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2014-02-28 Moisture sensitivity levels for plastic-encapsulated ICs
Learn about the use of acoustic microscopy to find internal defects during the assigning of the sensitivity levels.
2012-10-29 Imaging BGA package at multiple depths
Understand how to come up with a slide show of acoustically visible features at increasing depths.
2000-10-01 Effects of NEMI reflow on PTHs
This paper evaluates the changes in plated through-hole (PTH) performance and laminate material properties for several epoxy-based laminate systems caused by the thermal reflow requirements of the NEMI higher temperature alloy.
2005-03-16 Acoustic micro imaging of internal interfaces in a stacked die package
A benefit of acoustic microscopy is that nondestructive images can be made of specific desired depths within the device
2010-12-02   Xradia demos semicon failure analysis solutions at Semicon Japan
Xradia Inc.'s 3D X-ray solutions make it possible to visualize buried problems without destroying the package, or inducing artifacts that have nothing to do with the actual condition of the package.
2006-07-06 X-ray analyzer eases advanced chip packaging
Xradia said the MicroXCT is suited for the engineering and failure analysis of next-generation semiconductor packages, including multistacked die and flip-chip architectures.
2009-06-02 Wave solder exposure of SMT packages
Attaching surface mount components to the bottom side of a PCB by wave solder processing is common practice. Because surface mount components are normally soldered using a reflow oven process, the impact of wave soldering and wave solder simulation methods must be understood.
2011-04-27 Study improves stretchable interconnect reliability
IMEC has studied the deformation behavior and failure mechanisms of horseshoe-patterned interconnects, resulting to an improved reliability of the stretchable interconnects.
2009-06-18 Stickers offer way to stretchable electronics
A collaborative study by Massachusetts Institute of Technology (MIT) researchers and others suggests that ultra-thin, flexible but strong materials such as graphene are ideal candidates for stretchable electronic applications.
2011-12-30 Rapid acoustic inspection for 300MM wafer generation (Part 1)
As wafers become larger and individual die become smaller, acoustic micro imaging is developing the non-destructive tools that can remove defective die to boost reliability and yield.
2014-06-10 Protect system operation in corrosive environments
With the increasing adoption of electronics in developing countries, where atmospheric pollution levels are generally higher, there is a growing need for corrosion protection.
2014-05-13 Power tester detects thermally-induced failures in real time
The industrial power tester from Mentor Graphics can power modules through tens of thousandspotentially millionsof cycles while providing "real-time" failure-in-progress data for diagnostics.
2010-12-01 Optical inspection system targets 2mµ wafer defects
Altatech Semiconductor S.A. launches high-throughput AltaSight EyeEdge inspection system
2008-01-15 MEMS measurement tech could increase wafer yields
NIST claims that CMOS semiconductor makers could take advantage of its MEMS measurement regime to increase wafer yields by reducing the frequency of failures.
2002-03-06 LSI Logic tries startup's wafer polishing approach
LSI Logic Corp. is exploring a new method of polishing copper and low-k interconnects by working with ACM Research Inc., which has developed a form of non-contact polishing aimed at replacing conventional chemical-mechanical polishing (CMP).
2002-10-24 LSI Logic extends reach of wirebond packaging
LSI Logic Corp. has developed a form of wirebond packaging that places bonding pads directly on top of a chip's active I/O circuitry.
2010-09-06 Inspection tool monitors edge profiles
The metrology and inspection tool can help fabs identify potentially yield-impacting irregularities in the shape of the wafer edge profile or in the edges of films deposited on the wafer.
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level.
2008-06-30 Guidelines on leadforming, trimming lead length, and heatsink mounting
The demand for smaller consumer products often results in semiconductor designers manipulating package configurations to fit intended designs, often requiring custom leadforming and module assembly.This application note introduces general guidelines to ensure basic protection to the integrity of the package, both mechanically and electrically.
2014-01-02 Grow graphene for electronics the bio-inspired way
Researchers from Singapore came up with a one-step method to grow and transfer high-quality graphene on silicon that enables graphene to be applied in various photonics and electronics devices.
2006-07-17 Green engineering challenges reliability, logistics
Chip makers began transitioning to Pb-free finishes and "green" packaging years ago, prompted largely by the European Union's clampdown on six substancesincluding leadin electronics equipment. Eliminating lead has significantly affected the electronics industry.
2011-12-02 Foil resistors feature 10? to 125k? resistance
Vishay's foil chip VSMF series resistors offer low TCR of 2ppm/C (typ.) from -55C to 125C.
2003-04-04 feinfocus x-ray displays 2D, 3D imagery
feinfocus has released the ?CT-F.O.X. x-ray inspection system, which is claimed to be the first to include 2D and 3D modalities in one device.
2005-06-08 Experts mull interconnect beyond 65nm
A panel at the International Interconnect Technology Conference here examined the vexing question of the IC interconnect stack at 45nm and beyond
2011-04-19 Double-zone acoustic scanning of plastic-encapsulated ICs
Learn about the double-zone scanning system and how it can increase throughput.
2006-08-23 Designing and shipping after RoHS
RoHS compliance must become an integral part of a designer's development process, with RoHS checks conducted at each step: concept, development, prototype, first builds and volume production.
2007-10-03 Carbon nanotubes find, fix aircraft wing defects
Carbon nanotubes can find and fix defects in aircraft wings and other polymer composites.
2009-02-23 BiCMOS options lock in on optoelectronics
X-Fab discloses five new options for its 0.6?m BiCMOS technology platform, two of which deliver first-of-a-kind capabilities for the emerging and rapidly expanding optoelectronics market.
2005-07-13 Aviza, SEZ link to clean-up atomic layer deposition
ip equipment vendor Aviza Technology Inc. is joining forces with wafer cleaning company SEZ Group to work on atomic layer deposition (ALD) film removal for next-generation IC manufacturing.
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