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2006-09-18 New DFM methods enable early yield prediction
New DFM methodologies such as RRA and CAA, combined with traditional DRC and accurate fab yield impact data, enable designers to determine whether design modifications actually result in higher-yielding silicon.
2010-06-09 Looking acoustically into MEMS devices
Acoustic imaging of MEMS devices before dicing provides the advantage of identifying gap-type defects before further value is added.
2002-02-12 KLA-Tencor introduces automated wafer backside inspection system
KLA-Tencor Corp. has introduced the industry's first fully-automated wafer backside inspection system that enables non-destructive inspection of the backsides of 300mm wafers.
2007-03-01 Conquer loss, create high-yielding designs
This article discusses the three most important yield-loss mechanisms in 65nm designs, and proposed methods for mitigating yield loss without severe impact on design schedules. Using tools that are both powerful and well-integrated, design and layout engineers can create high-yielding designs while meeting design specifications and demanding schedules.
1999-12-01 Checking for wafer-to-wafer bonding integrity
Detection of internal defects in bonded wafer pairs is vital to achieving anticipated yield and for long-term device reliability. Acoustic micro imaging provides you a nondestructive method for imaging and analyzing these defects.
2003-09-16 Build high availability into your IP network
A high-availability system design demands a hardware platform with redundant, hot-swappable components to enable fast-recovery software techniques.
2016-05-05 Basics of software standards compliance (Part 6)
In this instalment, we will discuss the use of coverage analysis to assess test completeness against both requirements and code.
2016-04-04 Basics of software standards compliance (Part 5)
In this instalment, we will start going beyond the code to look at how to build processes that are also bullet proof.
2011-08-04 X-ray inspection system eases board failure detection
The Akila XR-3 X-ray inspection system claims accurate detection of defects such as excess solder, insufficient solder and voids in printed circuit fabrication.
2007-04-30 X-ray inspection system delivers high-throughput 3D coverage
Agilent Technologies says its Medalist x6000 3D X-ray inspection systems offer more than double the throughput of leading 3D solutions while using full 3D capability to find PCB assembly (PCBA) solder and manufacturing assembly defects.
1999-12-01 Using in-line inspection to improve PCB assembly yields
Identifying defects in your process and improving product quality calls for a suitable pre-flow in-line component inspection system. While choosing a system, keep in mind your specific process needs, inspection accuracy and repeatibility requirements, and last but not the least, its robustness vis--vis actual operating conditions.
2009-02-16 Uncovering static analysis pitfalls
Perhaps the most surprising thing about static analysis is not that it can detect memory leaks, buffer overflows, or incorrect pointer assignments at compile time, but rather that users of static analysis will often fail to fix such detected defects.
2001-02-01 Testing dimensional limits of high I/O flip-chip design
The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
2013-11-28 Tantalum capacitors boast high breakdown voltage
Known as F-Tech, KEMET's tantalum manufacturing technology features techniques for optimizing chemical purity to eliminate hidden dielectric defects that could lead to capacitor failure.
2015-07-16 Structural netlist for analogue IP verification
Find out how to achieve more accurate analogue behaviour by using a structural netlist instead of a behavioural model to reduce the number of silicon defects and the verification cycle time.
2003-01-16 Solder paste process control for CSPs and 0201s
This technical article discusses a more effective strategy to improve first pass yields and prevent defects from occurring in CSPs and 0201s.
2009-02-02 Software debugging techniques for PowerPC 440 processor embedded platforms
This application note discusses the use of the Xilinx Microprocessor Debugger and the GNU software debugger (GBB) to debug software defects.
2005-04-05 SII system for advance processes
SII NanoTechnology will release its SIR7000FIB photomask defect repair system that repairs defects on photomasks for semiconductor devices which accommodate the 65nm node.
2006-10-02 Self-healing chips prevent system failure
Semiconductor Research Corp. and the National Science Foundation are funding a groundbreaking research effort into "self-healing" chips that can detect and repair defects in the field.
2004-02-02 Scan-based testing can do job
Scan-based transition-fault testing techniques are increasingly used to test for delay-inducing defects.
2004-05-04 Production tester addresses high-speed serial chip tests
Agilent claims its high-speed production tester is the industry's first for identifying the maximum number of product defects at the lowest cost.
2013-03-19 Piezoelectric sensors remotely detect machine integrity
A*STAR's Institute of Materials Research and Engineering and Singapore's Hoestar PD Technology teamed up to deploy wireless piezoelectric sensors that can detect defects via remote monitoring.
2013-02-05 Optical fibre touts panoramic spectrograph, sensor analysis
The FBPI broadband optical fibre from Polymicro FBPI boasts a low-OH pure silica core that demonstrates significantly reduced content of UV defects and other UV absorption centres.
2014-02-28 Moisture sensitivity levels for plastic-encapsulated ICs
Learn about the use of acoustic microscopy to find internal defects during the assigning of the sensitivity levels.
2011-08-11 Modular AOI tech touted as industry's first
CyberOptics' AOI and SPI systems deliver high-speed, flexible inspection of solder and lead defects, presence and position, correct parts and polarity down to 01005 components.
2007-06-07 Ministry finds China's MP3 players below par
The Ministry of Information Industry (MII) revealed that about 66 percent of the MP3 players in China today have defects.
2005-11-22 KLA touts technology to cut flash defect detection time
KLA-Tencor Corp. said that it has identified a new application for its MicroLoop electrical defect detection methodology that can detect critical bridging defects on advanced flash memory wafers nearly twice as fast as current methods.
2002-11-27 Innovative optical imaging method seen to lower IC test costs
A group of physicists led by Dr. Caesar A. Saloma of the National Institute of Physics at the University of the Philippines have developed an inexpensive optical imaging technique to detect IC defects.
2006-10-19 IC firms collaborate with Synopsys to validate new ATPG tech
Synopsys has collaborated with several semiconductor firms to test a new ATPG technology designed to increase the quality of manufacturing tests by targeting small delay defects.
2015-06-23 IBM highlights III-V FinFETs on silicon substrate
A method similar to Imec's, IBM's process begins vertically then coaxes the InGaAs to turn horizontal and inward, eliminating lattice mismatch defects it was making in the vertical column growth pattern.
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