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2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2004-08-02 Transcoding key to sharing multimedia
Transcoding of multimedia content is helping remove barriers between different encoding/decoding platforms and within wired and wireless networks.
2003-07-22 TransChip rolls out a single-chip CMOS imager
TransChip is targeting mobile handset vendors seeking to upgrade cellphones to popular camera phones with a single-chip CMOS image sensor that integrates image processing and compression along with LCD controller functions.
2007-02-14 Transceiver eases EDGE handset designs
RF Micro Devices Inc. will sample in April a highly integrated RF transceiver that it is marketing under the brand Polaris 3 Total Radio.
2010-02-04 TowerJazz, Soitec join hands on backside illumination
TowerJazz and Soitec Group will develop turn-key solution for high-end backside-illuminated CMOS image sensors for industrial, medical and automotive applications.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2005-03-03 Timing analysis needs overhaul, speaker says
New IC devices, circuits, and physical effects will drive a new generation of timing analysis tools, said David Hathaway, senior technical staff member for EDA at IBM Microelectronics, at a keynote speech at the Tau timing workshop here Monday (Feb. 28).
2007-03-21 TI to shake up 'corporate culture' and revamp fab strategies
Amid stinging losses of its baseband chip monopolies at Docomo, Ericsson and Nokia, Texas Instruments is moving with a new sense of urgency to shake up its corporate culture and revamp its fab and product strategies.
2013-08-28 TI rolls power chips with MIPI RFFE, maximise battery life
Integrating the MIPI Alliance's radio frequency front-end digital control interface, TI's latest RF power converters significantly reduce the heat and power consumption in RF power amplifiers.
2009-01-29 TI braces for prolonged recession
TI's Rich Templeton said the reorganization actions should not be seen as a temporary fix but as a new cost structure intended to preserve TI's health in the midst of an economic decline.
2012-01-02 The lowdown on power line communication
Here's a discussion on power line communication and its segments, applications, and challenges.
2013-10-04 The Internet of Things and its need for the human touch
For the IoT to take off at the scale touted by enthusiastic visionaries, it must apply the same talents used into the transformation of technological dreams into reality to the human side of the IoT.
2015-05-07 The clash of IoT IP policies: Intel vs Qualcomm
How do the IP policies of Qualcomm-led AllSeen Alliance compare to Intel-led Open Interconnect Consortium (OIC), and how does the legality surrounding "free software" and "open source" affect you?
2015-04-27 Testing limits: Sensor detects electron charge in nanoseconds
Researchers at the University of Cambridge created an electronic device that they say can detect the charge of a single electron in less than one microsecond.
2006-11-03 Test challenges could trump future chip designs
Coming silicon process generations will bring not only immense increases in device density, but also the challenges of working with process and device variations that in many ways are worse than for the processes of 20 years ago.
2005-01-31 Teradyne launches new connector platform for tight spaces
Teradyne Connection Systems Division launched its new Aptera connector platform that offers a low-profile solution for server, storage and networking apps.
2013-10-01 Teardown: Galaxy Note 3 still king of phablets
TechInsights deems the Galaxy Note 3 as still the leading phablet in the market based on chips utilised in the device.
2011-08-08 Talkwalkar's profile fits AMD's next CEO
AMD's CEO should be a person who knows the dynamics of the Intel market and has lots of experiences, a profile that fits Talkwalkar 's experience and character.
2005-01-18 Taking a walk inside Bluetooth EDR
There's no doubt that Bluetooth technology has started to gain hold in the communication sector.
2008-01-02 Taiwan jumps on the 4C bandwagon
Cars of the future will have leading-edge electronic technologies integrated into them that will improve driving comfort and entertainment, opening the door to the so-called "4C" industry and giving new hope for Taiwan's electronic industry.
2016-04-28 Tackling IoT and Industry 4.0 sensor backplane needs
Read about the configurable analogue architecture that supports the bimodality requirements of the sensor backplane for both IoT and Industry 4.0 applications.
2006-08-16 T.J. Rodgers on politics and nano
EE Times caught up with Cypress Semiconductor founder and CEO T.J. Rodgers at the Embedded Systems Conference.
2004-02-19 Synopsys, ARM to write SystemVerilog manual
Seeking to write the book on how to use SystemVerilog for verification, Synopsys Inc. and ARM Ltd. are working together on a SystemVerilog Verification Methodology Manual and hope to have it ready by June.
2009-02-19 Survey: Consumers want power-efficient apps
Energy efficiency has become so important to electronics manufacturers and consumers alike that an industry survey and roadmap found that consumers are now willing to pay a premium for electronic products that deliver energy efficiency.
2005-11-22 Supercapacitors offer extended temperature range
AVX extended the temperature range of its BestCap series of electrochemical supercapacitors to operate over the range of -40C to 70C.
2006-08-03 Summit on multicore SoCs scheduled on ESC-Taiwan
The Multicore SoC Summit at ESC-Taiwan will discuss the challenges in designing multicore SoCs and will highlight technological trends that are expected to make the engineer's work easier.
2008-12-25 Studies address process variability issues
CMOS device process variability remains one of the most acute problems facing the semiconductor world, particularly at the 45nm node and beyond, according to presenters at the International Electron Devices Meeting (IEDM).
2005-11-02 Structured ASIC demand rising, says study
Innovation in the IC industry combined with increasing demand for high-performance electronic systems is driving demand for structured ASICs, according to a study by Frost and Sullivan.
2002-09-01 Startups with new ideas
In spite of industry consolidation and slowing growth rates, EDA startups are bringing new ideas and technology to chip designers.
2003-11-11 Startup eyes RF chips at China's booming handset market
A small startup based in China developing RF chips is looking to capture 50 percent of the country's fast-growing market for PHS handsets.
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