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2007-10-09 The road to success in embedded software
Despite being complex and challenging, writing embedded software code is not exactly "rocket science" or a magic only a few people can do; in fact, it is doable by a wide range of people with a broad set of skills.
2005-07-01 The need to design for uncertainty
If there was a message for chip designers from two recent industry conferences, the ISPD and the EDP, it was this: Get used to uncertainty. The era of 'design for variability' is here.
2014-07-07 The cost of overlooking design-for-test
To prevent costly printed circuit board rework, it is important to have an effective DFT strategy based on a close partnership and working relationship between PCB design and test engineering.
2006-12-18 Test tool optimizes data for IC yield
LogicVision Inc. touts its solution Yield Insight to provide "yield learning," a process in which test failure data can pinpoint potential yield problems.
2011-06-09 Test solution automates 3D IC deployment
Imec and Cadence has released a test solution that automates 3D stacked ICs deployment.
2011-09-26 Test sol'n improves yield, volume diagnostics
Synopsys said its TetraMAX ATPG and Yield Explorer increase volume testing and yield-ramp to identify causes of silicon failures.
2010-11-04 Test coverage analysis tool features yield estimation
ASTER's TestWay Express now allows estimates for new product yields
2006-11-03 Test challenges could trump future chip designs
Coming silicon process generations will bring not only immense increases in device density, but also the challenges of working with process and device variations that in many ways are worse than for the processes of 20 years ago.
2002-09-06 Teradyne delivers optical test equipment to BISC
Teradyne's Assembly Test Division has received an order from Beijing International Switching System Corp. Ltd (BISC) for two Teradyne Optima 7300 post-reflow automated optical inspection systems.
2004-07-13 TEL, IMEC team up in immersion lithography
Tokyo Electron Ltd (TEL) has collaborated with IMEC for the research of 193nm immersion lithography.
2002-04-26 TCE adopts Numerical's Virtual Stepper for photomask inspection
Taiwan-based photomask manufacturer Toppan Chunghwa Electronics (TCE) has incorporated Numerical Technologies' Virtual Stepper System into its photomask manufacturing process.
2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface.
2015-06-01 Synopsys to buy Quotium's app security testing biz
The Quotium Seeker complements the Coverity platform's static analysis technology by testing and analysing applications, providing customers with a solution to detect and remediate security issues.
2006-02-21 Synopsys posts profit, revenue growth
Synopsys reported a net income of $1.7 million on revenue of $260.2 million for the first quarter of its fiscal 2006, which closed Jan. 31.
2004-10-29 Synopsys Galaxy 2004 supports Nvidia latest designs
Synopsys Inc. disclosed that Nvidia Corp. has adopted its Galaxy 2004 physically aware test solution for its latest generation designs.
2004-05-14 Synopsys enhances SiVL verification tool
Synopsys has announced enhancements to its SiVL verification tool, a silicon-versus-layout tool.
2006-05-01 Synopsys adding to its DFM lineup
Included in Synopsys' yearend agenda is the addition of a dual-domain simulation product and a next-generation yield analysis tool to its DFM product family.
2013-05-09 Synchronised technique for next-gen data storage
The BPMR technique offers much higher storage capacity because it records the data in a regular array of single-grain magnetic islands that can be much smaller than multiple grain bits in continuous media.
2009-12-18 Switches protect from repeat short circuits
The two devices offer over-current shutdown, over-temperature shutdown and active clamp circuit to assure safe operation.
2010-06-02 Survey finds more in favor of193nm, EUV litho
A survey of more than 130 attendees hailed 193nm and EUV as the technologies that would be considered for manufacturing at the 32nm node or beyond.
2008-03-17 Succeed at 65nm design
A true DFM-aware environment accounts for process variability and lithographic effects in the context of timing, power, noise and yield at every stage of the flow. This begins with the characterization of the cell library, continues through implementation, analysis and optimization, and ends with sign-off verification.
2008-12-25 Studies address process variability issues
CMOS device process variability remains one of the most acute problems facing the semiconductor world, particularly at the 45nm node and beyond, according to presenters at the International Electron Devices Meeting (IEDM).
2014-03-25 Strain tunes surface electron states of TIs
Surface electrons behave like massless Dirac particles in a similar way to electrons in graphene, which make TIs a prime platform for the realisation of solid state quantum computing devices.
2008-04-16 Step-up converters drive six rows of up to 10 WLEDs
STMicroelectronics has introduced three monolithic step-up converters for LED backlights and lighting, providing 30mA or 85mA current sources for six rows of up to 10 white LEDs.
2002-12-26 Startup taps digital holography for wafer inspection
A metrology startup is pitching the use of digital holography to peer into the narrow and deep spaces, such as contacts and trench capacitors, on semiconductor wafers.
2004-06-01 Startup takes a novel design-for-yield approach
Anchor Semiconductor says it offers the market's first silicon design-rule-checking tool.
2004-04-14 Startup takes a novel design-for-yield approach
Anchor Semiconductor has begun shipments of NanoScope, a tool that provides full-chip, post-resolution-enhancement technology verification.
2015-04-15 SRC to standardise 3D chip testing
Duke University lays down the plan to designing-for-test the TSVs, so that large inexpensive probes can touch many TSV microbumps simultaneously to take measurements that ensure defect-free stacked die.
2014-12-19 SRAMs in nextgen IoT and wearable embedded designs
In this article, we will discuss the technology advances that necessitate SRAMs and also the evolving trends in SRAM technology that make it ready to service the needs of the future.
2014-09-17 Squeezing in Moore: Steppers for 10nm, EUV for 7nm
Considering the slow progress of EUV systems, manufacturers may have to make do with immersion steppers to fabricate 10nm chips, but once ready, EUV can be used for 7nm chip production.
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