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2011-02-09 Tensilica allows customer evaluation of Atlas DPUs
Now available for customer evaluation are ConnX SSP16, a 16-way SIMD baseband core optimized for processing of soft bits, and ConnX BSP3, a baseband core optimized for processing and control of bit streams
2013-03-13 Cadence to boost SoC offerings with Tensilica buyout
Cadence Design Systems has agreed to purchase Tensilica for approximately $380 million to expand its scope of IP offerings and accelerate delivery of IP roadmap.
2012-05-07 Tensilica expands R&D hub in India, plans to increase workforce
As the company's R&D unit has now transferred to a new building, the company is planning to double the workforce of the center to at least 50 percent.
2010-09-17 AppliedMicro chooses Tensilica for high-throughput project
Tensilica, Inc. has just announced that AppliedMicro has chosen Tensilica's Xtensa LX dataplane processors (DPUs) for their upcoming high-throughput communications chip design project
2009-09-03 DSP engine targets telecom, VoIP apps
Tensilica Inc. has introduced the ConnX D2 16bit dual-MAC (multiply accumulate) DSP engine for its proven Xtensa LX dataplane processor cores for SoC designs
2012-07-02 Multi-core networking in Linux user space with zero overhead
Find out how multicore network SoCs work, and how to leverage them efficiently for data path processing
2004-03-11 Control plane bridge chips span to SPI 4.2Chipsets extend fiber with copper in last mile
Cavium has crafted a device family that provides transparent bridging between an SPI 4.2 device and existing PCI-X.
2005-08-26 Cavium MPU integrates up to sixteen MIPS64-based cores
Cavium Networks' new Octeon EXP microprocessor embeds up to 16 MIPS64-based cores in a single chip to reduce cost and increase performance and functionality for converged control and data-plane apps.
2011-03-31 Tensilica releases DSP core for cellular basebands
Aimed at cellular basebands, Tensilica's Xtensa LX4 boasts lower power and a smaller footprint, reaching speeds of more than 1GHz in a high-performance 45nm process with an area of only 0.044mm2.
2005-08-24 Freescale to acquire Seaway Networks
In a move to expand its communications chip business, Freescale Semiconductor Inc. has acquired the assets of Seaway Networks Inc. for an undisclosed price.
2009-06-24 DSPs tailored for 3G/4G base stations
Tensilica Inc. has launched the ConnX family of DSPs for 3G and 4G SoC designs.
2010-04-28 DSP core handles eight MAC operations per cycle
Tensilica Inc. is offering its third generation ConnX 545CK eight-MAC (multiply-accumulate) VLIW DSP core for SoC designs.
2010-03-25 Controllers deliver fast clock speed at low power
Tensilica Inc. has launched its third generation of Diamond Standard controllers that deliver faster clock speed at less power in a smaller die area.
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