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2015-03-10 Viscom delivers system for coating inspection
The S3088 system for conformal coating inspection, Viscom says, is now available with high-precision plasma coating inspection. It works with UV LEDs and has 11.75?m/px or 23.5?m/px resolution.
2013-07-22 Virtual design, verification for e-Mobility
Learn how to address many of the emerging engineering challenges that carmakers now face.
2012-08-21 Utilize wafer-scale CMOS X-ray imaging for medical apps
This imaging technology can bring key advantages in terms of performance such as high resolution, high dynamic range and low noise capabilities.
2015-07-21 Utilising FRAMs in automotive applications
FRAMs can be used for nonvolatile data logging in most automotive sub systems. This technical article discusses the use of FRAM in Automotive Event Data Recorders.
2008-06-02 Use system models for better verification
This article describes the system-level to RTL design and verification flow of a commercial graphics processing chip. In this flow, system models were developed to validate the arithmetic computation of video instructions and were then used to verify the RTL implementation using sequential logic equivalence checking.
2015-03-02 Unsolderable no more: Liquid-process transistor does the trick
The "miracle solder" creates new materials by joining their powdered forms into a continuous single-crystal-like material, and can even be used in 3D printers to join formerly incompatible materials.
2015-02-18 Understand product failures through bathtub curves
The likelihood of a component failing to properly function over time can be described by the bathtub curve. Read this article to learn more about this concept.
2005-03-29 UMC uses Mentor embedded compression solution for production test
United Microelectronics Corp. (UMC) has adopted Mentor Graphics Corp.'s TestKompress embedded deterministic test (EDT) tool for use in 90- and 130nm reference flows.
2006-11-22 UMC produces 45nm SRAM chip
United Microelectronics Corp. has cleared a key 45nm process hurdle by producing an SRAM chip with a bit cell size of less than 0.25?m?.
2013-10-18 Ultra-high-res display makers switch to metal-oxide TFTs
The expensive low-temperature polysilicon process has prompted the ultra-high-res display industry to move to metal oxide TFTs.
2010-09-23 UCLA uses nanowires as self-aligning gates on graphene transistors
UCLA researchers how that using nanowires as self-aligning gates overcomes the difficulties of fabricating graphene transistors.
2014-07-07 Two-step process crops transparent graphene substitute
The process involves coating the substrate with a polymer solution and heating it at 1,200C. The resulting material, transparent and conductive, exhibits properties inherent in graphene.
2008-05-20 TSMC ventures into automotive silicon market
TSMC is in European talks to enter the safety-critical automotive silicon market. Infineon, which claims to be number two in automotive silicon, is one way TSMC could make its move.
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate.
2008-06-12 TSMC targets to unify 32nm design flow
Facing the 32nm challenge, Taiwan Semiconductor Manufacturing Co. Ltd is putting the pedal to the metal with a new design-for-manufacturing scheme.
2012-01-27 Triaxial accelerometer for high-g impact apps
The piezoelectric sensor features an amplified output and is packaged in a rugged aluminum or stainless steel housing with a 60in cable assembly.
2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2004-02-02 Traveling at memory speed
The combination of a memory BIST engine with enhanced at-speed application provides the basis for ensuring high-quality testing of SoC designs with embedded memories.
2007-08-14 Toshiba recalls more fire-hazard Sony batteries
Due to the continued reports of overheating batteries, Toshiba has issued another round of recalls for Sony notebook batteries that are said to be fire hazard.
2007-10-19 Toshiba 'validates' imprint litho for 22nm CMOS
Toshiba Semiconductor has reportedly validated the use of imprint lithography technology in developing 22nm node CMOS devices.
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2006-11-01 Tool reduces need for immersion at 45nm
Invarium Inc. offers patterning-synthesis software promising, among other things, to limit the number of advanced layers that will require immersion at 45nm. This will allow customers to get more mileage out of existing lithography equipment.
2007-10-18 Tool quickens complex network device analysis
Fanfare latest test-automation software, the iTest Team, enables network-equipment makers and service providers to perform complex system testing by executing simultaneous commands to a multitude of different devices in their network to simulate real-life network testing.
2006-09-20 Tool limits need for immersion lithography at 45nm
Invarium will roll out new patterning-synthesis software this week, promising, among other things, to limit the number of advanced layers that will require immersion at 45nm.
2008-01-21 Tool deploys Simulink code to Green Hills IDE
The MathWorks and Green Hills Software has announced Embedded IDE Link MU, a tool that deploys code generated from Simulink models into the Green Hills MULTI IDE.
2012-05-09 Tips on IPv6 testing
Know the causes of poor IPv6 compatibility and how to address them.
2004-04-23 Timing optimization rolls for logic designers
Silicon Dimensions has released an add-on to its Chip2Nite floor planner, block design and analysis offering.
2006-10-19 TI, Mistral Software co-develop virtual CD changer ref design
Texas Instruments Inc. and Mistral Software Ltd are launching a virtual CD changer (VCDC) reference design for next-generation A/V applications.
2004-06-18 TI outlines new options for chip scaling
Texas Instruments Inc. (TI) revealed that its semiconductor research teams have developed cost effective techniques to lower chip power consumption, and a new approach to increase overall performance.
2013-05-29 Thinnest semiconductor grown from MoS2 crystals
Columbia University researchers studied how MoS2 crystals stitch together, helping them understand the optical and electronic properties of the material.
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