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2003-08-08 DEK, Gore introduce EMI shielding solution
DEK Printing Machines and W. L. Gore & Associates have combined their technologies to deliver a lightweight removable EMI board-level shield for wireless comms devices.
2003-01-13 DEK transfer heads reduce costs, waste materials
The company has introduced the first of a new series of low volume ProFlow transfer heads that are claimed to reduce costs and waste materials.
2002-02-07 DEK stencil clamping system allows <60s chageover
The company's stencil clamping system enables changeovers to be completed in <60s and is adjustable in x and y planes from 304.8-by-304.8mm to 736.6-by-736.6mm.
2003-03-10 DEK screen printer features automatic vision alignment
DEK Printing Machines Ltd has introduced its Viking-class Horizon 05 screen printer that has automatic vision alignment and networking capabilities.
2002-01-22 DEK printer inspection system reduces cycle time by 50 percent
Version 6 of the company's 2Di printing machine inspection system features an improved LED lighting system and an enhanced camera movement path, reducing cycle time by 50 percent
2002-02-01 DEK imaging system features upgrades
The ProFlow DirEKt imaging system features upgraded integrated thermal control (ITC) and software-controlled air regulator (SCAR), further improving the efficiency of the surface-mount pre-placement process.
2002-04-19 DEK camera has 10-by-7.5mm inspection window
The Gold Camera inspection system from DEK Printing Machines Ltd offers an 11.5-by-8.5mm and an inspection window of 10-by-7.5mmnearly three times larger than inspection window of the company's existing Green Camera system.
2002-05-17 Adept, DEK to codevelop automated wafer-handling solution
Adept Technology Inc. has formalized its partnership with DEK to develop a fully automated wafer handling solution for DEK's screen printer wafer bumping and ball placement system
2003-02-10 DEK underscreen cleaner shortens cleaning times
DEK's Vortex Plus underscreen cleaning system enhances cleaning efficiency through the use of a 2D cleaning action that performs wet and dry cleaning
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