Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > cte

cte Search results

total search29 articles
2002-12-27 CTE tuning forks operate to 60C
The 6K series of tuning forks from Crystal Technology Electronics Co. Ltd operates over the 30kHz to 350kHz frequency range with a tolerance level of 20ppm to 100pm.
2006-03-13 Adhesives feature low CTE
Advanced Applied Adhesives announced the availability of a new series of electrically insulating die attach adhesives that is said to feature a low coefficient of thermal expansion.
2001-02-01 Testing dimensional limits of high I/O flip-chip design
The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
2001-06-08 HDI and microvia design for high-performance
High density-interconnect (HDI) printed circuits are now being designed in ever increasing quantities. This article focuses on the high-speed industrial systems for HDI.
2008-10-30 TI to shed about 350 jobs in France
Texas Instruments Inc. announced its intention to cut 300 to 350 jobs, out of 900, at its site in Villeneuve-Loubet, in the French region of Provence-Alpes-Cte-d'Azur.
2015-10-13 Wearable PCB designs call for attention to basics
In the absence of printed circuit board standards in wearable Internet of Things electronics, hardware developers need to pay close attention to fundamentals.
2006-02-27 Video tester gets HDMI CEC support
Providing a consumer electronic control (CEC) test approach, Quantum Data now has a HDMI CEC development and compliance test suite for its existing 882CA video test instruments.
2015-02-18 Understand product failures through bathtub curves
The likelihood of a component failing to properly function over time can be described by the bathtub curve. Read this article to learn more about this concept.
2004-10-26 Toshiba to use Rambus DDR2 interface
Toshiba Corp. has selected Rambus Inc. DDR interface cells for next-generation high-volume consumer applications.
2013-04-16 Slow but continuous growth for glass substrate market
Yole Dveloppement's report noted that the demand for glass is growing, and glass has already been adapted for various and unique wafer-processing functionalities and platforms supporting a wide range of end-applications.
2011-03-08 Silver, diamond make cooling composite for defense systems
Georgia Tech Research Institute researchers have developed a composite of silver and diamond for cooling microelectronics used in defense systems such as phased array radars.
2013-07-17 Saving embedded PCB design with forensic tech
Find out how forensics inspections can alleviate OEM concerns over maintaining high reliability for their systems and sub-systems.
2003-06-17 Rogers polymer material suits thin-film PCBs
Rogers Corp. has expanded its R/flex 3000 family of Liquid Crystalline Polymer-based circuit materials with the introduction of the R/flex 3850 double-clad laminate.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2006-11-07 Master Bond adhesive is resistant up to 205C
Master Bond announced it has developed a two-component, high temperature-resistant, thermally conductive epoxy adhesive, sealant and coating that features resistance up to 205C.
2009-05-12 Low-axis materials improve antenna efficiency
The Advanced Circuit Materials (ACM) Division of Rogers Corp. has developed the latest patent-pending innovation in high frequency materials, RT/duroid 5880LZ laminate.
2015-02-25 LCP laminates support high-temperature board construction
With a melt temperature of 330C, the Rogers ULTRALAM 3850HT liquid-crystal-polymer laminates are geared to simplify and enhance the construction of multilayer circuit boards at higher temperatures.
2015-04-22 Is resistive RAM the next NVM star?
Resistive RAM features low power consumption and a small cell areaboth compelling reasons for their adoption as a non-volatile memory.
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level.
2010-12-09 ICs seen to scale via 3D TSV
Chip scaling is becoming harder and costlier entering into the sub-20nm realm, thus, the industry is looking for new materials, structures and processes, says a technologist from Samsung.
2012-09-28 How to select PCB materials for high-frequency apps
Find out how to simplify that choice when striving for the best tradeoff between ease of fabrication and best electrical performance.
2013-09-13 How to avoid PCB engineering change orders
Prevent engineering change orders in printed circuit board designs by paying attention to seven key areas where problems are likely to occur.
2013-06-06 Fraunhofer, EV Group work on direct wafer bonding for solar cells
Fraunhofer ISE collaborated with EV Group to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.
2004-05-26 DDi licenses ThermalWorks PCB technology
DDi Corp. has licensed ThermalWorks' STABLCOR technology, an advanced thermal management solution for PCB fabrication.
2014-03-20 Chip stacks feature near-zero TSV keep-out zones
GlobalFoundries describes a middle-of-line layer stack technique that uses nitride, PMD oxide, and a contact protection layer with a high coefficient of thermal expansion.
2008-01-08 AlSiC base plates aim at IGBT modules
CPS Technologies Corp. has introduced base plates, based on its aluminum silicon carbide metal matrix composite material, for IGBT modules used in high-power apps.
2005-04-27 Adapter sets enables reuse of 1,396-pin BGA ICs
Ironwood introduced a new high pin count BGA surface mount adapter set that includes the SF-BGA1936A-B-42, female socket with machined pins, and LS-BGA1936A-41 male socket, for 1,936-pin BGA ICs.
2015-11-13 A9: Story of Apple's design ambitions
The A9 is really a story within a story. On a basic level it is a story of a sixth generation AP that is fabricated in a FinFET process. It is also a bigger story of Apple semiconductor design ambitions.
2015-05-14 A closer look at Samsung's 14nm node
Samsung has lagged Intel in the release of its process nodes, especially with the 20nm node that was two years behind Intel. Remarkably, Samsung has shrunk the lag for its 14nm to about six months.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top