor devices using wafer-level CSP.
2008-03-14 DC/DC converters come in CSP versions
AnalogicTech has announced the availability of CSPs for its AAT1149, and AAT1171 DC/DC converters.
2004-07-23 CSP partners with IVT for Bluetooth solution
CSR announced the latest in its newly launched BlueCore4 family of Bluetooth silicon that was jointly developed with IVT.
2001-03-30 CSP MOSFETs Offer Both Size And Performance Advantages
This paper describes Chip-Scale-Packaged (CSP) devices that enable the designer to reduce the amount of board space required to implement load management and battery protection circuits.
2000-03-10 CSP die shrink solution for memory devices
This application note shows the effectiveness of die shrink as a package solution for memory devices. In the case of the 8-by-10mm Direct Rambus DRAM device, about 350 dies can be obtained from a single 203.2mm wafer. The 85 percent linear shrink allows an addition of 150 dice from the same size wafer.
2002-06-18 ChipPAC develops CSP for handheld consumer applications
ChipPAC Inc. has developed a high density, high reliability, lead-free chip-scale package for mobile applications.
2003-03-12 APA to acquire certain assets of CSP
APA Optics Inc. has signed a purchase agreement to acquire certain assets of Computer System Products Inc.
2005-12-19 Analog switches feature CSP, very low ON-resistance
Pericom introduced a new family of advanced analog switches created for mobile terminal applications which feature CSP, very low ON-resistance, and wide voltage ranges.
2002-05-15 Amkor qualifies four 1mm-thin S-CSP products
Amkor Technology Inc. has claimed to be the first to qualify a family of two die stacked CSPs (S-CSPs) to meet the 1mm low-profile requirements of next generation wireless handsets.
2003-03-25 UMD Technology to acquire interconnect supplier assets
UMD Technology Inc. has signed a definitive agreement to acquire the assets of Wells-CTI Inc., a supplier of interconnect devices, including the capital stock of Japan corporation Wells-CTI Kabushiki Kaisha.
2003-11-16 Trends in power management use
Thinking early about your design can save money, time, and improve performance.
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2004-06-16 TMS320DM64x power consumption summary
This app note describes the power consumption of the Texas Instruments TMS320DM640, TMS320DM641 and TMS320DM642 digital signal processors (DSPs).
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