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2011-11-08 Yield issues, defects mount in 28nm node
Are customers feeding overly optimistic targets for the 28nm process technology than the actual demand?
2002-11-18 VRM: Using a virtual sample to diagnose defects
This technical article details how an advanced acoustic technique makes it possible to create a "virtual package" that preserves the full 3D detail of an IC package as a matrix file.
2005-01-03 Test experts ponder cost of defects
Is 100 DPPM too tough to be practical for designs in 100nm or finer processes?
2010-01-13 Targeting small delay defects
To maintain the quality of test for the reasonable DPM levels, more and more test engineers are looking to target small delay defects with ATPG.
2015-01-28 Preventing embedded PCB design defects
Printed circuit board defects can remain unnoticed until failure occurs, so it is important to implement disciplined practices even at the early stages of design.
2010-12-01 Optical inspection system targets 2mµ wafer defects
Altatech Semiconductor S.A. launches high-throughput AltaSight EyeEdge inspection system
2009-06-01 Nanosensors spot bridge, aircraft defects
Nanocomposites are being developed to audit the safety of bridges and aircraft by embedding nanotubes into sensors that change conductivity when cracks or other structural defects occur.
2016-03-31 Investigating the impact of etching time on 4H-SiC defects
In this article, we looked into the relationship between the pre-growth hydrogen etching time and defects density on 4H-SiC substrate surfaces.
2006-11-10 Infineon test chip avoids vertical interconnect defects
Infineon claimed to be the 'first' to deliver the test chip for avoiding VIA defects in the production of highly integrated semiconductor circuits by a factor of 10.
2013-01-09 Improve requirements analysis to eliminate defects
Investment in requirements management, equivalent to that made for design and coding, is needed to ensure a strong foundation on which to build a successful project.
2006-03-01 IC testing pushes zero defects in autos
The industry buzz on zero-defect initiatives is growing and IC manufacturers are taking the challenge to satisfy automotive customers.
2004-07-01 Handling a storm of packaging defects
The presence of internal packaging defects in IC packages can cause havoc with reliability; but acoustic micro imaging provides a way to control costs.
2013-06-05 Graphene still the strongest material even with defects
Columbia Engineering researchers demonstrated that graphene, even if stitched together from many small crystalline grains, is almost as strong as graphene in its perfect crystalline form.
2007-11-12 Former employee sues AMD for son's birth defects
A former AMD employee sued the company and a regional medical association of being responsible for birth defects of her son, born with a missing lower right arm and lifelong cognitive deficits.
2005-10-06 Fluorine sweeps high-k defects out of the gate
Hafnium oxide, the anointed successor to silicon dioxide in the gate stack, has a new ally: fluorine.
1999-11-01 Finding manufacturing process defects with ATPG
Rising chip complexity has increased the probability of manufacturing process defects, which inevitably compromises process yield. Automatic Test pattern Generation will help you identify these defects, with the added advantage that it is technology independent.
2009-03-31 Finding defects in safety-critical code
The methods that safety-critical developers use are undeniably effective at reducing risk, so there are lessons to be learned for developers who do not write safety-critical code. Two techniques stand out as being most responsible: advanced static analysis and rigorous testing.
2005-08-05 Fewer defects found in Linux kernel
An analysis of the latest Linux kernel has found that it contains fewer critical defects than the previous version, despite an increase in the amount of code, a source-code analysis firm said Wednesday.
2000-10-01 Evaluating solder-paste defects
A robust solder-system evaluation saves manufacturing facilities unnecessary expenses.
2006-02-08 E- beam device spots defects in FEOL, BEOL apps
KLA-Tencor introduced the eS32, an extension of its e-beam inspection platform, designed to capture electrical and small physical defects.
2015-02-11 Detect physical defects using advanced fault models
Here is a look at the use of advanced fault model for detection of physical defects that cannot be detected using conventional Single Stuck-at and Transition Fault models.
2009-02-13 Dealing with statically detected defects
Because statically detected defects rarely have an external advocate demanding that they be fixed, the management of a development organization needs to make the adoption of a static tool a priority in order to reap the benefits.
2007-10-03 Carbon nanotubes find, fix aircraft wing defects
Carbon nanotubes can find and fix defects in aircraft wings and other polymer composites.
2007-09-17 Broadband illumination captures critical defects
This article demonstrates that a tunable broadband brightfield approach has several advantages over a single-wavelength approach for meeting new inspection challenges and generating higher capture rates of yield-impacting defects.
2008-06-05 Auto ICs new design seeks zero defects
To accomplish fewer defects in chip designs, Bosch is deploying proactive types of technologies such as failure tolerance, redundancy and applications engineering as the need for a new ASIC methodology rises in the automotive industry.
2000-12-01 Applying Hubble technology to chip defects
This technical article describes the application of the Hubble space telescope technology to detect chip defects.
2014-11-10 Apple blames TLC NAND for iPhone 6 defects, picks substitute
The U.S. tech giant believes a problem in the controller IC of the TLC NAND flash causes the numerous failings of the 64GB iPhone 6 and the 128GB iPhone 6+.
2002-08-01 Accurately identifying disk surface defects
This technical article discusses an innovative disk-surface defect test solution aimed for HDD devices.
2000-12-01 Technique probes deep-submicron test
This technology news article describes the latest Agilent Technology technique for conducting deep-submicron test schemes.
2011-12-30 Rapid acoustic inspection for 300MM wafer generation (Part 1)
As wafers become larger and individual die become smaller, acoustic micro imaging is developing the non-destructive tools that can remove defective die to boost reliability and yield.
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