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2006-09-06 MicroStencil signs up DEK as sole distributor in Asia, Americas
DEK has been named as the sole distributor for the MicroStencil product range in Asia and the Americas. Under the terms of the agreement, DEK's new Platinum offering will incorporate the entire MicroStencil product portfolio to deliver "pioneering" stencil technology for ultra fine pitch printing to customers in these regions.
2003-08-08 DEK, Gore introduce EMI shielding solution
DEK Printing Machines and W. L. Gore & Associates have combined their technologies to deliver a lightweight removable EMI board-level shield for wireless comms devices.
2003-02-10 DEK underscreen cleaner shortens cleaning times
DEK's Vortex Plus underscreen cleaning system enhances cleaning efficiency through the use of a 2D cleaning action that performs wet and dry cleaning.
2003-01-13 DEK transfer heads reduce costs, waste materials
The company has introduced the first of a new series of low volume ProFlow transfer heads that are claimed to reduce costs and waste materials.
2002-02-07 DEK stencil clamping system allows <60s chageover
The company's stencil clamping system enables changeovers to be completed in <60s and is adjustable in x and y planes from 304.8-by-304.8mm to 736.6-by-736.6mm.
2003-03-10 DEK screen printer features automatic vision alignment
DEK Printing Machines Ltd has introduced its Viking-class Horizon 05 screen printer that has automatic vision alignment and networking capabilities.
2003-01-08 DEK rolls bumping solution for 300mm wafers
DEK has announced the availability of a wafer bumping solution for 300mm wafers.
2002-01-23 DEK printing machine features extended print area
Designed for rapid-response EMS providers, the Vista printer features an extended print area for large panels or special applications.
2002-01-22 DEK printer inspection system reduces cycle time by 50 percent
Version 6 of the company's 2Di printing machine inspection system features an improved LED lighting system and an enhanced camera movement path, reducing cycle time by 50 percent.
2006-04-12 DEK opens regional parts center in Shenzhen
DEK, a supplier of process and equipment for high accuracy mass imaging of electronics materials, has established a new regional parts center in Shenzhen, China.
2002-05-16 DEK opens distribution center in Singapore
DEK, a provider of manufacturing solutions for electronics circuit board assembly and semiconductor industries, has opened a distribution center in Singapore.
2002-05-07 DEK launches new user initiative
DEK has recently held its first of a series of special European "User Groups" at the company's Weymouth facility in England.
2002-02-01 DEK imaging system features upgrades
The ProFlow DirEKt imaging system features upgraded integrated thermal control (ITC) and software-controlled air regulator (SCAR), further improving the efficiency of the surface-mount pre-placement process.
2006-06-05 DEK concludes research on lead-free pastes
DEK said it concluded research into screen printing for 0201 surface-mount technology components using SnPb and SAC solder pastes.
2002-04-19 DEK camera has 10-by-7.5mm inspection window
The Gold Camera inspection system from DEK Printing Machines Ltd offers an 11.5-by-8.5mm and an inspection window of 10-by-7.5mmnearly three times larger than inspection window of the company's existing Green Camera system.
2003-01-17 DEK adopts Adept wafer handling solution
Adept Technology Inc. has announced that it has delivered its Adept WLM wafer handling solution to DEK, a Dover Technologies Co.
2002-05-17 Adept, DEK to codevelop automated wafer-handling solution
Adept Technology Inc. has formalized its partnership with DEK to develop a fully automated wafer handling solution for DEK's screen printer wafer bumping and ball placement system.
2006-08-18 Solution enables high-speed 25m backside wafer coating
DEK announced it has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25m in thickness.
2006-04-05 Process for depositing silver epoxy delivers higher throughput
DEK announced that it has successfully developed processes for depositing silver epoxy and B-stage adhesives for die attach apps, delivering higher throughput and repeatability.
2006-08-21 CAD platform cuts processing time, eliminates errors
DEK said its new refined CAD system reduces processing time and eliminates design mistakes for higher quality tooling at a guaranteed faster turnaround.
2010-11-09 New wipe turns stencil "fluxophobic"
DEK's Nano-Pro Tek stencil surface wipe separates flux from apertures
2011-12-19 Stencils boast space savings up to 75%
Photo Stencil's VectorGuard frameless stencil tensioning system features ease-of-use, and repeatable and accurate foil tension.
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said.
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